[{"data":1,"prerenderedAt":377},["ShallowReactive",2],{"blog-fr4-material-properties-de":3,"header-nav-de":47},{"title":4,"description":5,"date":6,"lastUpdated":6,"category":7,"image":8,"readingTime":9,"wordCount":10,"timeRequired":11,"htmlContent":12,"tags":13,"slug":21,"jsonld":22},"FR4 Materialeigenschaften: Dk, Tg, Dichte, CTE Datenblatt","Was FR-4 ist und seine Schluesselwerte: Dielektrizitaetskonstante, Tg, Td, CTE, Dichte und Waermeleitfaehigkeit, plus Auswahl von High-Tg FR-4.","2026-10-09","materials","/assets/img/pcb/fr4/pcb-fr4-pcb-hero.webp",4,690,"PT4M","\u003Ch2 id=\"wichtige-erkenntnisse\" data-anchor-en=\"key-takeaways\">Wichtige Erkenntnisse\u003C/h2>\n\u003Cul>\n\u003Cli>\u003Cstrong>Bedeutung von FR-4:\u003C/strong> 'FR' steht fuer \u003Cstrong>Flame Retardant\u003C/strong> (flammhemmend), und '4' bezeichnet gewebtes glasfaserverstaerktes Epoxidharz nach NEMA LI 1-1998 und UL94 V-0 Entflammbarkeitsstandards.\u003C/li>\n\u003Cli>\u003Cstrong>FR4 Dielektrizitaetskonstante (Dk):\u003C/strong> Liegt typischerweise zwischen \u003Cstrong>4,2 und 4,7 bei 1 GHz\u003C/strong> und nimmt mit steigender Signalfrequenz ab. Dk variiert je nach Glas-Harz-Verhaeltnis (z. B. 7628 schweres Glas vs. 1080 leichtes Glas).\u003C/li>\n\u003Cli>\u003Cstrong>Thermische Grenzwerte (Tg, Td):\u003C/strong> Standard-FR-4 weist eine Glasuebergangstemperatur ($T_g$) von $130\\text{--}140^\\circ\\text{C}$ auf, Mid-$T_g$ liegt bei $150^\\circ\\text{C}$ und High-$T_g$ erreicht $170\\text{--}180^\\circ\\text{C}$. High-$T_g$-Rezepturen bieten essenzielle Sicherheitsmargen fuer bleifreies Reflow-Loeten ($260^\\circ\\text{C}$).\u003C/li>\n\u003Cli>\u003Cstrong>Waermeausdehnungskoeffizient (CTE):\u003C/strong> In der Z-Achse dehnt sich Standard-FR-4 unterhalb von $T_g$ um ca. $50\\text{--}70\\text{ ppm/}^\\circ\\text{C}$ aus und steigt oberhalb von $T_g$ auf $250\\text{--}300\\text{ ppm/}^\\circ\\text{C}$.\u003C/li>\n\u003Cli>\u003Cstrong>Mechanische Kennwerte:\u003C/strong> FR-4 besitzt eine typische Dichte von \u003Cstrong>$1,85\\text{ g/cm}^3$\u003C/strong>, einen Elastizitaetsmodul von \u003Cstrong>22--24 GPa\u003C/strong> und eine moderate Waermeleitfaehigkeit von \u003Cstrong>$0,25\\text{--}0,35\\text{ W/m}\\cdot\\text{K}$\u003C/strong>.\u003C/li>\n\u003C/ul>\n\u003Cdiv data-component=\"BlogQuickQuoteInline\">\u003C/div>\n\n\u003Ch2 id=\"was-ist-fr-4-zusammensetzung-und-gueteklassen\" data-anchor-en=\"what-is-fr-4-composition-and-grades\">Was ist FR-4? Zusammensetzung und Gueteklassen\u003C/h2>\n\u003Cp>Der Begriff \u003Cstrong>FR4 PCB Material\u003C/strong> bezeichnet ein Verbundmaterial aus zwei Hauptkomponenten:\u003C/p>\n\u003Col>\n\u003Cli>\u003Cstrong>Gewebtes Glasfasergewebe:\u003C/strong> E-Glas-Garne gewoben in standardisierte Gewebearten (wie 106, 1080, 2116, 3313 und 7628) sorgen fuer Zugfestigkeit, Biegesteifigkeit und Dimensionsstabilitaet.\u003C/li>\n\u003Cli>\u003Cstrong>Epoxidharzmatrix:\u003C/strong> Ein duroplastisches Polymer mit bromierten oder halogenfreien Flammschutzmitteln und anorganischen Keramikfuellstoffen, das Kupferfolien verklebt und Leiterbahnen isoliert.