[{"data":1,"prerenderedAt":378},["ShallowReactive",2],{"blog-fr4-material-properties-ar":3,"header-nav-ar":47},{"title":4,"description":5,"date":6,"lastUpdated":6,"category":7,"image":8,"readingTime":9,"wordCount":10,"timeRequired":11,"htmlContent":12,"tags":13,"slug":21,"jsonld":22},"خصائص مادة FR4: وثيقة بيانات Dk و Tg والكثافة و CTE","ما هي مادة FR-4 وخصائصها الرئيسية: ثابت العزل الكهربائي، Tg، Td، CTE، الكثافة والتوصيل الحراري، ومتى تختار High-Tg FR-4.","2026-10-09","materials","/assets/img/pcb/fr4/pcb-fr4-pcb-hero.webp",4,636,"PT4M","\u003Ch2 id=\"key-takeaways\" data-anchor-en=\"key-takeaways\">النقاط الرئيسية\u003C/h2>\n\u003Cul>\n\u003Cli>\u003Cstrong>معنى FR-4:\u003C/strong> تشير 'FR' إلى \u003Cstrong>Flame Retardant\u003C/strong> (مقاوم للاشتعال)، و '4' تعبر عن راتنج الإيبوكسي المقوى بألياف الزجاج المنسوجة وفق معايير NEMA LI 1-1998 و UL94 V-0.\u003C/li>\n\u003Cli>\u003Cstrong>ثابت العزل لمادة FR4 (Dk):\u003C/strong> يتراوح عادة بين \u003Cstrong>4.2 و 4.7 عند 1 جيجاهرتز\u003C/strong>، وينخفض مع زيادة تردد الإشارة وفقاً لنسبة الزجاج إلى الراتنج.\u003C/li>\n\u003Cli>\u003Cstrong>العتبات الحرارية (Tg, Td):\u003C/strong> تتميز FR-4 القياسية بدرجة انتقال زجاجي ($T_g$) تبلغ $130\\text{--}140^\\circ\\text{C}$، ومتوسطة $T_g$ عند $150^\\circ\\text{C}$، وعالية $T_g$ تصل إلى $170\\text{--}180^\\circ\\text{C}$ للتجميع الخالي من الرصاص ($260^\\circ\\text{C}$).\u003C/li>\n\u003Cli>\u003Cstrong>معامل التمدد الحراري (CTE):\u003C/strong> في المحور Z، تتمدد مادة FR-4 القياسية بمعدل $50\\text{--}70\\text{ ppm/}^\\circ\\text{C}$ تحت $T_g$ وتقفز إلى $250\\text{--}300\\text{ ppm/}^\\circ\\text{C}$ فوق $T_g$.\u003C/li>\n\u003Cli>\u003Cstrong>المعايير الميكانيكية والفيزيائية:\u003C/strong> الكثافة القياسية \u003Cstrong>$1.85\\text{ g/cm}^3$\u003C/strong>، ومعامل يونغ \u003Cstrong>22--24 GPa\u003C/strong>، والتوصيل الحراري \u003Cstrong>$0.25\\text{--}0.35\\text{ W/m}\\cdot\\text{K}$\u003C/strong>.\u003C/li>\n\u003C/ul>\n\u003Cdiv data-component=\"BlogQuickQuoteInline\">\u003C/div>\n\n\u003Ch2 id=\"fr-4\" data-anchor-en=\"what-is-fr-4-composition-and-grades\">ما هي مادة FR-4؟ التركيب والدرجات\u003C/h2>\n\u003Cp>يعرّف مصطلح \u003Cstrong>مادة FR4 للدوائر المطبوعة\u003C/strong> هيكلاً مركباً يجمع بين:\u003C/p>\n\u003Col>\n\u003Cli>\u003Cstrong>قماش ألياف الزجاج المنسوج:\u003C/strong> خيوط زجاج E منسوجة بأنماط قياسية (106، 1080، 2116، 7628) لمنح الصلابة الميكانيكية والاستقرار البعدي.\u003C/li>\n\u003Cli>\u003Cstrong>مصفوفة راتنج الإيبوكسي:\u003C/strong> بوليمر حراري معالج بمواد مثبطة للهب لعزل الموصلات الكهربائية وتثبيت رقائق النحاس.