[{"data":1,"prerenderedAt":595},["ShallowReactive",2],{"header-nav-en":3,"material-controlled-impedance-stackups-en":332,"resources-index":592},{"pcbManufacturingColumns":4,"capabilityColumns":129,"resourceColumns":160,"pcbaColumns":201},[5,53,82,111],{"heading":6,"links":7},"PCB Product Families",[8,11,14,17,20,23,26,29,32,35,38,41,44,47,50],{"label":9,"path":10},"FR-4 PCB","/pcb/fr4-pcb",{"label":12,"path":13},"High-Speed PCB","/pcb/high-speed-pcb",{"label":15,"path":16},"Multilayer PCB","/pcb/multilayer-pcb",{"label":18,"path":19},"HDI PCB","/pcb/hdi-pcb",{"label":21,"path":22},"Flexible PCB","/pcb/flex-pcb",{"label":24,"path":25},"Rigid Flex PCB","/pcb/rigid-flex-pcb",{"label":27,"path":28},"Ceramic PCB","/pcb/ceramic-pcb",{"label":30,"path":31},"Heavy Copper PCB","/pcb/heavy-copper-pcb",{"label":33,"path":34},"High Thermal PCB","/pcb/high-thermal-pcb",{"label":36,"path":37},"Antenna PCB","/pcb/antenna-pcb",{"label":39,"path":40},"High Frequency PCB","/pcb/high-frequency-pcb",{"label":42,"path":43},"Microwave PCB","/pcb/microwave-pcb",{"label":45,"path":46},"Metal Core PCB","/pcb/metal-core-pcb",{"label":48,"path":49},"High-Tg PCB","/pcb/high-tg-pcb",{"label":51,"path":52},"Backplane PCB","/pcb/backplane-pcb",{"sections":54},[55],{"heading":56,"links":57},"RF & Materials",[58,61,64,67,70,73,76,79],{"label":59,"path":60},"Rogers PCB","/materials/rf-rogers",{"label":62,"path":63},"Taconic PCB","/materials/taconic-pcb",{"label":65,"path":66},"Teflon PCB","/materials/teflon-pcb",{"label":68,"path":69},"Arlon PCB","/materials/arlon-pcb",{"label":71,"path":72},"Megtron PCB","/materials/megtron-pcb",{"label":74,"path":75},"ISOLA PCB","/materials/isola-pcb",{"label":77,"path":78},"Spread Glass FR-4","/materials/spread-glass-fr4",{"label":80,"path":81},"Impedance Control","/pcb/pcb-impedance-control",{"sections":83},[84],{"heading":85,"links":86},"Manufacturing / Stackups",[87,90,93,96,99,102,105,108],{"label":88,"path":89},"Quickturn Prototypes","/pcb/quick-turn-pcb",{"label":91,"path":92},"NPI & Small Batch (PCB)","/pcb/npi-small-batch-pcb-manufacturing",{"label":94,"path":95},"High-Volume Production","/pcb/mass-production-pcb-manufacturing",{"label":97,"path":98},"High Layer Count PCB","/pcb/high-layer-count-pcb",{"label":100,"path":101},"PCB Fabrication Process","/pcb/pcb-fabrication-process",{"label":103,"path":104},"Advanced PCB Manufacturing","/pcb/advanced-pcb-manufacturing",{"label":106,"path":107},"Special PCB Manufacturing","/pcb/special-pcb-manufacturing",{"label":109,"path":110},"Multi-Layer Laminated Structure","/pcb/multi-layer-laminated-structure",{"heading":112,"links":113},"Specialties & Resources",[114,117,120,123,126],{"label":115,"path":116},"PCB Surface Finishes (ENIG / ENEPIG / HASL / OSP / Immersion)","/pcb/pcb-surface-finishes",{"label":118,"path":119},"Drilling & Vias (Blind / Buried / Via-in-Pad / Backdrill / Half Hole)","/pcb/pcb-drilling",{"label":121,"path":122},"PCB Stackup (Standard / High-Layer / Flex / Rigid-Flex / Aluminum)","/pcb/pcb-stack-up",{"label":124,"path":125},"Profiles (Milling / V-Scoring / Depaneling)","/pcb/pcb-profiling",{"label":127,"path":128},"Quality & Inspection (AOI + X-Ray / Flying Probe / PCB DFM