[{"data":1,"prerenderedAt":398},["ShallowReactive",2],{"blog-pcb-components-guide-en":3,"header-nav-en":75},{"title":4,"description":5,"date":6,"lastUpdated":6,"category":7,"image":8,"readingTime":9,"wordCount":10,"timeRequired":11,"htmlContent":12,"tags":13,"slug":21,"jsonld":22},"Circuit Board Components: Identification and Labels Guide","Identify common circuit board components by look and reference designator (R, C, U, Q, D), and learn which ones drive cost, lead time and sourcing risk.","2026-10-01","technology","/assets/img/pcba/incoming-storage.webp",14,2783,"PT14M","\u003Cp>\u003Cstrong>Most circuit board components can be identified from two clues: the reference designator printed next to the part, and the package shape.\u003C/strong> The designator is a letter prefix plus a number, such as R12 for a resistor or U3 for an integrated circuit. Polarity marks next to the designator show how diodes, capacitors, and ICs are oriented; the \u003Ca href=\"/en/blog/smt-component-polarity\">SMT component polarity guide\u003C/a> explains the common symbols. The package tells you whether the part is a chip passive, a transistor, an IC, a connector, or something else. With those two clues and the markings on the part body, you can usually find the exact part in the BOM or a datasheet.\u003C/p>\n\u003Cp>This guide lists the main components on a PCB, explains circuit board component labels, shows how to identify parts that carry little or no marking, and ends with what turns a list of parts into a BOM a supplier can quote. It is written for engineers, buyers, and repair technicians who need to name a part correctly before they replace, source, or redesign it.\u003C/p>\n\u003Ch2 id=\"key-takeaways\" data-anchor-en=\"key-takeaways\">Key takeaways\u003C/h2>\n\u003Cul>\n\u003Cli>The reference designator prefix (R, C, L, D, Q, U, J and others) tells you the component type. The number links it to the BOM and schematic.\u003C/li>\n\u003Cli>Package shape narrows the type further: two-terminal chips, three-lead SOT parts, leaded ICs, leadless QFNs, ball-grid BGAs.\u003C/li>\n\u003Cli>Small passives are often unmarked. Measure them or read the BOM instead of guessing.\u003C/li>\n\u003Cli>Long lead times and supply risk usually come from ICs, connectors, and specialized passives, not from generic resistors and capacitors.\u003C/li>\n\u003Cli>A sourcing-ready BOM needs the manufacturer part number for every line, not a description like "10k resistor".\u003C/li>\n\u003C/ul>\n\u003Cdiv data-component=\"BlogQuickQuoteInline\">\u003C/div>\n\n\u003Ch2 id=\"main-components-on-a-pcb\" data-anchor-en=\"main-components-on-a-pcb\">Main components on a PCB\u003C/h2>\n\u003Cp>A typical assembled board carries a mix of passive parts, semiconductors, electromechanical parts, and hardware. These are the circuit board components you will see most often:\u003C/p>\n\u003Cul>\n\u003Cli>\u003Cstrong>Resistors\u003C/strong> limit current and set voltages. On modern boards most are small rectangular chips.\u003C/li>\n\u003Cli>\u003Cstrong>Capacitors\u003C/strong> store charge, filter noise, and decouple power pins. Ceramic chip capacitors are the most common; aluminum electrolytic and tantalum capacitors handle larger values.\u003C/li>\n\u003Cli>\u003Cstrong>Inductors and ferrite beads\u003C/strong> store energy in power converters and block high-frequency noise.\u003C/li>\n\u003Cli>\u003Cstrong>Diodes and LEDs\u003C/strong> pass current in one direction, protect against reverse polarity and transients, or emit light.\u003C/li>\n\u003Cli>\u003Cstrong>Transistors and MOSFETs\u003C/strong> switch and amplify signals or power.\u003C/li>\n\u003Cli>\u003Cstrong>Integrated circuits (ICs)\u003C/strong> include microcontrollers, processors, memory, power regulators, interface chips, and sensors.\u003C/li>\n\u003Cli>\u003Cstrong>Crystals and oscillators\u003C/strong> provide clock frequencies.\u003C/li>\n\u003Cli>\u003Cstrong>Connectors\u003C/strong> link the board to cables, other boards, or the outside world.