\u003C/li>\n\u003C/ol>\n\u003Ch2 id=\"fr4\" data-anchor-en=\"common-fr-4-grades-in-industry\">بيانات خصائص مادة FR4 الفنية\u003C/h2>\n\u003Ctable>\n\u003Cthead>\n\u003Ctr>\n\u003Cth>الخاصية\u003C/th>\n\u003Cth>طريقة الفحص (IPC-TM-650)\u003C/th>\n\u003Cth>FR-4 قياسي (Mid-Tg)\u003C/th>\n\u003Cth>FR-4 عالي Tg\u003C/th>\n\u003Cth>الوحدة النموذجية\u003C/th>\n\u003C/tr>\n\u003C/thead>\n\u003Ctbody>\u003Ctr>\n\u003Ctd>Glass Transition Temp ($T_g$)\u003C/td>\n\u003Ctd>2.4.24 (DSC)\u003C/td>\n\u003Ctd>135 - 150 °C\u003C/td>\n\u003Ctd>170 - 180 °C\u003C/td>\n\u003Ctd>°C\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Decomposition Temp ($T_d$)\u003C/td>\n\u003Ctd>2.4.24.6 (TGA 5% loss)\u003C/td>\n\u003Ctd>310 - 325 °C\u003C/td>\n\u003Ctd>340 - 355 °C\u003C/td>\n\u003Ctd>°C\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Time to Delamination (T260)\u003C/td>\n\u003Ctd>2.4.24.1 (TMA)\u003C/td>\n\u003Ctd>5 - 15 min\u003C/td>\n\u003Ctd>30 - 60+ min\u003C/td>\n\u003Ctd>min\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Time to Delamination (T288)\u003C/td>\n\u003Ctd>2.4.24.1 (TMA)\u003C/td>\n\u003Ctd>0 - 2 min\u003C/td>\n\u003Ctd>10 - 30 min\u003C/td>\n\u003Ctd>min\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Z-Axis CTE (Below $T_g$)\u003C/td>\n\u003Ctd>2.4.24 (TMA)\u003C/td>\n\u003Ctd>50 - 70\u003C/td>\n\u003Ctd>40 - 50\u003C/td>\n\u003Ctd>ppm/°C\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Z-Axis CTE (Above $T_g$)\u003C/td>\n\u003Ctd>2.4.24 (TMA)\u003C/td>\n\u003Ctd>250 - 300\u003C/td>\n\u003Ctd>220 - 260\u003C/td>\n\u003Ctd>ppm/°C\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Z-Axis Expansion (50-260°C)\u003C/td>\n\u003Ctd>2.4.24 (TMA)\u003C/td>\n\u003Ctd>4.0 - 5.5%\u003C/td>\n\u003Ctd>2.3 - 3.2%\u003C/td>\n\u003Ctd>%\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Dielectric Constant ($D_k$, 1 GHz)\u003C/td>\n\u003Ctd>2.5.5.9\u003C/td>\n\u003Ctd>4.3 - 4.6\u003C/td>\n\u003Ctd>4.2 - 4.5\u003C/td>\n\u003Ctd>-\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Loss Tangent ($D_f$, 1 GHz)\u003C/td>\n\u003Ctd>2.5.5.9\u003C/td>\n\u003Ctd>0.016 - 0.022\u003C/td>\n\u003Ctd>0.012 - 0.018\u003C/td>\n\u003Ctd>-\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Volume Resistivity\u003C/td>\n\u003Ctd>2.5.17\u003C/td>\n\u003Ctd>10^8 - 10^9\u003C/td>\n\u003Ctd>10^8 - 10^9\u003C/td>\n\u003Ctd>MΩ·cm\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Surface Resistivity\u003C/td>\n\u003Ctd>2.5.17\u003C/td>\n\u003Ctd>10^7 - 10^8\u003C/td>\n\u003Ctd>10^7 - 10^8\u003C/td>\n\u003Ctd>MΩ\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Dielectric Breakdown\u003C/td>\n\u003Ctd>2.5.6\u003C/td>\n\u003Ctd>> 40\u003C/td>\n\u003Ctd>> 45\u003C/td>\n\u003Ctd>kV\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Flexural Strength (Lengthwise)\u003C/td>\n\u003Ctd>2.4.4\u003C/td>\n\u003Ctd>> 450\u003C/td>\n\u003Ctd>> 500\u003C/td>\n\u003Ctd>MPa\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Peel Strength (1 oz copper)\u003C/td>\n\u003Ctd>2.4.8\u003C/td>\n\u003Ctd>1.4 - 1.8 (8 - 10)\u003C/td>\n\u003Ctd>1.4 - 1.8 (8 - 10)\u003C/td>\n\u003Ctd>N/mm (lb/in)\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Moisture