[{"data":1,"prerenderedAt":376},["ShallowReactive",2],{"blog-what-is-dielectric-constant-fr":3,"header-nav-fr":47},{"title":4,"description":5,"date":6,"lastUpdated":6,"category":7,"image":8,"readingTime":9,"wordCount":10,"timeRequired":11,"htmlContent":12,"tags":13,"slug":21,"jsonld":22},"Qu'est-ce que la constante diélectrique (Dk) ? Formule, unités et PCB","Constante diélectrique (permittivité relative) expliquée : formule, unités, valeurs pour l'air, le FR-4 et les laminés RF, et impact sur l'impédance.","2026-10-09T00:00:00.000Z","Technologie","/assets/img/pcb/high-frequency/pcb-high-frequency-pcb-hero.webp",4,686,"PT4M","\u003Cp>En électronique rapide et radiofréquence (RF), le substrat isolant soutenant les pistes de cuivre n&#39;est jamais un simple support mécanique neutre. Il agit comme un milieu électromagnétique actif. Le paramètre physique prépondérant régissant la vitesse et l&#39;intégrité des signaux est la \u003Cstrong>constante diélectrique\u003C/strong>, couramment abrégée en \u003Cstrong>Dk\u003C/strong> ou notée $\\varepsilon_r$ (permittivité relative).\u003C/p>\n\u003Cp>Que vous adaptiez une ligne 50 Ω pour un émetteur-récepteur 5G ou calculiez le déphasage sur des paires différentielles, la maîtrise de la constante diélectrique est indispensable pour réussir vos conceptions.\u003C/p>\n\u003Cp>Ce guide technique détaille la définition, la formule, les unités et le comportement en fréquence de Dk, tout en précisant quand migrer du standard FR-4 vers des laminés RF haute performance.\u003C/p>\n\u003Ch2 id=\"points-cles\" data-anchor-en=\"key-takeaways\">Points clés\u003C/h2>\n\u003Cul>\n\u003Cli>\u003Cstrong>Définition :\u003C/strong> La constante diélectrique quantifie la capacité d&#39;un isolant à stocker de l&#39;énergie électrostatique sous l&#39;effet d&#39;un champ électrique par rapport au vide.\u003C/li>\n\u003Cli>\u003Cstrong>Unités et symbole :\u003C/strong> Rapport scalaire de permittivités ($\\varepsilon / \\varepsilon_0$), la constante diélectrique est \u003Cstrong>sans dimension\u003C/strong> et sans unité physique. Symbole : $\\varepsilon_r$ ou Dk.\u003C/li>\n\u003Cli>\u003Cstrong>Vitesse de propagation :\u003C/strong> La vitesse du signal est inversement proportionnelle à la racine de la constante diélectrique effective : $v_p = c / \\sqrt{\\varepsilon_{\\text{eff}}}$. Un Dk élevé ralentit le signal.\u003C/li>\n\u003Cli>\u003Cstrong>Contrôle d&#39;impédance :\u003C/strong> À épaisseur diélectrique égale, un Dk plus élevé requiert des pistes plus étroites pour atteindre 50 Ω.\u003C/li>\n\u003Cli>\u003Cstrong>Stabilité en fréquence :\u003C/strong> Le Dk diminue avec l&#39;augmentation de la fréquence (dispersion). Les laminés RF haut de gamme conservent une courbe plate dans les GHz, contrairement au FR-4 classique.\u003C/li>\n\u003C/ul>\n\u003Cdiv data-component=\"BlogQuickQuoteInline\">\u003C/div>\n\n\u003Ch2 id=\"qu39est-ce-que-la-constante-dielectrique-definition-et-symbole\" data-anchor-en=\"what-is-dielectric-constant-definition-and-symbol\">Qu&#39;est-ce que la constante diélectrique ? Définition et symbole\u003C/h2>\n\u003Cp>Lorsqu&#39;un champ électrique alternatif traverse un diélectrique isolant, les molécules se polarisent et stockent de l&#39;énergie électrostatique. La \u003Cstrong>constante diélectrique\u003C/strong> exprime cette aptitude par rapport au vide. Les normes IPC et les fabricants utilisent quasi exclusivement la désignation \u003Cstrong>Dk\u003C/strong>.