\u003C/li>\n\u003Cli>\u003Cstrong>Switches, relays, fuses, transformers, and test points\u003C/strong> complete most designs.\u003C/li>\n\u003C/ul>\n\u003Ch2 id=\"circuit-board-component-labels-reference-designators\" data-anchor-en=\"circuit-board-component-labels-reference-designators\">Circuit board component labels: reference designators\u003C/h2>\n\u003Cp>The letters printed on the silkscreen next to each part are reference designators. They follow conventions from IEEE 315 / ASME Y14.44, though companies adapt them. The table below covers the prefixes you will meet on most boards, how to recognize each part by eye, and the sourcing risk each type usually carries.\u003C/p>\n\u003Ctable>\n\u003Cthead>\n\u003Ctr>\n\u003Cth>Designator prefix\u003C/th>\n\u003Cth>Component type\u003C/th>\n\u003Cth>How to identify it on the board\u003C/th>\n\u003Cth>Typical sourcing risk\u003C/th>\n\u003C/tr>\n\u003C/thead>\n\u003Ctbody>\u003Ctr>\n\u003Ctd>R\u003C/td>\n\u003Ctd>Resistor\u003C/td>\n\u003Ctd>Small rectangular chip, often black with a printed code; leaded parts have color bands\u003C/td>\n\u003Ctd>Low; many equivalent manufacturers\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>RN, RA\u003C/td>\n\u003Ctd>Resistor network or array\u003C/td>\n\u003Ctd>Chip with 4 to 10 terminals in a row\u003C/td>\n\u003Ctd>Low to medium; fewer alternates\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>C\u003C/td>\n\u003Ctd>Capacitor\u003C/td>\n\u003Ctd>Tan, brown, or grey unmarked chip (ceramic); cylinder with polarity stripe (electrolytic); molded block with band (tantalum)\u003C/td>\n\u003Ctd>Low for common ceramics; medium for high-value, high-voltage, or automotive-grade parts\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>L\u003C/td>\n\u003Ctd>Inductor\u003C/td>\n\u003Ctd>Square or round molded block, sometimes with visible winding; often marked with a value code\u003C/td>\n\u003Ctd>Medium; footprint and saturation current limit alternates\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>FB\u003C/td>\n\u003Ctd>Ferrite bead\u003C/td>\n\u003Ctd>Looks like a chip resistor or capacitor, usually unmarked\u003C/td>\n\u003Ctd>Low to medium\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>D\u003C/td>\n\u003Ctd>Diode\u003C/td>\n\u003Ctd>Two-terminal part with a cathode band or marked end; SOD or SMA/SMB packages\u003C/td>\n\u003Ctd>Low for generic parts; medium for TVS and specialized diodes\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>LED\u003C/td>\n\u003Ctd>Light-emitting diode\u003C/td>\n\u003Ctd>Clear or colored lens; cathode mark on body or footprint\u003C/td>\n\u003Ctd>Low to medium; color and brightness binning matter\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Q\u003C/td>\n\u003Ctd>Transistor or MOSFET\u003C/td>\n\u003Ctd>Three-lead SOT-23, larger DPAK or power packages with a metal tab\u003C/td>\n\u003Ctd>Medium; check pinout and ratings for alternates\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>U, IC\u003C/td>\n\u003Ctd>Integrated circuit\u003C/td>\n\u003Ctd>Multi-pin package (SOIC, QFP, QFN, BGA) with a pin-1 dot or notch and a part marking\u003C/td>\n\u003Ctd>High; often single-source with longer lead times\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Y, X\u003C/td>\n\u003Ctd>Crystal or oscillator\u003C/td>\n\u003Ctd>Metal can or ceramic package, often with frequency marked\u003C/td>\n\u003Ctd>Medium; frequency, load capacitance, and stability must match\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>J, P, CN\u003C/td>\n\u003Ctd>Connector\u003C/td>\n\u003Ctd>Housing with pins or sockets, at a board edge or for cables\u003C/td>\n\u003Ctd>Medium to high; long lead times and mechanical fit\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>SW, S\u003C/td>\n\u003Ctd>Switch\u003C/td>\n\u003Ctd>Tactile button, slide, or DIP switch\u003C/td>\n\u003Ctd>Medium; mechanical fit\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>K, RL\u003C/td>\n\u003Ctd>Relay\u003C/td>\n\u003Ctd>Rectangular box, usually through-hole\u003C/td>\n\u003Ctd>Medium\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>F\u003C/td>\n\u003Ctd>Fuse\u003C/td>\n\u003Ctd>Small