[{"data":1,"prerenderedAt":376},["ShallowReactive",2],{"blog-glass-transition-temperature-tg-de":3,"header-nav-de":46},{"title":4,"description":5,"date":6,"lastUpdated":6,"category":7,"image":8,"readingTime":9,"wordCount":10,"timeRequired":11,"htmlContent":12,"tags":13,"slug":21,"jsonld":22},"Glasuebergangstemperatur (Tg): Bedeutung fuer Leiterplatten","Die Glasuebergangstemperatur (Tg) markiert den Phasenwechsel von starr zu gummigleich. Erfahren Sie, wie Tg, Td und CTE die Zuverlaessigkeit beeinflussen.","2026-10-09","materials","/assets/img/pcb/high-tg/pcb-high-tg-pcb-hero.webp",3,403,"PT3M","\u003Ch2 id=\"wichtige-erkenntnisse\" data-anchor-en=\"key-takeaways\">Wichtige Erkenntnisse\u003C/h2>\n\u003Cul>\n\u003Cli>\u003Cstrong>Definition der Glasuebergangstemperatur:\u003C/strong> Tg ist der kritische Temperaturbereich, in dem ein amorphes Polymer von einem harten, glasartigen, starren Zustand in einen weichen, gummiartigen Zustand uebergeht.\u003C/li>\n\u003Cli>\u003Cstrong>Kein Schmelzpunkt:\u003C/strong> Tg ist kein Schmelzen; das Harz verfluessigt sich nicht. Es handelt sich um einen reversiblen thermodynamischen Phasenwechsel zweiter Ordnung.\u003C/li>\n\u003Cli>\u003Cstrong>Dramatischer Anstieg des Z-Achsen-CTE:\u003C/strong> Oberhalb von Tg steigt die thermische Ausdehnungsrate des Laminats in Z-Richtung um \u003Cstrong>400% bis 500%\u003C/strong> (von ca. 50 ppm/°C auf ca. 260 ppm/°C), was enorme Zugspannungen auf Durchkontaktierungen (PTH) ausuebt.\u003C/li>\n\u003Cli>\u003Cstrong>Branchenklassifizierung:\u003C/strong> Standard-FR-4 ($T_g \\approx 130\\text{--}140^\\circ\\text{C}$), Mid-$T_g$ ($T_g \\approx 150^\\circ\\text{C}$) und High-$T_g$ ($T_g \\ge 170^\\circ\\text{C}$).\u003C/li>\n\u003Cli>\u003Cstrong>Wann ein Upgrade erforderlich ist:\u003C/strong> High-$T_g$-Laminate sind vorgeschrieben fuer Multilayer ab 8 Lagen, bleifreie RoHS-Reflow-Loetzyklen ($260^\\circ\\text{C}$ Spitze) und Industrieanwendungen ueber $100^\\circ\\text{C}$.\u003C/li>\n\u003C/ul>\n\u003Cdiv data-component=\"BlogQuickQuoteInline\">\u003C/div>\n\n\u003Ch2 id=\"was-ist-die-glasuebergangstemperatur-physik-und-definition\" data-anchor-en=\"what-is-glass-transition-temperature-definition-and-physics\">Was ist die Glasuebergangstemperatur? Physik und Definition\u003C/h2>\n\u003Cp>In der Polymerphysik beschreibt die \u003Cstrong>Glasuebergangstemperatur\u003C/strong> die Kinetik der Molekuelketten. Das ausgehaertete Epoxidharz im PCB-Substrat bildet ein vernetztes amorphes Netzwerk. Bei Raumtemperatur sind die Polymerketten fixiert und schwingen kaum. Das Material ist steif und dimensionsstabil.\u003C/p>\n\u003Cp>Mit steigender Temperatur gewinnen die Ketten kinetische Energie, bis sie intermolekulare Kraefte ueberwinden und aneinander vorbeigleiten koennen. Der Schwellenwert dafuer ist die \u003Cstrong>Glasuebergangstemperatur\u003C/strong> ($T_g$).