3D Electronic Integration
Seamless interconnection of rigid component areas with flexible sections for dynamic bending and intricate routing.
Rigid-Flex PCB Capability
Rigid-Flex PCB Manufacturing Capabilities
APTPCB specializes in high-quality rigid-flex PCB solutions enabling compact, reliable 3D electronic integration for automotive, industrial, medical, aerospace, and high-end consumer products. We combine FR-4 or low-loss rigid sections with adhesiveless polyimide flex cores, delivering exceptional reliability with comprehensive engineering support from concept to production.
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Rigid-Flex PCB Manufacturing Capabilities – Detailed Specifications
| Item | Capability | Notes |
|---|---|---|
| Max Layer Count (Overall) | Up to 32 Layers | Typically includes up to 8 flexible layers within the rigid stack |
| Min Layer Count (Overall) | 1 Layer Flex + 1 Layer Rigid (2L overall) | Minimum configuration |
| Inner Layer Min Trace/Space | 2.5/2.5 mil (0.0635 mm) | Tighter possible after DFM review |
| Outer Layer Min Trace/Space | 2.5/2.5 mil (0.0635 mm) | Tighter possible after DFM review |
| Inner Layer Max Copper | 3 oz (105 µm) | Up to 10 oz in specific rigid areas |
| Outer Layer Max Copper | 3 oz (105 µm) | Up to 10 oz in specific rigid areas |
| Min Flex Core Thickness | 0.001″ (0.025 mm) | For adhesiveless polyimide film |
| Min Finished Mechanical Drill | 0.0079″ (0.20 mm) | Precision drilling |
| Min Finished Laser Drill (Microvia) | 0.003″ (0.075 mm) | For HDI and fine-pitch applications |
| Min Finished Hole Size | 0.006″ (0.15 mm) | Minimum hole diameter |
| Max Mechanical Drill Aspect Ratio | 12:1 | Max 15:1 for specialized designs |
| Max Blind Via Aspect Ratio | 0.75:1 | Blind via specification |
| Max Laser Drill Aspect Ratio | 1:1 | Typically for microvias through single dielectric |
| Press Fit Hole Tolerance | ±0.05 mm | Press-fit precision |
| PTH Tolerance | ±0.075 mm | Plated through-hole tolerance |
| NPTH Tolerance | ±0.05 mm | Non-plated through-hole tolerance |
| Countersink Tolerance | ±0.15 mm | Countersink precision |
| Board Thickness (Overall) | 0.4–3.2 mm | Including rigid and flex areas |
| Board Thickness Tolerance (< 1.0 mm) | ±0.10 mm | Tight tolerance for thin boards |
| Board Thickness Tolerance (≥ 1.0 mm) | ±10% | Standard tolerance for thicker boards |
| Impedance Tolerance (Single-Ended) | ±5 Ω (≤50 Ω), ±7% (>50 Ω) | Tighter with dedicated test coupons |
| Impedance Tolerance (Differential) | ±5 Ω (≤50 Ω), ±7% (>50 Ω) | Tighter with dedicated test coupons |
| Min Board Size | 5×5 mm | Panelized designs |
| Max Panel Size | 18×24 inch (457×610 mm) | For efficient production |
| Contour Tolerance | ±0.08 mm | For mechanical routing/milling |
| Min BGA Pitch | 0.3 mm (12 mil) | For rigid areas |
| Min SMT Component Size | 01005 (0.4×0.2 mm) | For rigid areas |
| Surface Finishes | ENIG, Gold Finger, Immersion Silver, Immersion Tin, Lead-free HASL, OSP, ENEPIG, Flash Gold | Variety of finishes |
| Gold Fingers / Contact Pads | Bevel 30°/45°, controlled hard-gold thickness, chamfered edge | Edge finger specifications |
| Solder Mask Colors | Green, Black, Blue, Red, Matt Green | Other colors on request |
| Min Solder Mask Clearance | 1.5 mil (0.038 mm) | Solder mask clearance |
| Min Solder Mask Dam | 3 mil (0.076 mm) | Solder dam specification |
| Legend (Silkscreen) Colors | White, Black, Red, Yellow | Other colors on request |
| Min Legend Width / Height | 3.5/20 mil (0.089/0.508 mm) | For fine pitch components |
| Strain Relief Fillet Width | 1.5±0.5 mm | Crucial for transition areas |
| Bow & Twist | ≤0.5% (typical in rigid areas) | Per IPC-A-600/6013 |