chip or cartridge, sometimes in a holder\u003C/td>\n\u003Ctd>Low to medium; ratings and agency approvals must match\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>T, TR\u003C/td>\n\u003Ctd>Transformer\u003C/td>\n\u003Ctd>Wound part with a core, often through-hole\u003C/td>\n\u003Ctd>High when custom\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>TP\u003C/td>\n\u003Ctd>Test point\u003C/td>\n\u003Ctd>Exposed pad or loop for probing\u003C/td>\n\u003Ctd>Not a sourced part when a bare pad\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>MH, H\u003C/td>\n\u003Ctd>Mounting hole or hardware\u003C/td>\n\u003Ctd>Plated or unplated hole, standoff, or screw\u003C/td>\n\u003Ctd>Low\u003C/td>\n\u003C/tr>\n\u003C/tbody>\u003C/table>\n\u003Cp>Two practical notes:\u003C/p>\n\u003Cul>\n\u003Cli>Designators are assigned by the designer and can vary. A company might use "IC" instead of "U" or "CN" instead of "J". The schematic and BOM are the final authority.\u003C/li>\n\u003Cli>Silkscreen is often omitted on dense boards, or hidden under parts. The assembly drawing shows every designator even when the board does not.\u003C/li>\n\u003C/ul>\n\u003Ch2 id=\"identifying-circuit-board-components-without-labels\" data-anchor-en=\"identifying-circuit-board-components-without-labels\">Identifying circuit board components without labels\u003C/h2>\n\u003Cp>When you cannot read a designator, combine the package, the markings, and the circuit context.\u003C/p>\n\u003Ch3 id=\"read-the-package\" data-anchor-en=\"read-the-package\">Read the package\u003C/h3>\n\u003Cul>\n\u003Cli>\u003Cstrong>Two-terminal rectangular chips\u003C/strong> are resistors, capacitors, inductors, ferrite beads, or fuses. Resistors usually have a black top and a printed code. Ceramic capacitors are usually unmarked and tan or grey.\u003C/li>\n\u003Cli>\u003Cstrong>Three-terminal small packages (SOT-23, SOT-323)\u003C/strong> are usually transistors, MOSFETs, small regulators, or dual diodes.\u003C/li>\n\u003Cli>\u003Cstrong>Packages with leads on two or four sides (SOIC, TSSOP, QFP)\u003C/strong> are ICs.\u003C/li>\n\u003Cli>\u003Cstrong>Packages with pads only underneath (QFN, DFN, LGA)\u003C/strong> are ICs or power parts; you can see the pads only at the edges.\u003C/li>\n\u003Cli>\u003Cstrong>Ball-grid arrays (BGA)\u003C/strong> show only the package top once mounted.\u003C/li>\n\u003C/ul>\n\u003Cp>The package size code helps too. Chip passives are named by length and width: 0402 is 0.04 × 0.02 inches (about 1.0 × 0.5 mm) in the imperial code most suppliers use. Watch for confusion between imperial and metric codes, because "0402" in metric is a much smaller part.\u003C/p>\n\u003Ch3 id=\"read-the-markings\" data-anchor-en=\"read-the-markings\">Read the markings\u003C/h3>\n\u003Cul>\n\u003Cli>\u003Cstrong>Resistor codes.\u003C/strong> A three-digit code such as 103 means 10 followed by three zeros, or 10 kΩ. Four-digit codes add one more significant digit. EIA-96 codes use two digits and a letter.\u003C/li>\n\u003Cli>\u003Cstrong>Capacitor codes.\u003C/strong> Larger capacitors may show a value like 104 (100 nF) or a voltage rating. Most small ceramics carry no marking at all.\u003C/li>\n\u003Cli>\u003Cstrong>IC and semiconductor markings.\u003C/strong> Small parts carry short "top mark" codes rather than full part numbers. Look up the code together with the package in the manufacturer's marking table.\u003C/li>\n\u003C/ul>\n\u003Ch3 id=\"use-the-circuit-around-it\" data-anchor-en=\"use-the-circuit-around-it\">Use the circuit around it\u003C/h3>\n\u003Cp>A part next to every IC power pin is probably a decoupling capacitor. A part in series with an LED is probably a current-limiting resistor. A part at a connector input with a band on one end is probably a protection diode. Context will not give you the exact value, but it narrows the search.