\u003C/li>\n\u003C/ol>\n\u003Ch2 id=\"fr4-materialeigenschaften-im-datenblatt\" data-anchor-en=\"common-fr-4-grades-in-industry\">FR4 Materialeigenschaften im Datenblatt\u003C/h2>\n\u003Ctable>\n\u003Cthead>\n\u003Ctr>\n\u003Cth>Eigenschaft\u003C/th>\n\u003Cth>Pruefmethode (IPC-TM-650)\u003C/th>\n\u003Cth>Standard FR-4 (Mid-Tg)\u003C/th>\n\u003Cth>High-Tg FR-4\u003C/th>\n\u003Cth>Typische Einheit\u003C/th>\n\u003C/tr>\n\u003C/thead>\n\u003Ctbody>\u003Ctr>\n\u003Ctd>Glass Transition Temp ($T_g$)\u003C/td>\n\u003Ctd>2.4.24 (DSC)\u003C/td>\n\u003Ctd>135 - 150 °C\u003C/td>\n\u003Ctd>170 - 180 °C\u003C/td>\n\u003Ctd>°C\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Decomposition Temp ($T_d$)\u003C/td>\n\u003Ctd>2.4.24.6 (TGA 5% loss)\u003C/td>\n\u003Ctd>310 - 325 °C\u003C/td>\n\u003Ctd>340 - 355 °C\u003C/td>\n\u003Ctd>°C\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Time to Delamination (T260)\u003C/td>\n\u003Ctd>2.4.24.1 (TMA)\u003C/td>\n\u003Ctd>5 - 15 min\u003C/td>\n\u003Ctd>30 - 60+ min\u003C/td>\n\u003Ctd>min\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Time to Delamination (T288)\u003C/td>\n\u003Ctd>2.4.24.1 (TMA)\u003C/td>\n\u003Ctd>0 - 2 min\u003C/td>\n\u003Ctd>10 - 30 min\u003C/td>\n\u003Ctd>min\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Z-Axis CTE (Below $T_g$)\u003C/td>\n\u003Ctd>2.4.24 (TMA)\u003C/td>\n\u003Ctd>50 - 70\u003C/td>\n\u003Ctd>40 - 50\u003C/td>\n\u003Ctd>ppm/°C\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Z-Axis CTE (Above $T_g$)\u003C/td>\n\u003Ctd>2.4.24 (TMA)\u003C/td>\n\u003Ctd>250 - 300\u003C/td>\n\u003Ctd>220 - 260\u003C/td>\n\u003Ctd>ppm/°C\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Z-Axis Expansion (50-260°C)\u003C/td>\n\u003Ctd>2.4.24 (TMA)\u003C/td>\n\u003Ctd>4.0 - 5.5%\u003C/td>\n\u003Ctd>2.3 - 3.2%\u003C/td>\n\u003Ctd>%\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Dielectric Constant ($D_k$, 1 GHz)\u003C/td>\n\u003Ctd>2.5.5.9\u003C/td>\n\u003Ctd>4.3 - 4.6\u003C/td>\n\u003Ctd>4.2 - 4.5\u003C/td>\n\u003Ctd>-\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Loss Tangent ($D_f$, 1 GHz)\u003C/td>\n\u003Ctd>2.5.5.9\u003C/td>\n\u003Ctd>0.016 - 0.022\u003C/td>\n\u003Ctd>0.012 - 0.018\u003C/td>\n\u003Ctd>-\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Volume Resistivity\u003C/td>\n\u003Ctd>2.5.17\u003C/td>\n\u003Ctd>10^8 - 10^9\u003C/td>\n\u003Ctd>10^8 - 10^9\u003C/td>\n\u003Ctd>MΩ·cm\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Surface Resistivity\u003C/td>\n\u003Ctd>2.5.17\u003C/td>\n\u003Ctd>10^7 - 10^8\u003C/td>\n\u003Ctd>10^7 - 10^8\u003C/td>\n\u003Ctd>MΩ\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Dielectric Breakdown\u003C/td>\n\u003Ctd>2.5.6\u003C/td>\n\u003Ctd>> 40\u003C/td>\n\u003Ctd>> 45\u003C/td>\n\u003Ctd>kV\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Flexural Strength (Lengthwise)\u003C/td>\n\u003Ctd>2.4.4\u003C/td>\n\u003Ctd>> 450\u003C/td>\n\u003Ctd>> 500\u003C/td>\n\u003Ctd>MPa\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Peel Strength (1 oz copper)\u003C/td>\n\u003Ctd>2.4.8\u003C/td>\n\u003Ctd>1.4 - 1.8 (8 - 10)\u003C/td>\n\u003Ctd>1.4 - 1.8 (8 - 10)\u003C/td>\n\u003Ctd>N/mm (lb/in)\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Moisture Absorption\u003C/td>\n\u003Ctd>2.6.2.1\u003C/td>\n\u003Ctd>0.15 - 0.25\u003C/td>\n\u003Ctd>0.10 - 0.18\u003C/td>\n\u003Ctd>%\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Thermal Conductivity\u003C/td>\n\u003Ctd>ASTM E1461\u003C/td>\n\u003Ctd>0.25 - 0.35\u003C/td>\n\u003Ctd>0.30 - 0.40\u003C/td>\n\u003Ctd>W/m·K\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Flammability Rating\u003C/td>\n\u003Ctd>UL 94\u003C/td>\n\u003Ctd>V-0\u003C/td>\n\u003Ctd>V-0\u003C/td>\n\u003Ctd>Class\u003C/td>\n\u003C/tr>\n\u003C/tbody>\u003C/table>\n\u003Ch2 id=\"haeufig-gestellte-fragen-zu-fr-4\" data-anchor-en=\"fr4-material-properties-datasheet-at-a-glance\">Haeufig gestellte Fragen zu FR-4\u003C/h2>\n\u003Ch3 id=\"wie-hoch-ist-die-dichte-von-fr4\" data-anchor-en=\"electrical-performance-fr4-dielectric-constant-and-loss\">Wie hoch ist die Dichte von FR4?\u003C/h3>\n\u003Cp>Die Dichte von ausgehaertetem FR-4 betraegt ueblicherweise \u003Cstrong>1,85 g/cm³\u003C/strong> (ca. 0,067 lb/in³). Sie kann je nach Verhaeltnis von Glasgewebe zu Harz leicht zwischen 1,80 und 1,90 g/cm³ schwanken.\u003C/p>\n\u003Ch3 id=\"welche-dielektrizitaetskonstante-hat-fr-4-bei-1-ghz\" data-anchor-en=\"1-dk-variations-by-glass-style\">Welche Dielektrizitaetskonstante hat FR-4 bei 1 GHz?\u003C/h3>\n\u003Cp>Bei 1 GHz liegt die relative Permittivitaet ($Dk$) von Standard-FR-4 typischerweise zwischen \u003Cstrong>4,2 und 4,5\u003C/strong>. Bei 10 GHz faellt sie durch dielektrische Dispersion auf ca. 4,0 bis 4,2.\u003C/p>\n\u003Ch3 id=\"wann-sollte-man-high-tg-fr-4-gegenueber-standard-fr-4-waehlen\" data-anchor-en=\"2-high-frequency-attenuation\">Wann sollte man High-Tg FR-4 gegenueber Standard-FR-4 waehlen?\u003C/h3>\n\u003Cp>High-Tg FR-4 ($T_g \\ge 170^\\circ\\text{C}$) ist zwingend erforderlich fuer bleifreie Reflow-Prozesse, Multilayer-Platinen mit mehr als 6 Lagen sowie Industrie- und Automobilanwendungen mit erhoehten Betriebstemperaturen.\u003C/p>\n\u003Ch2 id=\"verwandte-ressourcen-und-technische-leitfaden\" data-anchor-en=\"thermal-properties-tg-td-and-cte\">Verwandte Ressourcen und technische Leitfäden\u003C/h2>\n\u003Cul>\n\u003Cli>\u003Ca href=\"/de/blog/glass-transition-temperature-tg\">/blog/glass-transition-temperature-tg\u003C/a> - Deep dive into Tg thermal reliability thresholds\u003C/li>\n\u003Cli>\u003Ca href=\"/de/blog/what-is-dielectric-constant\">/blog/what-is-dielectric-constant\u003C/a> - Dielectric constant fundamentals and impedance control\u003C/li>\n\u003Cli>\u003Ca href=\"/de/materials\">/materials\u003C/a> - Complete substrate material catalog and high-frequency laminates\u003C/li>\n\u003Cli>\u003Ca href=\"/de/pcb\">/pcb\u003C/a> - Full multilayer rigid PCB fabrication specifications and tolerances\u003C/li>\n\u003C/ul>\n\n\u003Csection class=\"related-links\" aria-label=\"Related\">\u003Ch3>Related links\u003C/h3>\u003Cul>\u003Cli>\u003Ca