| Via Types | Through-hole, Blind, Buried, Microvias (Laser), Via-in-Pad (VIP) | Comprehensive support |
| Filled Vias | Conductive (copper-filled), Non-Conductive | For thermal management |
| Sequential Laminations | Up to 2 sequential laminations | For advanced HDI structures |
| Design Rule Check (DRC) | Comprehensive DFM review by engineering team | Free service |
| Electrical Test | 100% E-test (Flying Probe or Fixture Test) | Ensuring continuity and isolation |
| Quality Standards | IPC-A-600 Class 2/Class 3 | Industry-leading standards |
| Certifications | ISO 9001:2015, UL Certified | RoHS, IATF 16949, REACH compliant |
| Production Types | Prototypes, Small/Medium Batches, Volume Production | Flexible production scale |
| Typical Lead Time | 7-20 working days | Varies by complexity and quantity |
Comprehensive Rigid-Flex PCB Assembly Services
APTPCB offers integrated rigid-flex PCB assembly to deliver complete, tested products.
| Item | Capability | Notes |
|---|---|---|
| Min SMT Component Size | 01005 (0.4×0.2 mm) | For high-density component placement on rigid areas |
| Min BGA / CSP Pitch | 0.3 mm (12 mil) | Accurate placement for fine-pitch packages |
| Max Component Height | Up to 25 mm (top/bottom side) | Accommodating various component profiles |
| Assembly Technologies | SMT, THT, Mixed Assembly | Full range of assembly options |
| Soldering Processes | Lead-free Reflow, Wave Soldering (THT in rigid areas), Selective Soldering | Optimized processes |
| Inspection & Testing | AOI, X-Ray Inspection, ICT, FCT | Ensuring high quality and functionality |
| Conformal Coating | Available on request | For environmental protection |
| Component Sourcing | Full Turnkey (Component Procurement & Assembly) | Streamlined supply chain |
Why Choose APTPCB for Rigid-Flex PCB Solutions
Rigid-flex PCBs represent the pinnacle of electronic packaging, allowing seamless 3D interconnection of rigid and flexible sections. APTPCB possesses deep expertise in rigid-flex design complexities.
Assembly Optimization
Significantly reduces assembly steps, saves critical space, and improves signal integrity.
Enhanced Reliability
Exceptional reliability in environments subject to vibration and shock, eliminating traditional cables and connectors.
Expert Engineering Support
Deep expertise in bending radius, copper balancing, material selection, stiffener design, and stack-up optimization.
Early Stage Collaboration
Work from early stages to evaluate critical factors and transform mechanical concepts into robust, manufacturable designs.
Comprehensive DFM Review
Free design-for-manufacturing review to optimize manufacturability, reliability, and cost-effectiveness.
Rigid-Flex PCB Manufacturing Process
- 1
Design Review & Stack-up Planning
Collect rigid/flex stackups, copper weights, impedance nets, and flex zones. Define bend radius and stiffener locations.
- 2
Design for Bend Optimization
Balance copper in transition zones, specify hatched planes, add teardrops, and run ΔR simulations.
- 3
Coverlay & Stiffener Tooling
Laser-define coverlay windows, route stiffeners, and plan lamination layups with bonding films.
- 4
Sequential Lamination Build
Press rigid sections, laminate flex cores, and capture temperature/pressure traces for each cycle.
- 5
Surface Finish & Assembly Prep
Apply surface finish, add stiffeners, route outline, and perform electrical/ICT tests.
- 6
Quality Assurance & Validation
Cross-sections, ΔR plots, and flex-cycle logs accompany every Class 3 release.
Comprehensive Rigid-Flex Engineering Support
Our engineering team provides expert guidance throughout your rigid-flex PCB development lifecycle.