\u003C/p>\n\u003Ch3 id=\"measure-when-you-have-to\" data-anchor-en=\"measure-when-you-have-to\">Measure when you have to\u003C/h3>\n\u003Cp>On an unpowered board, a multimeter can identify resistor values and diode direction. An LCR meter, ideally with tweezers, helps with capacitors and inductors, but in-circuit readings are affected by neighboring parts. For anything critical, get the value from the BOM or the design files rather than from a measurement.\u003C/p>\n\u003Ch2 id=\"smd-components-how-to-identify-surface-mount-packages\" data-anchor-en=\"smd-components-how-to-identify-surface-mount-packages\">SMD components: how to identify surface mount packages\u003C/h2>\n\u003Cp>Most parts on a modern board are SMD components (surface mount devices). Their bodies are small and their markings short, so the package outline is often the fastest way to tell the component type. The \u003Ca href=\"/en/blog/what-is-smt\">SMT guide\u003C/a> explains how these parts are assembled; this table helps you recognize them.\u003C/p>\n\u003Ctable>\n\u003Cthead>\n\u003Ctr>\n\u003Cth>SMD package family\u003C/th>\n\u003Cth>Examples\u003C/th>\n\u003Cth>What it usually contains\u003C/th>\n\u003Cth>Identification tip\u003C/th>\n\u003C/tr>\n\u003C/thead>\n\u003Ctbody>\u003Ctr>\n\u003Ctd>Chip (two-terminal)\u003C/td>\n\u003Ctd>01005, 0201, 0402, 0603, 0805, 1206\u003C/td>\n\u003Ctd>Resistors, ceramic capacitors, inductors, ferrite beads, fuses\u003C/td>\n\u003Ctd>Black top with code = resistor; plain tan or grey = capacitor\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Molded two-terminal\u003C/td>\n\u003Ctd>SOD-123, SMA, SMB, SMC, tantalum case sizes\u003C/td>\n\u003Ctd>Diodes, TVS diodes, tantalum capacitors\u003C/td>\n\u003Ctd>A band or bevel marks the cathode or positive end\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>SOT\u003C/td>\n\u003Ctd>SOT-23, SOT-223, SOT-363\u003C/td>\n\u003Ctd>Transistors, MOSFETs, small regulators, dual diodes\u003C/td>\n\u003Ctd>Short top-mark code; look up by package and code\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Power packages\u003C/td>\n\u003Ctd>DPAK, D2PAK, PowerPAK-style\u003C/td>\n\u003Ctd>MOSFETs, regulators, power diodes\u003C/td>\n\u003Ctd>Large metal tab soldered to a copper area\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Leaded ICs\u003C/td>\n\u003Ctd>SOIC, TSSOP, QFP\u003C/td>\n\u003Ctd>Logic, interface, MCUs, op-amps\u003C/td>\n\u003Ctd>Gull-wing leads on two or four sides; pin-1 dot or notch\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Leadless ICs\u003C/td>\n\u003Ctd>QFN, DFN, LGA\u003C/td>\n\u003Ctd>MCUs, power ICs, RF parts\u003C/td>\n\u003Ctd>Pads only underneath; exposed thermal pad in the center\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Ball-grid arrays\u003C/td>\n\u003Ctd>BGA, CSP, WLCSP\u003C/td>\n\u003Ctd>Processors, FPGAs, memory\u003C/td>\n\u003Ctd>Only the top is visible after assembly; joints need X-ray\u003C/td>\n\u003C/tr>\n\u003C/tbody>\u003C/table>\n\u003Ch2 id=\"passive-vs-active-components\" data-anchor-en=\"passive-vs-active-components\">Passive vs active components\u003C/h2>\n\u003Cp>Engineers often split circuit board components into passive and active groups, because the two behave differently in sourcing and failure analysis.\u003C/p>\n\u003Ctable>\n\u003Cthead>\n\u003Ctr>\n\u003Cth>Group\u003C/th>\n\u003Cth>Examples\u003C/th>\n\u003Cth>Needs power to work?\u003C/th>\n\u003Cth>Typical sourcing note\u003C/th>\n\u003C/tr>\n\u003C/thead>\n\u003Ctbody>\u003Ctr>\n\u003Ctd>Passive\u003C/td>\n\u003Ctd>Resistors, capacitors, inductors, ferrite beads, crystals, transformers\u003C/td>\n\u003Ctd>No; they do not amplify or switch on their own\u003C/td>\n\u003Ctd>Many second sources for standard values; specialized grades narrow choice\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Active\u003C/td>\n\u003Ctd>Diodes, transistors, MOSFETs, ICs, LEDs, oscillators\u003C/td>\n\u003Ctd>Yes, for amplifying, switching, or controlling\u003C/td>\n\u003Ctd>Often fewer alternates; pinout and firmware dependencies\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Electromechanical\u003C/td>\n\u003Ctd>Connectors, switches, relays, fuses\u003C/td>\n\u003Ctd>Not applicable\u003C/td>\n\u003Ctd>Mechanical fit makes substitution harder\u003C/td>\n\u003C/tr>\n\u003C/tbody>\u003C/table>\n\u003Cp>Diodes are sometimes counted as passive in textbooks. For sourcing, treat them with the active parts, since ratings and package pinouts must be checked when changing manufacturer.