Check)","/pcb/pcb-quality",[130,135,140,145,150,155],{"links":131},[132],{"label":133,"path":134},"Rigid PCB Capability","/capabilities/rigid-pcb",{"links":136},[137],{"label":138,"path":139},"Rigid-Flex Capability","/capabilities/rigid-flex-pcb",{"links":141},[142],{"label":143,"path":144},"Flex PCB Capability","/capabilities/flex-pcb",{"links":146},[147],{"label":148,"path":149},"HDI PCB Capability","/capabilities/hdi-pcb",{"links":151},[152],{"label":153,"path":154},"Metal PCB Capability","/capabilities/metal-pcb",{"links":156},[157],{"label":158,"path":159},"Ceramic PCB Capability","/capabilities/ceramic-pcb",[161,171,192],{"heading":162,"links":163},"Downloads",[164,167,170],{"label":165,"path":166},"Materials Datasheet / Processing Notes","/resources/downloads-materials",{"label":168,"path":169},"PCB DFM Guidelines","/resources/dfm-guidelines",{"label":109,"path":110},{"heading":172,"links":173},"Tools",[174,177,180,183,186,189],{"label":175,"path":176},"Gerber Viewer","/tools/gerber-viewer",{"label":178,"path":179},"PCB Viewer","/tools/pcb-viewer",{"label":181,"path":182},"BOM Viewer","/tools/bom-viewer",{"label":184,"path":185},"3D Viewer","/tools/3d-viewer",{"label":187,"path":188},"Circuit Simulator","/tools/circuit-simulator",{"label":190,"path":191},"Impedance Calculator","/tools/impedance-calculator",{"heading":193,"links":194},"FAQ & Blog",[195,198],{"label":196,"path":197},"FAQ","/resources/faq",{"label":199,"path":200},"Blog","/blog",[202,232,262,295],{"heading":203,"links":204},"Core Services",[205,208,211,214,217,220,223,226,229],{"label":206,"path":207},"Turnkey PCB Assembly","/pcba/turnkey-assembly",{"label":209,"path":210},"NPI & Small Batch PCB Assembly","/pcba/npi-assembly",{"label":212,"path":213},"Mass Production PCB Assembly","/pcba/mass-production",{"label":215,"path":216},"Flex & Rigid-Flex PCB Assembly","/pcba/flex-rigid-flex",{"label":218,"path":219},"SMT & Through-Hole Assembly","/pcba/smt-tht",{"label":221,"path":222},"BGA PCB Assembly","/pcba/bga-qfn-fine-pitch",{"label":224,"path":225},"Components & BOM Management","/pcba/components-bom",{"label":227,"path":228},"Box Build Assembly","/pcba/box-build-assembly",{"label":230,"path":231},"PCB Assembly Testing & Quality","/pcba/testing-quality",{"heading":233,"links":234},"Supporting Services",[235,238,241,244,247,250,253,256,259],{"label":236,"path":237},"Every Support Touchpoint","/pcba/support-services",{"label":239,"path":240},"Stencil Lab","/pcba/pcb-stencil",{"label":242,"path":243},"Components Sourcing","/pcba/component-sourcing",{"label":245,"path":246},"IC Programming","/pcba/ic-programming",{"label":248,"path":249},"Conformal Coating","/pcba/pcb-conformal-coating",{"label":251,"path":252},"Selective Soldering","/pcba/pcb-selective-soldering",{"label":254,"path":255},"BGA Reballing","/pcba/bga-reballing",{"label":257,"path":258},"Cable Assembly","/pcba/cable-assembly",{"label":260,"path":261},"Wire Harness","/pcba/harness-assembly",{"heading":263,"links":264},"Quality & Testing",[265,268,271,274,277,280,283,286,289,292],{"label":266,"path":267},"Quality Inspection","/pcba/quality-system",{"label":269,"path":270},"First Article Inspection (FAI)","/pcba/first-article-inspection",{"label":272,"path":273},"Solder Paste Inspection (SPI)","/pcba/spi-inspection",{"label":275,"path":276},"AOI Optical Inspection","/pcba/aoi-inspection",{"label":278,"path":279},"X-Ray / CT Inspection","/pcba/xray-inspection",{"label":281,"path":282},"ICT In-Circuit Testing","/pcba/ict-test",{"label":284,"path":285},"Flying Probe Testing","/pcba/flying-probe-testing",{"label":287,"path":288},"FCT / Functional Testing","/pcba/fct-test",{"label":290,"path":291},"Final Inspection & Packing","/pcba/final-quality-inspection",{"label":293,"path":294},"Incoming Quality Control","/pcba/incoming-quality-control",{"heading":296,"linkClass":297,"links":298},"Industry Applications (Entry)","text-nowrap",[299,302,305,308,311,314,317,320,323,326,329],{"label":300,"path":301},"Server / Data Center","/industries/server-data-center-pcb",{"label":303,"path":304},"Automotive / EV","/industries/automotive-electronics-pcb",{"label":306,"path":307},"Medical","/industries/medical-pcb",{"label":309,"path":310},"Telecom / 5G","/industries/communication-equipment-pcb",{"label":312,"path":313},"Aerospace & Defense","/industries/aerospace-defense-pcb",{"label":315,"path":316},"Drone / UAV","/industries/drone-uav-pcb",{"label":318,"path":319},"Industrial Control & Automation","/industries/industrial-control-pcb",{"label":321,"path":322},"Power & New Energy","/industries/power-energy-pcb",{"label":324,"path":325},"Robotics & Automation","/industries/robotics-pcb",{"label":327,"path":328},"Security / Security Equipment","/industries/security-equipment-pcb",{"label":330,"path":331},"PCB Industry Overview →","/pcb-industry-solutions",{"payload":333,"localeUsed":591},{"hero":334,"trustBar":354,"seo":364,"sections":368},{"eyebrow":335,"title":336,"description":337,"highlights":338,"primaryCta":348,"secondaryCta":351},"Materials","Controlled Impedance Stackups","Reference stackups, tolerances, and CSV templates for rapid impedance planning across FR-4, low-loss, and hybrid builds.",[339,342,345],{"label":340,"value":341},"Layer Counts","2L / 4L / 6L / 8L / 10L",{"label":343,"value":344},"Tolerance","+/-5% - +/-10% Zo",{"label":346,"value":347},"Templates","CSV ready",{"label":349,"to":350},"Request Stackup Review","/quote",{"label":352,"to":353},"Browse Templates","/resources/stackup-templates#downloads",[355,358,361],{"label":356,"value":357},"2-10 Layers","Standard & HDI",{"label":359,"value":360},"Hybrid","Rogers + FR-4",{"label":362,"value":363},"Coupons","TDR / VNA",{"title":365,"description":366,"serviceType":367},"Controlled Impedance Stackups | HILPCB","Reference stackups for 2/4/6/8/10 layers with typical impedance structures, tolerances, and downloadable CSV templates.","Material",[369,404,431,492,509,532,567,581],{"id":370,"navLabel":371,"type":372,"title":373,"columns":374,"rows":378,"footnote":403},"specs","Specifications","table","Stackup & Impedance Ranges",[375,376,377],"Structure","Typical","Notes",[379,383,387,391,395,399],[380,381,382],"2-Layer FR-4","SE 50 Ohm microstrip (+/-10%)","Baseline proto / power planes",[384,385,386],"4-Layer FR-4","SE 50 Ohm microstrip, Diff 100 Ohm stripline (+/-10%)","Standard digital designs",[388,389,390],"6-Layer Low-Loss","SE 50 Ohm stripline, Diff 100 Ohm dual stripline (+/-5%)","10-25 Gbps signal integrity",[392,393,394],"6-Layer HDI","Microvia build-up + VIPPO (+/-5%)","Compact routing with stacked vias",[396,397,398],"8-Layer Hybrid","Rogers microstrip + FR-4 core stripline (+/-5%)","RF front end with digital core",[400,401,402],"10-Layer Backplane","SE/Diff stripline (+/-5%)","Thick panels with backdrill","Tolerances assume paired coupon design and +/-5% to +/-10% acceptance per IPC-TM-650; confirm with program targets.",{"id":405,"navLabel":162,"type":406,"title":407,"autoload":408,"fromResources":409,"cards":414},"downloads","cardGrid","Downloads & Templates",true,[410,411,412,413],"stackup","impedance","coupon","high-speed",[415,421,426],{"title":416,"description":417,"cta":418},"Stackup Templates Bundle","4/6/8-layer CSV pack for rapid edits.",{"label":419,"to":420},"Download","/resources/stackup-templates-4-6-8-layer.csv",{"title":422,"description":423,"cta":424},"TDR Coupon Pack","SE 50 Ohm & Diff 100 Ohm coupon geometries.",{"label":419,"to":425},"/resources/coupons/tdr-coupon-pack.csv",{"title":427,"description":428,"cta":429},"Impedance Examples","Reference widths for common materials.",{"label":419,"to":430},"/resources/impedance-examples.csv",{"id":432,"navLabel":433,"type":406,"title":434,"cards":435},"stackups","Stackups","Reference Stackups",[436,444,451,457,464,468,474,481,487],{"title":437,"description":438,"bullets":439,"cta":441},"2-Layer Standard FR-4","Layers: 2 | Thickness: 1.6 mm",[440],"SE 50 Ohm - microstrip (+/-10%)",{"label":442,"to":443},"View CSV","/resources/stackup-templates-2-layer.csv",{"title":445,"description":446,"bullets":447,"cta":449},"4-Layer Standard FR-4","Layers: 4 | Thickness: 1.6 mm",[440,448],"Diff 100 Ohm - stripline (+/-10%)",{"label":442,"to":450},"/resources/stackup-templates-4-layer.csv",{"title":452,"description":446,"bullets":453,"cta":456},"4-Layer Low-Loss",[454,455],"SE 50 Ohm - microstrip (+/-5%)","Diff 100 Ohm - stripline (+/-5%)",{"label":442,"to":450},{"title":388,"description":458,"bullets":459,"cta":462},"Layers: 6 | Thickness: 1.6 mm",[460,461],"SE 50 Ohm - stripline (+/-5%)","Diff 100 Ohm - dual stripline (+/-5%)",{"label":442,"to":463},"/resources/stackup-templates-6-layer.csv",{"title":465,"description":458,"bullets":466,"cta":467},"6-Layer HDI Low-Loss",[454,461],{"label":442,"to":463},{"title":469,"description":458,"bullets":470,"cta":473},"6-Layer Hybrid (RO4350B + FR-4)",[471,472],"SE 50 Ohm - microstrip on RO4350B (+/-5%)","Diff 100 Ohm - stripline in FR-4 (+/-5%)",{"label":442,"to":463},{"title":475,"description":476,"bullets":477,"cta":479},"8-Layer Balanced Low-Loss","Layers: 8 | Thickness: 1.6 mm",[478,461],"SE 50 Ohm - microstrip/stripline mix (+/-5%)",{"label":442,"to":480},"/resources/stackup-templates-8-layer.csv",{"title":482,"description":476,"bullets":483,"cta":486},"8-Layer Hybrid (Rogers + FR-4)",[484,485],"SE 50 Ohm - microstrip on Rogers (+/-5%)","Diff 100 Ohm - dual stripline in FR-4 (+/-5%)",{"label":442,"to":480},{"title":488,"description":489,"bullets":490,"cta":491},"10-Layer Backplane-Grade","Layers: 10 | Thickness: 2.4 mm",[460,461],{"label":442,"to":480},{"id":493,"navLabel":494,"type":406,"title":495,"cards":496},"design-process","Design & Process","Design Checklist & Process Controls",[497,503],{"title":498,"bullets":499},"Design