\u003C/p>\n\u003Ch2 id=\"pruefmethoden-zur-messung-von-tg\" data-anchor-en=\"how-is-tg-measured-dsc-tma-dma\">Pruefmethoden zur Messung von Tg\u003C/h2>\n\u003Cp>Die Leiterplattenindustrie verwendet drei genormte Pruefverfahren nach IPC-TM-650:\u003C/p>\n\u003Col>\n\u003Cli>\u003Cstrong>Differential Scanning Calorimetry (DSC, IPC-TM-650 2.4.25):\u003C/strong> Misst die Aenderung der Waermekapazitaet ($C_p$). Weit verbreiteter Standard.\u003C/li>\n\u003Cli>\u003Cstrong>Thermomechanical Analysis (TMA, IPC-TM-650 2.4.24):\u003C/strong> Erfasst die dimensionale Ausdehnung ueber die Temperatur. Bestimmt Tg und den Ausdehnungskoeffizienten $\\alpha_1$ und $\\alpha_2$.\u003C/li>\n\u003Cli>\u003Cstrong>Dynamic Mechanical Analysis (DMA, IPC-TM-650 2.4.24.4):\u003C/strong> Misst die Abnahme des Speichermoduls ($E'$). Liefert typischerweise 5 bis 10 °C hoehere Tg-Werte als DSC/TMA.\u003C/li>\n\u003C/ol>\n\u003Ch2 id=\"haeufig-gestellte-fragen-zu-pcb-tg\" data-anchor-en=\"tg-vs-td-vs-time-to-delamination-t260-t288\">Haeufig gestellte Fragen zu PCB Tg\u003C/h2>\n\u003Ch3 id=\"was-bedeutet-glasuebergangstemperatur-bei-leiterplatten\" data-anchor-en=\"1-glass-transition-temperature-tg\">Was bedeutet Glasuebergangstemperatur bei Leiterplatten?\u003C/h3>\n\u003Cp>Tg bezeichnet die Temperatur, bei der die Epoxidharzmatrix der Leiterplatte ihre mechanische Steifigkeit verliert und die thermische Z-Achsen-Ausdehnung sprunghaft ansteigt.\u003C/p>\n\u003Ch3 id=\"ist-tg-identisch-mit-der-maximalen-betriebstemperatur\" data-anchor-en=\"2-decomposition-temperature-td\">Ist Tg identisch mit der maximalen Betriebstemperatur?\u003C/h3>\n\u003Cp>Nein. Die maximale Dauerbetriebstemperatur (RTI) einer Leiterplatte liegt ueblicherweise mindestens 20 °C bis 30 °C unter der Glasuebergangstemperatur Tg.\u003C/p>\n\u003Ch3 id=\"warum-ist-high-tg-fuer-bleifreies-loeten-erforderlich\" data-anchor-en=\"3-time-to-delamination-t260-and-t288\">Warum ist High-Tg fuer bleifreies Loeten erforderlich?\u003C/h3>\n\u003Cp>Bleifreie Lote (wie SAC306/SAC305) erfordern Spitzentemperaturen von bis zu 260 °C. Standard-FR-4 wuerde bei mehrfachen Durchlaeufen delaminieren oder Fassungsrisse in Durchkontaktierungen erleiden.\u003C/p>\n\u003Ch2 id=\"verwandte-ressourcen-und-technische-leitfaden\" data-anchor-en=\"why-tg-matters-in-lead-free-assembly\">Verwandte Ressourcen und technische Leitfäden\u003C/h2>\n\u003Cul>\n\u003Cli>\u003Ca href=\"/de/blog/fr4-material-properties\">/blog/fr4-material-properties\u003C/a> - Complete FR-4 material properties, Dk, and thermal specifications\u003C/li>\n\u003Cli>\u003Ca href=\"/de/materials\">/materials\u003C/a> - High-Tg and high-frequency substrate materials catalog\u003C/li>\n\u003Cli>\u003Ca href=\"/de/pcb\">/pcb\u003C/a> - Fabrication specifications for high-layer-count multilayer circuit boards\u003C/li>\n\u003Cli>\u003Ca href=\"/de/pcba\">/pcba\u003C/a> - Lead-free RoHS surface-mount assembly thermal profiles\u003C/li>\n\u003C/ul>\n\n\u003Csection class=\"related-links\" aria-label=\"Related\">\u003Ch3>Related links\u003C/h3>\u003Cul>\u003Cli>\u003Ca