\u003C/p>\n\u003Ch2 id=\"components-that-drive-cost-and-lead-time\" data-anchor-en=\"components-that-drive-cost-and-lead-time\">Components that drive cost and lead time\u003C/h2>\n\u003Cp>When a build is delayed, the cause is rarely a resistor. These are the components that usually set the schedule and the price:\u003C/p>\n\u003Cul>\n\u003Cli>\u003Cstrong>Single-source ICs.\u003C/strong> Microcontrollers, processors, FPGAs, power management ICs, and RF chips often have no drop-in alternate.\u003C/li>\n\u003Cli>\u003Cstrong>Connectors.\u003C/strong> Many are specific to one manufacturer's mating system, with long factory lead times and minimum order quantities.\u003C/li>\n\u003Cli>\u003Cstrong>High-value or specialty passives.\u003C/strong> Large-capacitance MLCCs, high-voltage or automotive-grade capacitors, precision resistors, and power inductors can be allocated in tight markets.\u003C/li>\n\u003Cli>\u003Cstrong>Custom magnetics and transformers.\u003C/strong> These are built to order.\u003C/li>\n\u003Cli>\u003Cstrong>Parts near end of life.\u003C/strong> EOL or not-recommended-for-new-design parts may need a last-time buy or a redesign.\u003C/li>\n\u003Cli>\u003Cstrong>Moisture-sensitive packages.\u003C/strong> BGAs and QFNs need dry storage and baking rules, which add handling steps. See \u003Ca href=\"/en/pcba/bga-qfn-fine-pitch\">BGA and fine-pitch assembly\u003C/a> for how they are handled on the line.\u003C/li>\n\u003C/ul>\n\u003Cp>The \u003Ca href=\"/en/blog/how-to-avoid-bom-mismatch-and-substitution-risk-in-turnkey-pcba\">BOM mismatch and substitution risk guide\u003C/a> explains how to control alternates without losing traceability.\u003C/p>\n\u003Ch2 id=\"from-parts-to-a-sourcing-ready-bom\" data-anchor-en=\"from-parts-to-a-sourcing-ready-bom\">From parts to a sourcing-ready BOM\u003C/h2>\n\u003Cp>Identifying components is only useful if it ends in a BOM that a supplier can buy from. A sourcing-ready BOM has, for every line:\u003C/p>\n\u003Cul>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Reference designators that match the schematic and \u003Ca href=\"/en/blog/centroid-file-basics\">placement (centroid) file\u003C/a>\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Quantity per board\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Manufacturer name and full manufacturer part number (MPN)\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Description with value, tolerance, voltage or current rating, and package\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Approved alternates, or a "do not substitute" flag for critical lines\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Do-not-place (DNP) lines clearly marked\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Any special requirements: automotive grade, date-code limits, RoHS or REACH declarations\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Whether the part is purchased by the assembler or supplied by you\u003C/li>\n\u003C/ul>\n\u003Cp>The \u003Ca href=\"/en/blog/assembly-bom-best-practices\">assembly BOM guide\u003C/a> has a full template, and the \u003Ca href=\"/en/tools/bom-viewer\">online BOM viewer\u003C/a> lets you check a file before you send it.\u003C/p>\n\u003Ch2 id=\"how-aptpcb-handles-your-components\" data-anchor-en=\"how-aptpcb-handles-your-components\">How APTPCB handles your components\u003C/h2>\n\u003Cp>APTPCB's \u003Ca href=\"/en/pcba/component-sourcing\">PCB component sourcing\u003C/a> service reviews your BOM line by line, checks availability and lifecycle status, and prioritizes manufacturers and authorized or franchised distributors. Lines with generic descriptions or missing data become open exceptions instead of guesses, and no alternate is purchased or kitted without your approval or an updated AVL. Projects can be fully turnkey, partly sourced, or fully consigned; a \u003Ca href=\"/en/pcba/turnkey-assembly\">turnkey PCB assembly\u003C/a> order puts sourcing and assembly under one purchase order. Received parts are checked against an agreed incoming inspection plan before they are released to the assembly lot, as described on the \u003Ca href=\"/en/pcba/incoming-quality-control\">incoming quality control\u003C/a> page.