Material Selection & Stack-up Design
Choosing suitable polyimide thicknesses, adhesive types, and copper foils (RA vs. ED copper) for both rigid and flexible areas.
Safe Bend Areas & Radii Definition
Ensuring optimal flexure without compromising reliability with bend radius ≥10× for dynamic zones.
Controlled Impedance Design
Achieving precise signal integrity in all regions with ±5 Ω or ±7% tolerance.
Stiffener & Connector Solutions
Tailoring designs for robust assembly and performance with FR-4, aluminum, or polyimide stiffeners.
Rigid-Flex PCB Applications
Rigid-flex PCBs enable innovative 3D electronic integration across multiple industries.
Automotive Electronics
HMI systems, steering wheel controls, infotainment with rigid backplane and flex interconnects.
Industrial Control
Control systems and equipment requiring compact 3D integration and vibration resistance.
Medical Devices
Wearable medical devices with dynamic flex tails and ≥100k flex cycles for reliability.
Aerospace & Defense
Multi-hinged harness replacements with 40-g shock and -55↔125 °C thermal cycling.
Consumer Electronics
Camera and imaging modules with rigid core hosting optics and flex arms for sensors.
High-End Products
Premium consumer products requiring innovative 3D packaging and space optimization.
Design for Manufacturability (DFM) Support
Our engineering team provides comprehensive DFM and DFA guidance to optimize your rigid-flex PCB designs.
Early Engagement
Partner with APTPCB early in your development cycle to mitigate risks and accelerate time-to-market.
3D Model & Mechanical Analysis
Share 3D models, mechanical constraints, expected bend angles, and lifetime requirements for detailed analysis.
Transition Zone Governance
Define overlap zones, keep copper balanced, and use fillets to prevent stress fractures in transition areas.
Reliability Validation
Flex-cycle testing, cross-sections, ΔR measurements, and comprehensive documentation for Class 3 products.
Frequently Asked Questions
What is the minimum bend radius for rigid-flex PCBs?
The minimum bend radius is typically ≥10× the flex core thickness. For example, a 0.1 mm flex core requires a minimum bend radius of 1 mm. This ensures the copper traces and dielectric layers don't crack under repeated flexing.
How many flex cycles can a rigid-flex PCB withstand?
APTPCB's rigid-flex PCBs are tested for ≥100k dynamic flex cycles at the specified bend radius with ΔR (resistance change) tracking. Actual performance depends on material selection, copper weight, and design geometry.
What materials are used for the flex core?
We use adhesiveless polyimide film (typically 0.025–0.125 mm thick) as the flex core. This provides excellent flexibility, chemical resistance, and reliability without the brittleness of adhesive-bonded constructions.
Can rigid-flex PCBs replace traditional cable harnesses?
Yes, rigid-flex designs eliminate traditional connectors and cables, reducing assembly steps, improving signal integrity, and enhancing reliability in vibration-prone environments. This is especially valuable in aerospace, automotive, and medical applications.
What is the typical lead time for rigid-flex PCBs?
Lead times typically range from 7–20 working days depending on complexity, layer count, and production volume. Expedited options are available for urgent prototypes.
How do you ensure impedance control in rigid-flex designs?
We maintain ±5 Ω (≤50 Ω) or ±7% (>50 Ω) tolerance through careful dielectric thickness control, trace geometry optimization, and validation with TDR coupons. Impedance is controlled in both rigid and flex regions.
What surface finishes are available for rigid-flex PCBs?
We offer ENIG, gold fingers, immersion silver, immersion tin, lead-free HASL, OSP, ENEPIG, and flash gold. Surface finish selection depends on your assembly process and environmental requirements.
Can you handle high-layer-count rigid-flex designs?
Yes, we support up to 32 layers overall, typically including up to 8 flexible layers within the rigid stack. Complex stackups require early DFM collaboration to optimize manufacturability and cost.
Partner with APTPCB for Expert Rigid-Flex PCB Development
Rigid-flex designs are deeply intertwined with mechanical enclosures, thermal management, and final product assembly. Our collaborative approach transforms your vision into a manufacturable, high-performance, and cost-effective rigid-flex PCB, reducing redesign cycles and ensuring long-term product reliability.