\u003C/p>\n\u003Cp>Le vide possède un Dk exact de 1,0. L&#39;air sec affiche environ 1,0006. Les substrats pour circuits imprimés s&#39;échelonnent entre 2,1 (PTFE pur) et 9,8 (céramique d&#39;alumine $\\text{Al}_2\\text{O}_3$), tandis que le FR-4 standard se situe entre 4,0 et 4,6.\u003C/p>\n\u003Ch2 id=\"formule-unites-et-permittivite\" data-anchor-en=\"formula-units-and-permittivity-explained\">Formule, unités et permittivité\u003C/h2>\n\u003Cp>$$\\varepsilon_r = \\frac{\\varepsilon}{\\varepsilon_0}$$\u003C/p>\n\u003Cp>Où $\\varepsilon_r$ est relatif et sans dimension, $\\varepsilon$ est la permittivité absolue en Farads par mètre (F/m), et $\\varepsilon_0 \\approx 8{,}854 \\times 10^{-12} \\text{ F/m}$. Les unités s&#39;annulant au numérateur et au dénominateur, \u003Cstrong>Dk est sans unité\u003C/strong>.\u003C/p>\n\u003Ch2 id=\"tableau-comparatif-des-materiaux-pcb\" data-anchor-en=\"dielectric-constant-units\">Tableau comparatif des matériaux PCB\u003C/h2>\n\u003Ctable>\n\u003Cthead>\n\u003Ctr>\n\u003Cth>Matériau\u003C/th>\n\u003Cth>Référence / Norme\u003C/th>\n\u003Cth align=\"right\">Dk (1 GHz)\u003C/th>\n\u003Cth align=\"right\">Dk (10 GHz)\u003C/th>\n\u003Cth align=\"right\">Tangente de perte (Df @ 10 GHz)\u003C/th>\n\u003Cth>Application principale\u003C/th>\n\u003C/tr>\n\u003C/thead>\n\u003Ctbody>\u003Ctr>\n\u003Ctd>\u003Cstrong>Vide\u003C/strong>\u003C/td>\n\u003Ctd>Référence idéale\u003C/td>\n\u003Ctd align=\"right\">1,0000\u003C/td>\n\u003Ctd align=\"right\">1,0000\u003C/td>\n\u003Ctd align=\"right\">0,0000\u003C/td>\n\u003Ctd>Référence physique\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>\u003Cstrong>Air\u003C/strong>\u003C/td>\n\u003Ctd>Air sec ambiant\u003C/td>\n\u003Ctd align=\"right\">1,0006\u003C/td>\n\u003Ctd align=\"right\">1,0006\u003C/td>\n\u003Ctd align=\"right\">~0,0000\u003C/td>\n\u003Ctd>Lignes coaxiales à air\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>\u003Cstrong>PTFE pur\u003C/strong>\u003C/td>\n\u003Ctd>Fluoropolymère\u003C/td>\n\u003Ctd align=\"right\">2,10\u003C/td>\n\u003Ctd align=\"right\">2,10\u003C/td>\n\u003Ctd align=\"right\">0,0004\u003C/td>\n\u003Ctd>Radar hyperfréquence\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>\u003Cstrong>PTFE tissé\u003C/strong>\u003C/td>\n\u003Ctd>Rogers RT/duroid 5880\u003C/td>\n\u003Ctd align=\"right\">2,20\u003C/td>\n\u003Ctd align=\"right\">2,20\u003C/td>\n\u003Ctd align=\"right\">0,0009\u003C/td>\n\u003Ctd>Télécoms spatiales\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>\u003Cstrong>Hydrocarbure céramique\u003C/strong>\u003C/td>\n\u003Ctd>Rogers RO4350B\u003C/td>\n\u003Ctd align=\"right\">3,66\u003C/td>\n\u003Ctd align=\"right\">3,48\u003C/td>\n\u003Ctd align=\"right\">0,0037\u003C/td>\n\u003Ctd>Stations de base 5G, radar 24 GHz\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>\u003Cstrong>Époxy haute vitesse\u003C/strong>\u003C/td>\n\u003Ctd>Panasonic Megtron 6\u003C/td>\n\u003Ctd align=\"right\">3,71\u003C/td>\n\u003Ctd align=\"right\">3,65\u003C/td>\n\u003Ctd align=\"right\">0,0040\u003C/td>\n\u003Ctd>Fond