\u003C/p>\n\u003Cp>Electrical, firmware, regulatory, and system-level validation of any alternate remains the customer's responsibility.\u003C/p>\n\u003Cp>Relevant standards and references may include:\u003C/p>\n\u003Cul>\n\u003Cli>IEEE 315 / ASME Y14.44: reference designations for electrical and electronic parts\u003C/li>\n\u003Cli>IPC-7351: land patterns for surface mount components\u003C/li>\n\u003Cli>J-STD-033: handling of moisture-sensitive surface mount devices\u003C/li>\n\u003Cli>ANSI/ESD S20.20: electrostatic discharge control programs\u003C/li>\n\u003C/ul>\n\u003C!-- faq:start -->\n\u003Ch2 id=\"frequently-asked-questions\" data-anchor-en=\"frequently-asked-questions\">Frequently asked questions\u003C/h2>\n\u003Ch3 id=\"what-are-the-main-components-of-a-circuit-board\" data-anchor-en=\"what-are-the-main-components-of-a-circuit-board\">What are the main components of a circuit board?\u003C/h3>\n\u003Cp>The main components are resistors, capacitors, inductors, diodes, transistors, integrated circuits, crystals or oscillators, and connectors, along with switches, fuses, relays, and transformers on some boards. The bare PCB itself provides the copper connections between them.\u003C/p>\n\u003Ch3 id=\"how-do-i-identify-components-on-a-circuit-board\" data-anchor-en=\"how-do-i-identify-components-on-a-circuit-board\">How do I identify components on a circuit board?\u003C/h3>\n\u003Cp>Start with the reference designator printed next to the part, which gives the type (R, C, U, Q and so on). Then use the package shape and part markings to narrow it down, and confirm against the BOM, schematic, or manufacturer marking tables.\u003C/p>\n\u003Ch3 id=\"what-do-the-letters-on-a-circuit-board-mean\" data-anchor-en=\"what-do-the-letters-on-a-circuit-board-mean\">What do the letters on a circuit board mean?\u003C/h3>\n\u003Cp>They are reference designators. The letter prefix shows the component type, such as R for resistor, C for capacitor, D for diode, Q for transistor, U for integrated circuit, and J for connector. The number identifies that specific part in the schematic and BOM.\u003C/p>\n\u003Ch3 id=\"why-do-some-components-on-a-pcb-have-no-markings\" data-anchor-en=\"why-do-some-components-on-a-pcb-have-no-markings\">Why do some components on a PCB have no markings?\u003C/h3>\n\u003Cp>Small chip capacitors and many small passives are too small to print on, or the manufacturer does not mark them. Their values are defined only in the BOM and design files, so measure them out of circuit or ask for the design data.\u003C/p>\n\u003Ch3 id=\"how-do-i-identify-smd-components\" data-anchor-en=\"how-do-i-identify-smd-components\">How do I identify SMD components?\u003C/h3>\n\u003Cp>Look at the package first: two-terminal chips are passives, three-lead SOT parts are usually transistors or small regulators, and leaded or leadless multi-pin packages are ICs. Then read the top marking and look it up in the manufacturer's marking table for that package, or confirm the part against the BOM by reference designator.\u003C/p>\n\u003Ch3 id=\"what-should-a-bom-include-for-component-sourcing\" data-anchor-en=\"what-should-a-bom-include-for-component-sourcing\">What should a BOM include for component sourcing?\u003C/h3>\n\u003Cp>Each line should include reference designators, quantity, manufacturer, manufacturer part number, a description with key ratings and package, approved alternates or do-not-substitute flags, and DNP status. Add volume, required date, and traceability needs for the quote.\u003C/p>\n\u003C!