Absorption\u003C/td>\n\u003Ctd>2.6.2.1\u003C/td>\n\u003Ctd>0.15 - 0.25\u003C/td>\n\u003Ctd>0.10 - 0.18\u003C/td>\n\u003Ctd>%\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Thermal Conductivity\u003C/td>\n\u003Ctd>ASTM E1461\u003C/td>\n\u003Ctd>0.25 - 0.35\u003C/td>\n\u003Ctd>0.30 - 0.40\u003C/td>\n\u003Ctd>W/m·K\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Flammability Rating\u003C/td>\n\u003Ctd>UL 94\u003C/td>\n\u003Ctd>V-0\u003C/td>\n\u003Ctd>V-0\u003C/td>\n\u003Ctd>Class\u003C/td>\n\u003C/tr>\n\u003C/tbody>\u003C/table>\n\u003Ch2 id=\"fr-4-2\" data-anchor-en=\"fr4-material-properties-datasheet-at-a-glance\">الأسئلة الشائعة حول مادة FR-4\u003C/h2>\n\u003Ch3 id=\"fr4-2\" data-anchor-en=\"electrical-performance-fr4-dielectric-constant-and-loss\">ما هي كثافة مادة FR4؟\u003C/h3>\n\u003Cp>تبلغ كثافة مادة FR-4 المعالجة عادة \u003Cstrong>1.85 جم/سم³\u003C/strong>.\u003C/p>\n\u003Ch3 id=\"fr-4-1\" data-anchor-en=\"1-dk-variations-by-glass-style\">ما هو ثابت العزل الكهربائي لـ FR-4 عند 1 جيجاهرتز؟\u003C/h3>\n\u003Cp>عند 1 جيجاهرتز، يتراوح ثابت العزل النسبي ($Dk$) بين \u003Cstrong>4.2 و 4.5\u003C/strong>.\u003C/p>\n\u003Ch3 id=\"high-tg-fr-4\" data-anchor-en=\"2-high-frequency-attenuation\">متى يجب اختيار High-Tg FR-4 بدلاً من القياسي؟\u003C/h3>\n\u003Cp>تعتبر High-Tg FR-4 ($T_g \\ge 170^\\circ\\text{C}$) ضرورية لعمليات اللحام الخالي من الرصاص RoHS، واللوحات متعددة الطبقات التي تزيد عن 6 طبقات.\u003C/p>\n\u003Ch2 id=\"thermal-properties-tg-td-and-cte\" data-anchor-en=\"thermal-properties-tg-td-and-cte\">موارد وأدلة تقنية ذات صلة\u003C/h2>\n\u003Cul>\n\u003Cli>\u003Ca href=\"/ar/blog/glass-transition-temperature-tg\">/blog/glass-transition-temperature-tg\u003C/a> - Deep dive into Tg thermal reliability thresholds\u003C/li>\n\u003Cli>\u003Ca href=\"/ar/blog/what-is-dielectric-constant\">/blog/what-is-dielectric-constant\u003C/a> - Dielectric constant fundamentals and impedance control\u003C/li>\n\u003Cli>\u003Ca href=\"/ar/materials\">/materials\u003C/a> - Complete substrate material catalog and high-frequency laminates\u003C/li>\n\u003Cli>\u003Ca href=\"/ar/pcb\">/pcb\u003C/a> - Full multilayer rigid PCB fabrication specifications and tolerances\u003C/li>\n\u003C/ul>\n\n\u003Csection class=\"related-links\" aria-label=\"Related\">\u003Ch3>Related links\u003C/h3>\u003Cul>\u003Cli>\u003Ca href=\"/ar/blog/glass-transition-temperature-tg\">/blog/glass-transition-temperature-tg\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/ar/blog/what-is-dielectric-constant\">/blog/what-is-dielectric-constant\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/ar/materials\">/materials\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/ar/pcb\">/pcb\u003C/a>\u003C/li>\u003C/ul>\u003C/section>",[14,15,16,17,18,19,20],"FR4 Material","FR4 Properties","PCB Substrate","FR4 Dielectric Constant","FR4 Tg","Thermal Conductivity","PCB