href=\"/de/blog/glass-transition-temperature-tg\">/blog/glass-transition-temperature-tg\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/de/blog/what-is-dielectric-constant\">/blog/what-is-dielectric-constant\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/de/materials\">/materials\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/de/pcb\">/pcb\u003C/a>\u003C/li>\u003C/ul>\u003C/section>",[14,15,16,17,18,19,20],"FR4 Material","FR4 Properties","PCB Substrate","FR4 Dielectric Constant","FR4 Tg","Thermal Conductivity","PCB Stackup","fr4-material-properties",{"blog":23,"breadcrumb":32,"faq":46},{"@context":24,"@type":25,"headline":4,"description":5,"image":8,"url":26,"datePublished":6,"dateModified":6,"timeRequired":11,"keywords":27,"articleSection":7,"author":28,"publisher":31},"https://schema.org","BlogPosting","https://aptpcb.com/de/blog/fr4-material-properties","FR4 Material, FR4 Properties, PCB Substrate, FR4 Dielectric Constant, FR4 Tg, Thermal Conductivity, PCB Stackup",{"@type":29,"name":30},"Organization","APTPCB",{"@type":29,"name":30},{"@context":24,"@type":33,"itemListElement":34},"BreadcrumbList",[35,40,44],{"@type":36,"position":37,"name":38,"item":39},"ListItem",1,"Home","https://aptpcb.com/",{"@type":36,"position":41,"name":42,"item":43},2,"Blog","https://aptpcb.com/de/blog",{"@type":36,"position":45,"name":21,"item":26},3,null,{"pcbManufacturingColumns":48,"capabilityColumns":172,"resourceColumns":208,"pcbaColumns":252},[49,97,126,155],{"heading":50,"links":51},"PCB-Produktfamilien",[52,55,58,61,64,67,70,73,76,79,82,85,88,91,94],{"label":53,"path":54},"FR-4 PCB","/pcb/fr4-pcb",{"label":56,"path":57},"High-Speed-PCB","/pcb/high-speed-pcb",{"label":59,"path":60},"Multilayer-PCB","/pcb/multilayer-pcb",{"label":62,"path":63},"HDI-PCB","/pcb/hdi-pcb",{"label":65,"path":66},"Flex-PCB","/pcb/flex-pcb",{"label":68,"path":69},"Rigid-Flex-PCB","/pcb/rigid-flex-pcb",{"label":71,"path":72},"Keramik-PCB","/pcb/ceramic-pcb",{"label":74,"path":75},"Dickkupfer-PCB","/pcb/heavy-copper-pcb",{"label":77,"path":78},"High-Thermal-PCB","/pcb/high-thermal-pcb",{"label":80,"path":81},"Antenna-PCB","/pcb/antenna-pcb",{"label":83,"path":84},"High-Frequency-PCB","/pcb/high-frequency-pcb",{"label":86,"path":87},"Microwave-PCB","/pcb/microwave-pcb",{"label":89,"path":90},"Metal-Core-PCB","/pcb/metal-core-pcb",{"label":92,"path":93},"High-Tg-PCB","/pcb/high-tg-pcb",{"label":95,"path":96},"Backplane-PCB","/pcb/backplane-pcb",{"sections":98},[99],{"heading":100,"links":101},"RF & Materialien",[102,105,108,111,114,117,120,123],{"label":103,"path":104},"Rogers PCB","/materials/rf-rogers",{"label":106,"path":107},"Taconic PCB","/materials/taconic-pcb",{"label":109,"path":110},"Teflon PCB","/materials/teflon-pcb",{"label":112,"path":113},"Arlon PCB","/materials/arlon-pcb",{"label":115,"path":116},"Megtron PCB","/materials/megtron-pcb",{"label":118,"path":119},"ISOLA PCB","/materials/isola-pcb",{"label":121,"path":122},"Spread-Glass FR-4","/materials/spread-glass-fr4",{"label":124,"path":125},"Stackups mit kontrollierter Impedanz","/pcb/pcb-stack-up",{"sections":127},[128],{"heading":129,"links":130},"Fertigung / Stackups",[131,134,137,140,143,146,149,152],{"label":132,"path":133},"Quickturn-Prototypen","/pcb/quick-turn-pcb",{"label":135,"path":136},"NPI & Kleinserie (PCB)","/pcb/npi-small-batch-pcb-manufacturing",{"label":138,"path":139},"High-Volume-Produktion","/pcb/mass-production-pcb-manufacturing",{"label":141,"path":142},"High-Layer-Count-PCB","/pcb/high-layer-count-pcb",{"label":144,"path":145},"PCB-Fertigungsprozess","/pcb/pcb-fabrication-process",{"label":147,"path":148},"Fortschrittliche PCB-Fertigung","/pcb/advanced-pcb-manufacturing",{"label":150,"path":151},"Spezielle PCB-Fertigung","/pcb/special-pcb-manufacturing",{"label":153,"path":154},"Mehrlagige Laminatstruktur","/pcb/multilayer-pcb-lamination-services",{"heading":156,"links":157},"Spezialthemen & Ressourcen",[158,161,164,166,169],{"label":159,"path":160},"PCB-Oberflächen (ENIG / ENEPIG / HASL / OSP / Immersion)","/pcb/pcb-surface-finishes",{"label":162,"path":163},"Bohren & Vias (Blind / Buried / Via-in-Pad / Backdrill / Half Hole)","/pcb/pcb-drilling",{"label":165,"path":125},"PCB-Stackup (Standard / High-Layer / Flex / Rigid-Flex / Aluminum)",{"label":167,"path":168},"Profilierung (Milling / V-Scoring / Depaneling)","/pcb/pcb-profiling",{"label":170,"path":171},"Qualität & Inspektion (AOI + X-Ray / Flying Probe / PCB DFM Check)","/pcb/pcb-quality",[173,178,183,188,193,198,203],{"links":174},[175],{"label":176,"path":177},"Rigid-PCB-Kapazitäten","/capabilities/rigid-pcb",{"links":179},[180],{"label":181,"path":182},"Rigid-Flex-Kapazitäten","/capabilities/rigid-flex-pcb",{"links":184},[185],{"label":186,"path":187},"Flex-PCB-Kapazitäten","/capabilities/flex-pcb",{"links":189},[190],{"label":191,"path":192},"HDI-PCB-Kapazitäten","/capabilities/hdi-pcb",{"links":194},[195],{"label":196,"path":197},"Metal-PCB-Kapazitäten","/capabilities/metal-pcb",{"links":199},[200],{"label":201,"path":202},"Keramik-PCB-Kapazitäten","/capabilities/ceramic-pcb",{"links":204},[205],{"label":206,"path":207},"Heavy-Copper-PCB-Kapazitäten","/capabilities/heavy-copper-pcb",[209,220,244],{"heading":210,"links":211},"Downloads",[212,215,218],{"label":213,"path":214},"Material-Datenblätter / Prozesshinweise","/resources/downloads-materials",{"label":216,"path":217},"PCB-DFM-Richtlinien","/resources/dfm-guidelines",{"label":153,"path":219},"/pcb/multi-layer-laminated-structure",{"heading":221,"links":222},"Tools",[223,226,229,232,235,238,241],{"label":224,"path":225},"Gerber-Viewer","/tools/gerber-viewer",{"label":227,"path":228},"PCB-Viewer","/tools/pcb-viewer",{"label":230,"path":231},"BOM-Viewer","/tools/bom-viewer",{"label":233,"path":234},"3D-Viewer","/tools/3d-viewer",{"label":236,"path":237},"Schaltungssimulator","/tools/circuit-simulator",{"label":239,"path":240},"Impedanzrechner","/tools/impedance-calculator",{"label":242,"path":243},"Leiterbahnbreiten-Rechner","/tools/trace-width-calculator",{"heading":245,"links":246},"FAQ & Blog",[247,250],{"label":248,"path":249},"FAQ","/resources/faq",{"label":42,"path":251},"/blog",[253,283,307,340],{"heading":254,"links":255},"Kernleistungen",[256,259,262,265,268,271,274,277,280],{"label":257,"path":258},"Turnkey-PCB-Assembly","/pcba/turnkey-assembly",{"label":260,"path":261},"NPI & Kleinserien-PCB-Assembly","/pcba/npi-assembly",{"label":263,"path":264},"Serien-PCB-Assembly","/pcba/mass-production",{"label":266,"path":267},"Flex- & Rigid-Flex-PCB-Assembly","/pcba/flex-rigid-flex",{"label":269,"path":270},"SMT- & Through-Hole-Assembly","/pcba/smt-tht",{"label":272,"path":273},"BGA-PCB-Assembly","/pcba/bga-qfn-fine-pitch",{"label":275,"path":276},"Komponenten & BOM-Management","/pcba/components-bom",{"label":278,"path":279},"Box-Build-Assembly","/pcba/box-build-assembly",{"label":281,"path":282},"PCB-Assembly: Test & Qualität","/pcba/testing-quality",{"heading":284,"links":285},"Ergänzende Services",[286,289,292,295,298,301,304],{"label":287,"path":288},"Alle Support-Touchpoints","/pcba/support-services",{"label":290,"path":291},"Stencil-Lab","/pcba/pcb-stencil",{"label":293,"path":294},"Komponentenbeschaffung","/pcba/component-sourcing",{"label":296,"path":297},"IC-Programmierung","/pcba/ic-programming",{"label":299,"path":300},"Schutzlackierung","/pcba/pcb-conformal-coating",{"label":302,"path":303},"Selektivlöten","/pcba/pcb-selective-soldering",{"label":305,"path":306},"BGA-Reballing","/pcba/bga-reballing",{"heading":308,"links":309},"Qualität & Test",[310,313,316,319,322,325,328,331,334,337],{"label":311,"path":312},"Qualitätsinspektion","/pcba/quality-system",{"label":314,"path":315},"Erstmusterprüfung (FAI)","/pcba/first-article-inspection",{"label":317,"path":318},"Lötpasteninspektion (SPI)","/pcba/spi-inspection",{"label":320,"path":321},"AOI-Inspektion","/pcba/aoi-inspection",{"label":323,"path":324},"Röntgen-/CT-Inspektion","/pcba/xray-inspection",{"label":326,"path":327},"ICT In-Circuit Test","/pcba/ict-test",{"label":329,"path":330},"Flying-Probe-Test","/pcba/flying-probe-testing",{"label":332,"path":333},"FCT / Funktionstest","/pcba/fct-test",{"label":335,"path":336},"Endkontrolle & Verpackung","/pcba/final-quality-inspection",{"label":338,"path":339},"Wareneingangskontrolle","/pcba/incoming-quality-control",{"heading":341,"linkClass":342,"links":343},"Branchenanwendungen (Einstieg)","text-nowrap",[344,347,350,353,356,359,362,365,368,371,374],{"label":345,"path":346},"Server / Rechenzentrum","/industries/server-data-center-pcb",{"label":348,"path":349},"Automotive / EV","/industries/automotive-electronics-pcb",{"label":351,"path":352},"Medizintechnik","/industries/medical-pcb",{"label":354,"path":355},"Telecom / 5G","/industries/communication-equipment-pcb",{"label":357,"path":358},"Aerospace & Defense","/industries/aerospace-defense-pcb",{"label":360,"path":361},"Drohnen / UAV","/industries/drone-uav-pcb",{"label":363,"path":364},"Industrieautomation","/industries/industrial-control-pcb",{"label":366,"path":367},"Power & Neue Energie","/industries/power-energy-pcb",{"label":369,"path":370},"Robotik & Automation","/industries/robotics-pcb",{"label":372,"path":373},"Security / Sicherheitstechnik","/industries/security-equipment-pcb",{"label":375,"path":376},"PCB-Branchenüberblick →","/pcb-industry-solutions",1791586844073]