-- faq:end -->\n\n\u003Ch2 id=\"bom-rfq-checklist\" data-anchor-en=\"bom-rfq-checklist\">BOM RFQ checklist\u003C/h2>\n\u003Cul>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Manufacturer part number (MPN) unique per reference designator\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Tier-1 alternate MPN listed for each line, or flagged do-not-substitute\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Tier-2 and tier-3 alternates listed if known\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Reference designators in standard form (R1, C2, U3) matching placement file\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Minimum order quantity (MOQ) and multiple-per-qty stated per line\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> RoHS and REACH declarations confirmed or required\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Datasheet linked or attached for each IC and active part\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Lifecycle status: active, NRND, or EOL; last-buy date if applicable\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Moisture sensitivity level (MSL) stated per line\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Stock allocation or reserved quantity confirmed\u003C/li>\n\u003Cli>\u003Cinput disabled=\"\" type=\"checkbox\"> Consignment or third-party procurement party named\u003C/li>\n\u003C/ul>\n\u003Cp>Use this when you request a quote for component sourcing.\u003C/p>\n\u003Cdiv data-component=\"BlogQuickQuoteInline\">\u003C/div>\n\n\u003Ch2 id=\"name-the-part-then-source-it\" data-anchor-en=\"name-the-part-then-source-it\">Name the part, then source it\u003C/h2>\n\u003Cp>Identifying circuit board components correctly is the first step in repair, redesign, and procurement. Use the designator and package to name the part, confirm it in the design data, and record the exact manufacturer part number. A BOM built that way can be quoted and bought without guessing.\u003C/p>\n\n\u003Csection class=\"related-links\" aria-label=\"Related\">\u003Ch3>Related links\u003C/h3>\u003Cul>\u003Cli>\u003Ca href=\"/en/blog/smt-component-polarity\">SMT component polarity guide\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/en/blog/what-is-smt\">SMT guide\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/en/pcba/bga-qfn-fine-pitch\">BGA and fine-pitch assembly\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/en/blog/how-to-avoid-bom-mismatch-and-substitution-risk-in-turnkey-pcba\">BOM mismatch and substitution risk guide\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/en/blog/centroid-file-basics\">placement (centroid) file\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/en/blog/assembly-bom-best-practices\">assembly BOM guide\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/en/tools/bom-viewer\">online BOM viewer\u003C/a>\u003C/li>\u003C/ul>\u003C/section>",[14,15,16,17,18,19,20],"Circuit Board Components","PCB Components","Component Identification","Reference Designators","SMD Components","BOM","Component Sourcing","pcb-components-guide",{"blog":23,"breadcrumb":32,"faq":46},{"@context":24,"@type":25,"headline":4,"description":5,"image":8,"url":26,"datePublished":6,"dateModified":6,"timeRequired":11,"keywords":27,"articleSection":7,"author":28,"publisher":31},"https://schema.org","BlogPosting","https://aptpcb.com/en/blog/pcb-components-guide","Circuit Board Components, PCB Components, Component Identification, Reference Designators, SMD Components, BOM, Component Sourcing",{"@type":29,"name":30},"Organization","APTPCB",{"@type":29,"name":30},{"@context":24,"@type":33,"itemListElement":34},"BreadcrumbList",[35,40,44],{"@type":36,"position":37,"name":38,"item":39},"ListItem",1,"Home","https://aptpcb.com/",{"@type":36,"position":41,"name":42,"item":43},2,"Blog","https://aptpcb.com/en/blog",{"@type":36,"position":45,"name":21,"item":26},3,{"@context":24,"@type":47,"mainEntity":48},"FAQPage",[49,55,59,63,67,71],{"@type":50,"name":51,"acceptedAnswer":52},"Question","What are the main components of a circuit board?",{"@type":53,"text":54},"Answer","The main components are resistors, capacitors, inductors, diodes, transistors, integrated circuits, crystals or oscillators, and