de panier 112G, PCIe 5.0\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>\u003Cstrong>FR-4 standard\u003C/strong>\u003C/td>\n\u003Ctd>Kingboard KB-6160\u003C/td>\n\u003Ctd align=\"right\">4,40\u003C/td>\n\u003Ctd align=\"right\">4,15\u003C/td>\n\u003Ctd align=\"right\">0,0200\u003C/td>\n\u003Ctd>Électronique grand public, industrie\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>\u003Cstrong>Céramique Al2O3\u003C/strong>\u003C/td>\n\u003Ctd>Alumine pure\u003C/td>\n\u003Ctd align=\"right\">9,80\u003C/td>\n\u003Ctd align=\"right\">9,60\u003C/td>\n\u003Ctd align=\"right\">0,0008\u003C/td>\n\u003Ctd>Modules de puissance, hybrides\u003C/td>\n\u003C/tr>\n\u003C/tbody>\u003C/table>\n\u003Ch2 id=\"quand-quitter-le-fr-4-pour-des-lamines-haute-frequence\" data-anchor-en=\"capacitor-formula-representation\">Quand quitter le FR-4 pour des laminés haute fréquence ?\u003C/h2>\n\u003Cp>Le FR-4 standard atteint ses limites physiques au-delà de 3 GHz ou 10 Gbps. Les pertes diélectriques (Df) et les variations de Dk imposent de migrer vers des technologies de \u003Ca href=\"/fr/pcb/high-frequency-pcb\">PCB haute fréquence\u003C/a> pour sécuriser le diagramme de l&#39;œil et l&#39;atténuation.\u003C/p>\n\u003Chr>\n\u003Ch2 id=\"faq\">Foire aux questions (FAQ)\u003C/h2>\n\n\u003Cp>\u003Cstrong>Q: La constante diélectrique a-t-elle des unités ?\u003C/strong>\nA: Non, il s&#39;agit d&#39;un rapport de permittivités sans dimension physique.\u003C/p>\n\u003Cp>\u003Cstrong>Q: Pourquoi le Dk du FR-4 varie-t-il selon l&#39;empilage ?\u003C/strong>\nA: Le FR-4 associe fibres de verre ($Dk \\approx 6{,}0$) et résine époxy ($Dk \\approx 3{,}2$). La proportion volumique de résine dans les préimprégnés (1080 vs 7628) modifie la valeur globale finale.\u003C/p>\n\n\u003Csection class=\"related-links\" aria-label=\"Related\">\u003Ch3>Related links\u003C/h3>\u003Cul>\u003Cli>\u003Ca href=\"/fr/pcb/high-frequency-pcb\">PCB haute fréquence\u003C/a>\u003C/li>\u003C/ul>\u003C/section>",[14,15,16,17,18,19,20],"Constante diélectrique","Matériaux PCB","Permittivité relative","PCB haute fréquence","Contrôle d'impédance","FR4 Dk","Intégrité du signal","what-is-dielectric-constant",{"blog":23,"breadcrumb":32,"faq":46},{"@context":24,"@type":25,"headline":4,"description":5,"image":8,"url":26,"datePublished":6,"dateModified":6,"timeRequired":11,"keywords":27,"articleSection":7,"author":28,"publisher":31},"https://schema.org","BlogPosting","https://aptpcb.com/fr/blog/what-is-dielectric-constant","Constante diélectrique, Matériaux PCB, Permittivité relative, PCB haute fréquence, Contrôle d'impédance, FR4 Dk, Intégrité du signal",{"@type":29,"name":30},"Organization","APTPCB",{"@type":29,"name":30},{"@context":24,"@type":33,"itemListElement":34},"BreadcrumbList",[35,40,44],{"@type":36,"position":37,"name":38,"item":39},"ListItem",1,"Home","https://aptpcb.com/",{"@type":36,"position":41,"name":42,"item":43},2,"Blog","https://aptpcb.com/fr/blog",{"@type":36,"position":45,"name":21,"item":26},3,null,{"pcbManufacturingColumns":48,"capabilityColumns":171,"resourceColumns":207,"pcbaColumns":251},[49,96,125,154],{"heading":50,"links":51},"Familles de produits PCB",[52,55,58,61,64,67,70,73,76,79,82,84,87,90,93],{"label":53,"path":54},"PCB