href=\"/de/blog/fr4-material-properties\">/blog/fr4-material-properties\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/de/materials\">/materials\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/de/pcb\">/pcb\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/de/pcba\">/pcba\u003C/a>\u003C/li>\u003C/ul>\u003C/section>",[14,15,16,17,18,19,20],"Glass Transition Temperature","PCB Tg","High Tg PCB","Thermal Reliability","FR4 Material","Lead-Free Assembly","CTE Expansion","glass-transition-temperature-tg",{"blog":23,"breadcrumb":32,"faq":45},{"@context":24,"@type":25,"headline":4,"description":5,"image":8,"url":26,"datePublished":6,"dateModified":6,"timeRequired":11,"keywords":27,"articleSection":7,"author":28,"publisher":31},"https://schema.org","BlogPosting","https://aptpcb.com/de/blog/glass-transition-temperature-tg","Glass Transition Temperature, PCB Tg, High Tg PCB, Thermal Reliability, FR4 Material, Lead-Free Assembly, CTE Expansion",{"@type":29,"name":30},"Organization","APTPCB",{"@type":29,"name":30},{"@context":24,"@type":33,"itemListElement":34},"BreadcrumbList",[35,40,44],{"@type":36,"position":37,"name":38,"item":39},"ListItem",1,"Home","https://aptpcb.com/",{"@type":36,"position":41,"name":42,"item":43},2,"Blog","https://aptpcb.com/de/blog",{"@type":36,"position":9,"name":21,"item":26},null,{"pcbManufacturingColumns":47,"capabilityColumns":171,"resourceColumns":207,"pcbaColumns":251},[48,96,125,154],{"heading":49,"links":50},"PCB-Produktfamilien",[51,54,57,60,63,66,69,72,75,78,81,84,87,90,93],{"label":52,"path":53},"FR-4 PCB","/pcb/fr4-pcb",{"label":55,"path":56},"High-Speed-PCB","/pcb/high-speed-pcb",{"label":58,"path":59},"Multilayer-PCB","/pcb/multilayer-pcb",{"label":61,"path":62},"HDI-PCB","/pcb/hdi-pcb",{"label":64,"path":65},"Flex-PCB","/pcb/flex-pcb",{"label":67,"path":68},"Rigid-Flex-PCB","/pcb/rigid-flex-pcb",{"label":70,"path":71},"Keramik-PCB","/pcb/ceramic-pcb",{"label":73,"path":74},"Dickkupfer-PCB","/pcb/heavy-copper-pcb",{"label":76,"path":77},"High-Thermal-PCB","/pcb/high-thermal-pcb",{"label":79,"path":80},"Antenna-PCB","/pcb/antenna-pcb",{"label":82,"path":83},"High-Frequency-PCB","/pcb/high-frequency-pcb",{"label":85,"path":86},"Microwave-PCB","/pcb/microwave-pcb",{"label":88,"path":89},"Metal-Core-PCB","/pcb/metal-core-pcb",{"label":91,"path":92},"High-Tg-PCB","/pcb/high-tg-pcb",{"label":94,"path":95},"Backplane-PCB","/pcb/backplane-pcb",{"sections":97},[98],{"heading":99,"links":100},"RF & Materialien",[101,104,107,110,113,116,119,122],{"label":102,"path":103},"Rogers PCB","/materials/rf-rogers",{"label":105,"path":106},"Taconic PCB","/materials/taconic-pcb",{"label":108,"path":109},"Teflon PCB","/materials/teflon-pcb",{"label":111,"path":112},"Arlon PCB","/materials/arlon-pcb",{"label":114,"path":115},"Megtron PCB","/materials/megtron-pcb",{"label":117,"path":118},"ISOLA PCB","/materials/isola-pcb",{"label":120,"path":121},"Spread-Glass FR-4","/materials/spread-glass-fr4",{"label":123,"path":124},"Stackups mit kontrollierter Impedanz","/pcb/pcb-stack-up",{"sections":126},[127],{"heading":128,"links":129},"Fertigung / Stackups",[130,133,136,139,142,145,148,151],{"label":131,"path":132},"Quickturn-Prototypen","/pcb/quick-turn-pcb",{"label":134,"path":135},"NPI & Kleinserie (PCB)","/pcb/npi-small-batch-pcb-manufacturing",{"label":137,"path":138},"High-Volume-Produktion","/pcb/mass-production-pcb-manufacturing",{"label":140,"path":141},"High-Layer-Count-PCB","/pcb/high-layer-count-pcb",{"label":143,"path":144},"PCB-Fertigungsprozess","/pcb/pcb-fabrication-process",{"label":146,"path":147},"Fortschrittliche PCB-Fertigung","/pcb/advanced-pcb-manufacturing",{"label":149,"path":150},"Spezielle PCB-Fertigung","/pcb/special-pcb-manufacturing",{"label":152,"path":153},"Mehrlagige Laminatstruktur","/pcb/multilayer-pcb-lamination-services",{"heading":155,"links":156},"Spezialthemen & Ressourcen",[157,160,163,165,168],{"label":158,"path":159},"PCB-Oberflächen (ENIG / ENEPIG / HASL / OSP / Immersion)","/pcb/pcb-surface-finishes",{"label":161,"path":162},"Bohren & Vias (Blind / Buried / Via-in-Pad / Backdrill / Half Hole)","/pcb/pcb-drilling",{"label":164,"path":124},"PCB-Stackup (Standard / High-Layer / Flex / Rigid-Flex / Aluminum)",{"label":166,"path":167},"Profilierung (Milling / V-Scoring / Depaneling)","/pcb/pcb-profiling",{"label":169,"path":170},"Qualität & Inspektion (AOI + X-Ray / Flying Probe / PCB DFM Check)","/pcb/pcb-quality",[172,177,182,187,192,197,202],{"links":173},[174],{"label":175,"path":176},"Rigid-PCB-Kapazitäten","/capabilities/rigid-pcb",{"links":178},[179],{"label":180,"path":181},"Rigid-Flex-Kapazitäten","/capabilities/rigid-flex-pcb",{"links":183},[184],{"label":185,"path":186},"Flex-PCB-Kapazitäten","/capabilities/flex-pcb",{"links":188},[189],{"label":190,"path":191},"HDI-PCB-Kapazitäten","/capabilities/hdi-pcb",{"links":193},[194],{"label":195,"path":196},"Metal-PCB-Kapazitäten","/capabilities/metal-pcb",{"links":198},[199],{"label":200,"path":201},"Keramik-PCB-Kapazitäten","/capabilities/ceramic-pcb",{"links":203},[204],{"label":205,"path":206},"Heavy-Copper-PCB-Kapazitäten","/capabilities/heavy-copper-pcb",[208,219,243],{"heading":209,"links":210},"Downloads",[211,214,217],{"label":212,"path":213},"Material-Datenblätter / Prozesshinweise","/resources/downloads-materials",{"label":215,"path":216},"PCB-DFM-Richtlinien","/resources/dfm-guidelines",{"label":152,"path":218},"/pcb/multi-layer-laminated-structure",{"heading":220,"links":221},"Tools",[222,225,228,231,234,237,240],{"label":223,"path":224},"Gerber-Viewer","/tools/gerber-viewer",{"label":226,"path":227},"PCB-Viewer","/tools/pcb-viewer",{"label":229,"path":230},"BOM-Viewer","/tools/bom-viewer",{"label":232,"path":233},"3D-Viewer","/tools/3d-viewer",{"label":235,"path":236},"Schaltungssimulator","/tools/circuit-simulator",{"label":238,"path":239},"Impedanzrechner","/tools/impedance-calculator",{"label":241,"path":242},"Leiterbahnbreiten-Rechner","/tools/trace-width-calculator",{"heading":244,"links":245},"FAQ & Blog",[246,249],{"label":247,"path":248},"FAQ","/resources/faq",{"label":42,"path":250},"/blog",[252,282,306,339],{"heading":253,"links":254},"Kernleistungen",[255,258,261,264,267,270,273,276,279],{"label":256,"path":257},"Turnkey-PCB-Assembly","/pcba/turnkey-assembly",{"label":259,"path":260},"NPI & Kleinserien-PCB-Assembly","/pcba/npi-assembly",{"label":262,"path":263},"Serien-PCB-Assembly","/pcba/mass-production",{"label":265,"path":266},"Flex- & Rigid-Flex-PCB-Assembly","/pcba/flex-rigid-flex",{"label":268,"path":269},"SMT- & Through-Hole-Assembly","/pcba/smt-tht",{"label":271,"path":272},"BGA-PCB-Assembly","/pcba/bga-qfn-fine-pitch",{"label":274,"path":275},"Komponenten & BOM-Management","/pcba/components-bom",{"label":277,"path":278},"Box-Build-Assembly","/pcba/box-build-assembly",{"label":280,"path":281},"PCB-Assembly: Test & Qualität","/pcba/testing-quality",{"heading":283,"links":284},"Ergänzende Services",[285,288,291,294,297,300,303],{"label":286,"path":287},"Alle Support-Touchpoints","/pcba/support-services",{"label":289,"path":290},"Stencil-Lab","/pcba/pcb-stencil",{"label":292,"path":293},"Komponentenbeschaffung","/pcba/component-sourcing",{"label":295,"path":296},"IC-Programmierung","/pcba/ic-programming",{"label":298,"path":299},"Schutzlackierung","/pcba/pcb-conformal-coating",{"label":301,"path":302},"Selektivlöten","/pcba/pcb-selective-soldering",{"label":304,"path":305},"BGA-Reballing","/pcba/bga-reballing",{"heading":307,"links":308},"Qualität & Test",[309,312,315,318,321,324,327,330,333,336],{"label":310,"path":311},"Qualitätsinspektion","/pcba/quality-system",{"label":313,"path":314},"Erstmusterprüfung (FAI)","/pcba/first-article-inspection",{"label":316,"path":317},"Lötpasteninspektion (SPI)","/pcba/spi-inspection",{"label":319,"path":320},"AOI-Inspektion","/pcba/aoi-inspection",{"label":322,"path":323},"Röntgen-/CT-Inspektion","/pcba/xray-inspection",{"label":325,"path":326},"ICT In-Circuit Test","/pcba/ict-test",{"label":328,"path":329},"Flying-Probe-Test","/pcba/flying-probe-testing",{"label":331,"path":332},"FCT / Funktionstest","/pcba/fct-test",{"label":334,"path":335},"Endkontrolle & Verpackung","/pcba/final-quality-inspection",{"label":337,"path":338},"Wareneingangskontrolle","/pcba/incoming-quality-control",{"heading":340,"linkClass":341,"links":342},"Branchenanwendungen (Einstieg)","text-nowrap",[343,346,349,352,355,358,361,364,367,370,373],{"label":344,"path":345},"Server / Rechenzentrum","/industries/server-data-center-pcb",{"label":347,"path":348},"Automotive / EV","/industries/automotive-electronics-pcb",{"label":350,"path":351},"Medizintechnik","/industries/medical-pcb",{"label":353,"path":354},"Telecom / 5G","/industries/communication-equipment-pcb",{"label":356,"path":357},"Aerospace & Defense","/industries/aerospace-defense-pcb",{"label":359,"path":360},"Drohnen / UAV","/industries/drone-uav-pcb",{"label":362,"path":363},"Industrieautomation","/industries/industrial-control-pcb",{"label":365,"path":366},"Power & Neue Energie","/industries/power-energy-pcb",{"label":368,"path":369},"Robotik & Automation","/industries/robotics-pcb",{"label":371,"path":372},"Security / Sicherheitstechnik","/industries/security-equipment-pcb",{"label":374,"path":375},"PCB-Branchenüberblick →","/pcb-industry-solutions",1791586844326]