connectors, along with switches, fuses, relays, and transformers on some boards. The bare PCB itself provides the copper connections between them.",{"@type":50,"name":56,"acceptedAnswer":57},"How do I identify components on a circuit board?",{"@type":53,"text":58},"Start with the reference designator printed next to the part, which gives the type (R, C, U, Q and so on). Then use the package shape and part markings to narrow it down, and confirm against the BOM, schematic, or manufacturer marking tables.",{"@type":50,"name":60,"acceptedAnswer":61},"What do the letters on a circuit board mean?",{"@type":53,"text":62},"They are reference designators. The letter prefix shows the component type, such as R for resistor, C for capacitor, D for diode, Q for transistor, U for integrated circuit, and J for connector. The number identifies that specific part in the schematic and BOM.",{"@type":50,"name":64,"acceptedAnswer":65},"Why do some components on a PCB have no markings?",{"@type":53,"text":66},"Small chip capacitors and many small passives are too small to print on, or the manufacturer does not mark them. Their values are defined only in the BOM and design files, so measure them out of circuit or ask for the design data.",{"@type":50,"name":68,"acceptedAnswer":69},"How do I identify SMD components?",{"@type":53,"text":70},"Look at the package first: two-terminal chips are passives, three-lead SOT parts are usually transistors or small regulators, and leaded or leadless multi-pin packages are ICs. Then read the top marking and look it up in the manufacturer's marking table for that package, or confirm the part against the BOM by reference designator.",{"@type":50,"name":72,"acceptedAnswer":73},"What should a BOM include for component sourcing?",{"@type":53,"text":74},"Each line should include reference designators, quantity, manufacturer, manufacturer part number, a description with key ratings and package, approved alternates or do-not-substitute flags, and DNP status. Add volume, required date, and traceability needs for the quote.",{"pcbManufacturingColumns":76,"capabilityColumns":201,"resourceColumns":232,"pcbaColumns":273},[77,125,154,183],{"heading":78,"links":79},"PCB Product Families",[80,83,86,89,92,95,98,101,104,107,110,113,116,119,122],{"label":81,"path":82},"FR-4 PCB","/pcb/fr4-pcb",{"label":84,"path":85},"High-Speed PCB","/pcb/high-speed-pcb",{"label":87,"path":88},"Multilayer PCB","/pcb/multilayer-pcb",{"label":90,"path":91},"HDI PCB","/pcb/hdi-pcb",{"label":93,"path":94},"Flexible PCB","/pcb/flex-pcb",{"label":96,"path":97},"Rigid Flex PCB","/pcb/rigid-flex-pcb",{"label":99,"path":100},"Ceramic PCB","/pcb/ceramic-pcb",{"label":102,"path":103},"Heavy Copper PCB","/pcb/heavy-copper-pcb",{"label":105,"path":106},"High Thermal PCB","/pcb/high-thermal-pcb",{"label":108,"path":109},"Antenna PCB","/pcb/antenna-pcb",{"label":111,"path":112},"High Frequency PCB","/pcb/high-frequency-pcb",{"label":114,"path":115},"Microwave 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(Standard / High-Layer / Flex / Rigid-Flex / Aluminum)","/pcb/pcb-stack-up",{"label":196,"path":197},"Profiles (Milling / V-Scoring / Depaneling)","/pcb/pcb-profiling",{"label":199,"path":200},"Quality & Inspection (AOI + X-Ray / Flying Probe / PCB DFM Check)","/pcb/pcb-quality",[202,207,212,217,222,227],{"links":203},[204],{"label":205,"path":206},"Rigid PCB Capability","/capabilities/rigid-pcb",{"links":208},[209],{"label":210,"path":211},"Rigid-Flex Capability","/capabilities/rigid-flex-pcb",{"links":213},[214],{"label":215,"path":216},"Flex PCB Capability","/capabilities/flex-pcb",{"links":218},[219],{"label":220,"path":221},"HDI PCB Capability","/capabilities/hdi-pcb",{"links":223},[224],{"label":225,"path":226},"Metal PCB Capability","/capabilities/metal-pcb",{"links":228},[229],{"label":230,"path":231},"Ceramic PCB Capability","/capabilities/ceramic-pcb",[233,244,265],{"heading":234,"links":235},"Downloads",[236,239,242],{"label":237,"path":238},"Materials Datasheet / Processing 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