FR-4","/pcb/fr4-pcb",{"label":56,"path":57},"PCB haute vitesse","/pcb/high-speed-pcb",{"label":59,"path":60},"PCB multicouches","/pcb/multilayer-pcb",{"label":62,"path":63},"PCB HDI","/pcb/hdi-pcb",{"label":65,"path":66},"PCB flexible","/pcb/flex-pcb",{"label":68,"path":69},"PCB rigid-flex","/pcb/rigid-flex-pcb",{"label":71,"path":72},"PCB céramique","/pcb/ceramic-pcb",{"label":74,"path":75},"PCB cuivre épais","/pcb/heavy-copper-pcb",{"label":77,"path":78},"PCB haute dissipation thermique","/pcb/high-thermal-pcb",{"label":80,"path":81},"PCB d’antenne","/pcb/antenna-pcb",{"label":17,"path":83},"/pcb/high-frequency-pcb",{"label":85,"path":86},"PCB micro-ondes","/pcb/microwave-pcb",{"label":88,"path":89},"PCB à noyau métallique","/pcb/metal-core-pcb",{"label":91,"path":92},"PCB High-Tg","/pcb/high-tg-pcb",{"label":94,"path":95},"PCB backplane","/pcb/backplane-pcb",{"sections":97},[98],{"heading":99,"links":100},"RF & matériaux",[101,104,107,110,113,116,119,122],{"label":102,"path":103},"PCB Rogers","/materials/rf-rogers",{"label":105,"path":106},"Taconic PCB","/materials/taconic-pcb",{"label":108,"path":109},"Teflon PCB","/materials/teflon-pcb",{"label":111,"path":112},"Arlon PCB","/materials/arlon-pcb",{"label":114,"path":115},"Megtron PCB","/materials/megtron-pcb",{"label":117,"path":118},"ISOLA PCB","/materials/isola-pcb",{"label":120,"path":121},"FR-4 Spread Glass","/materials/spread-glass-fr4",{"label":123,"path":124},"Stackups à impédance contrôlée","/pcb/pcb-stack-up",{"sections":126},[127],{"heading":128,"links":129},"Fabrication / stackups",[130,133,136,139,142,145,148,151],{"label":131,"path":132},"Prototypes quickturn","/pcb/quick-turn-pcb",{"label":134,"path":135},"NPI & petites séries (PCB)","/pcb/npi-small-batch-pcb-manufacturing",{"label":137,"path":138},"Production grande série","/pcb/mass-production-pcb-manufacturing",{"label":140,"path":141},"PCB à nombre de couches élevé","/pcb/high-layer-count-pcb",{"label":143,"path":144},"Processus de fabrication PCB","/pcb/pcb-fabrication-process",{"label":146,"path":147},"Fabrication PCB avancée","/pcb/advanced-pcb-manufacturing",{"label":149,"path":150},"Fabrication PCB spéciale","/pcb/special-pcb-manufacturing",{"label":152,"path":153},"Structure laminée multicouche","/pcb/multilayer-pcb-lamination-services",{"heading":155,"links":156},"Spécialités & ressources",[157,160,163,165,168],{"label":158,"path":159},"Finitions de surface PCB (ENIG / ENEPIG / HASL / OSP / Immersion)","/pcb/pcb-surface-finishes",{"label":161,"path":162},"Perçage & vias (Blind / Buried / Via-in-Pad / Backdrill / Half Hole)","/pcb/pcb-drilling",{"label":164,"path":124},"Stackup PCB (Standard / High-Layer / Flex / Rigid-Flex / Aluminum)",{"label":166,"path":167},"Profilage (Milling / V-Scoring / Depaneling)","/pcb/pcb-profiling",{"label":169,"path":170},"Qualité & inspection (AOI + X-Ray / Flying Probe / PCB DFM Check)","/pcb/pcb-quality",[172,177,182,187,192,197,202],{"links":173},[174],{"label":175,"path":176},"Capacité PCB rigide","/capabilities/rigid-pcb",{"links":178},[179],{"label":180,"path":181},"Capacité PCB rigid-flex","/capabilities/rigid-flex-pcb",{"links":183},[184],{"label":185,"path":186},"Capacité PCB flexible","/capabilities/flex-pcb",{"links":188},[189],{"label":190,"path":191},"Capacité