Stackup","fr4-material-properties",{"blog":23,"breadcrumb":32,"faq":46},{"@context":24,"@type":25,"headline":4,"description":5,"image":8,"url":26,"datePublished":6,"dateModified":6,"timeRequired":11,"keywords":27,"articleSection":7,"author":28,"publisher":31},"https://schema.org","BlogPosting","https://aptpcb.com/ar/blog/fr4-material-properties","FR4 Material, FR4 Properties, PCB Substrate, FR4 Dielectric Constant, FR4 Tg, Thermal Conductivity, PCB Stackup",{"@type":29,"name":30},"Organization","APTPCB",{"@type":29,"name":30},{"@context":24,"@type":33,"itemListElement":34},"BreadcrumbList",[35,40,44],{"@type":36,"position":37,"name":38,"item":39},"ListItem",1,"Home","https://aptpcb.com/",{"@type":36,"position":41,"name":42,"item":43},2,"Blog","https://aptpcb.com/ar/blog",{"@type":36,"position":45,"name":21,"item":26},3,null,{"pcbManufacturingColumns":48,"capabilityColumns":172,"resourceColumns":208,"pcbaColumns":253},[49,97,126,155],{"heading":50,"links":51},"فئات منتجات PCB",[52,55,58,61,64,67,70,73,76,79,82,85,88,91,94],{"label":53,"path":54},"PCB ‏FR-4","/pcb/fr4-pcb",{"label":56,"path":57},"PCB عالي السرعة","/pcb/high-speed-pcb",{"label":59,"path":60},"PCB متعدد الطبقات","/pcb/multilayer-pcb",{"label":62,"path":63},"PCB ‏HDI","/pcb/hdi-pcb",{"label":65,"path":66},"PCB مرن","/pcb/flex-pcb",{"label":68,"path":69},"PCB صلب-مرن","/pcb/rigid-flex-pcb",{"label":71,"path":72},"PCB خزفي","/pcb/ceramic-pcb",{"label":74,"path":75},"PCB نحاس ثقيل","/pcb/heavy-copper-pcb",{"label":77,"path":78},"PCB عالي التبديد الحراري","/pcb/high-thermal-pcb",{"label":80,"path":81},"PCB للهوائيات","/pcb/antenna-pcb",{"label":83,"path":84},"PCB عالي التردد","/pcb/high-frequency-pcb",{"label":86,"path":87},"PCB للميكروويف","/pcb/microwave-pcb",{"label":89,"path":90},"PCB ذو قلب معدني","/pcb/metal-core-pcb",{"label":92,"path":93},"PCB عالي Tg","/pcb/high-tg-pcb",{"label":95,"path":96},"PCB Backplane","/pcb/backplane-pcb",{"sections":98},[99],{"heading":100,"links":101},"RF والمواد",[102,105,108,111,114,117,120,123],{"label":103,"path":104},"PCB ‏Rogers","/materials/rf-rogers",{"label":106,"path":107},"PCB ‏Taconic","/materials/taconic-pcb",{"label":109,"path":110},"PCB تفلون","/materials/teflon-pcb",{"label":112,"path":113},"PCB ‏Arlon","/materials/arlon-pcb",{"label":115,"path":116},"PCB ‏Megtron","/materials/megtron-pcb",{"label":118,"path":119},"PCB ‏ISOLA","/materials/isola-pcb",{"label":121,"path":122},"Spread Glass FR-4","/materials/spread-glass-fr4",{"label":124,"path":125},"تراصات ذات معاوقة مضبوطة","/pcb/pcb-stack-up",{"sections":127},[128],{"heading":129,"links":130},"التصنيع / تراصات الطبقات",[131,134,137,140,143,146,149,152],{"label":132,"path":133},"نماذج أولية سريعة","/pcb/quick-turn-pcb",{"label":135,"path":136},"NPI ودفعات صغيرة (PCB)","/pcb/npi-small-batch-pcb-manufacturing",{"label":138,"path":139},"إنتاج كميات كبيرة","/pcb/mass-production-pcb-manufacturing",{"label":141,"path":142},"PCB