Checklist",[500,501,502],"Document target Zo, trace geometry, and coupon locations in the fab drawing.","Specify materials (Dk/Df), copper roughness, and spread glass where skew matters.","Align stackup choice with connector/backdrill strategy and assembly constraints.",{"title":504,"bullets":505},"Process Controls",[506,507,508],"CAM applies width compensation per solver input; offsets tracked in SPC.","Lamination profiles logged per stack to maintain dielectric thickness.","TDR/VNA correlation with coupon acceptance maps attached to each lot.",{"id":510,"navLabel":511,"type":406,"title":512,"cards":513},"applications","Applications","Typical Use Cases",[514,520,526],{"title":515,"bullets":516},"High-Speed Digital",[517,518,519],"25-112 Gbps links with +/-5% Zo control","Backplane, switch, and router line cards","Pairs with backdrill and press-fit windows",{"title":521,"bullets":522},"RF / Hybrid",[523,524,525],"Rogers microstrip launches with FR-4 digital routing","Antenna / PA matching networks","Requires tight material tolerance and stack registration",{"title":527,"bullets":528},"HDI & Compact SoCs",[529,530,531],"Microvia fanout with VIPPO / cavity requirements","High layer-count compute modules","Pairs with sequential lamination control",{"id":533,"navLabel":534,"type":406,"title":535,"cards":536},"insights","Insights","Related Capabilities & Resources",[537,549,561],{"title":538,"links":539},"Capabilities",[540,543,546],{"label":541,"to":542},"Sequential Lamination","/capabilities/sequential-lamination",{"label":544,"to":545},"Backdrill","/capabilities/backdrill",{"label":547,"to":548},"TDR Testing","/capabilities/tdr-testing",{"title":550,"links":551},"Resources",[552,555,558],{"label":553,"to":554},"Stackup Templates","/resources/stackup-templates",{"label":556,"to":557},"Impedance Resources","/resources/impedance",{"label":559,"to":560},"High-Speed Resources","/resources/high-speed",{"title":562,"links":563},"Related Products",[564,565,566],{"label":12,"to":13},{"label":51,"to":52},{"label":18,"to":19},{"id":568,"navLabel":569,"type":568,"title":570,"items":571},"faq","FAQs","Frequently Asked Questions",[572,575,578],{"question":573,"answer":574},"How do I choose the right stackup template?","Start from layer count, impedance targets, and material family. Use the CSV to document dielectric thickness, copper weights, and coupon plan for engineering review.",{"question":576,"answer":577},"What tolerance can I expect on impedance?","Standard programs hold +/-10% on FR-4 baselines; low-loss, hybrid, and high-speed programs run +/-5% with coupon correlation and SPC tracking.",{"question":579,"answer":580},"Can templates be customized for my build?","Yes. Share the CSV with your target stack and we will return a validated stackup with materials, press parameters, and coupon strategy.",{"id":582,"type":583,"title":584,"description":585,"primary":586,"secondary":587,"showInNav":590},"closing-cta","ctaBlock","Ready to validate your stackup?","Send us your impedance targets, materials, and connector plan, we will deliver a tuned stackup and acceptance workflow.",{"label":349,"to":350},{"label":588,"to":589},"Talk to Engineering","/contact",false,"en",{"updated_at":593,"downloads":594},null,[],1776310226141]