عالي عدد الطبقات","/pcb/high-layer-count-pcb",{"label":144,"path":145},"عملية تصنيع PCB","/pcb/pcb-fabrication-process",{"label":147,"path":148},"تصنيع PCB متقدم","/pcb/advanced-pcb-manufacturing",{"label":150,"path":151},"تصنيع PCB خاص","/pcb/special-pcb-manufacturing",{"label":153,"path":154},"البنية المُصفّحة متعددة الطبقات","/pcb/multilayer-pcb-lamination-services",{"heading":156,"links":157},"تخصصات وموارد",[158,161,164,166,169],{"label":159,"path":160},"تشطيبات سطح PCB (ENIG / ENEPIG / HASL / OSP / Immersion)","/pcb/pcb-surface-finishes",{"label":162,"path":163},"الثقب والممرات (Blind / Buried / Via-in-Pad / Backdrill / Half Hole)","/pcb/pcb-drilling",{"label":165,"path":125},"تراص PCB (Standard / High-Layer / Flex / Rigid-Flex / Aluminum)",{"label":167,"path":168},"التشكيل (Milling / V-Scoring / Depaneling)","/pcb/pcb-profiling",{"label":170,"path":171},"الجودة والفحص (AOI + X-Ray / Flying Probe / DFM)","/pcb/pcb-quality",[173,178,183,188,193,198,203],{"links":174},[175],{"label":176,"path":177},"قدرات PCB الصلب","/capabilities/rigid-pcb",{"links":179},[180],{"label":181,"path":182},"قدرات PCB الصلب-المرن","/capabilities/rigid-flex-pcb",{"links":184},[185],{"label":186,"path":187},"قدرات PCB المرن","/capabilities/flex-pcb",{"links":189},[190],{"label":191,"path":192},"قدرات PCB ‏HDI","/capabilities/hdi-pcb",{"links":194},[195],{"label":196,"path":197},"قدرات PCB ذو قلب معدني","/capabilities/metal-pcb",{"links":199},[200],{"label":201,"path":202},"قدرات PCB الخزفي","/capabilities/ceramic-pcb",{"links":204},[205],{"label":206,"path":207},"قدرات PCB النحاس الثقيل","/capabilities/heavy-copper-pcb",[209,220,244],{"heading":210,"links":211},"التنزيلات",[212,215,218],{"label":213,"path":214},"مواصفات المواد / ملاحظات المعالجة","/resources/downloads-materials",{"label":216,"path":217},"إرشادات DFM للـ PCB","/resources/dfm-guidelines",{"label":153,"path":219},"/pcb/multi-layer-laminated-structure",{"heading":221,"links":222},"الأدوات",[223,226,229,232,235,238,241],{"label":224,"path":225},"عارض Gerber","/tools/gerber-viewer",{"label":227,"path":228},"عارض PCB","/tools/pcb-viewer",{"label":230,"path":231},"عارض BOM","/tools/bom-viewer",{"label":233,"path":234},"عارض ثلاثي الأبعاد","/tools/3d-viewer",{"label":236,"path":237},"محاكاة الدوائر","/tools/circuit-simulator",{"label":239,"path":240},"حاسبة المعاوقة","/tools/impedance-calculator",{"label":242,"path":243},"حاسبة عرض المسار","/tools/trace-width-calculator",{"heading":245,"links":246},"الأسئلة الشائعة والمدونة",[247,250],{"label":248,"path":249},"الأسئلة الشائعة","/resources/faq",{"label":251,"path":252},"المدونة","/blog",[254,284,308,341],{"heading":255,"links":256},"الخدمات الأساسية",[257,260,263,266,269,272,275,278,281],{"label":258,"path":259},"تجميع PCB بنظام Turnkey","/pcba/turnkey-assembly",{"label":261,"path":262},"تجميع 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