PCB HDI","/capabilities/hdi-pcb",{"links":193},[194],{"label":195,"path":196},"Capacité PCB métal","/capabilities/metal-pcb",{"links":198},[199],{"label":200,"path":201},"Capacité PCB céramique","/capabilities/ceramic-pcb",{"links":203},[204],{"label":205,"path":206},"Capacité PCB cuivre épais","/capabilities/heavy-copper-pcb",[208,219,243],{"heading":209,"links":210},"Téléchargements",[211,214,217],{"label":212,"path":213},"Fiches matériaux / notes de procédé","/resources/downloads-materials",{"label":215,"path":216},"Guidelines DFM PCB","/resources/dfm-guidelines",{"label":152,"path":218},"/pcb/multi-layer-laminated-structure",{"heading":220,"links":221},"Outils",[222,225,228,231,234,237,240],{"label":223,"path":224},"Visionneuse Gerber","/tools/gerber-viewer",{"label":226,"path":227},"Visionneuse PCB","/tools/pcb-viewer",{"label":229,"path":230},"Visionneuse BOM","/tools/bom-viewer",{"label":232,"path":233},"Visionneuse 3D","/tools/3d-viewer",{"label":235,"path":236},"Simulateur de circuits","/tools/circuit-simulator",{"label":238,"path":239},"Calculateur d’impédance","/tools/impedance-calculator",{"label":241,"path":242},"Calculateur de largeur de piste","/tools/trace-width-calculator",{"heading":244,"links":245},"FAQ & blog",[246,249],{"label":247,"path":248},"FAQ","/resources/faq",{"label":42,"path":250},"/blog",[252,282,306,339],{"heading":253,"links":254},"Services principaux",[255,258,261,264,267,270,273,276,279],{"label":256,"path":257},"Assemblage PCB turnkey","/pcba/turnkey-assembly",{"label":259,"path":260},"Assemblage PCB NPI & petites séries","/pcba/npi-assembly",{"label":262,"path":263},"Assemblage PCB production de masse","/pcba/mass-production",{"label":265,"path":266},"Assemblage PCB flex & rigid-flex","/pcba/flex-rigid-flex",{"label":268,"path":269},"Assemblage SMT & traversant (THT)","/pcba/smt-tht",{"label":271,"path":272},"Assemblage PCB BGA","/pcba/bga-qfn-fine-pitch",{"label":274,"path":275},"Composants & gestion BOM","/pcba/components-bom",{"label":277,"path":278},"Assemblage box build","/pcba/box-build-assembly",{"label":280,"path":281},"Tests & qualité d’assemblage PCB","/pcba/testing-quality",{"heading":283,"links":284},"Services complémentaires",[285,288,291,294,297,300,303],{"label":286,"path":287},"Tous les points de support","/pcba/support-services",{"label":289,"path":290},"Atelier pochoirs","/pcba/pcb-stencil",{"label":292,"path":293},"Sourcing composants","/pcba/component-sourcing",{"label":295,"path":296},"Programmation IC","/pcba/ic-programming",{"label":298,"path":299},"Vernis de tropicalisation","/pcba/pcb-conformal-coating",{"label":301,"path":302},"Soudure sélective","/pcba/pcb-selective-soldering",{"label":304,"path":305},"Reballing BGA","/pcba/bga-reballing",{"heading":307,"links":308},"Qualité & tests",[309,312,315,318,321,324,327,330,333,336],{"label":310,"path":311},"Inspection qualité","/pcba/quality-system",{"label":313,"path":314},"Inspection premier article (FAI)","/pcba/first-article-inspection",{"label":316,"path":317},"Inspection pâte à braser (SPI)","/pcba/spi-inspection",{"label":319,"path":320},"Inspection optique AOI","/pcba/aoi-inspection",{"label":322,"path":323},"Inspection rayons X / CT","/pcba/xray-inspection",{"label":325,"path":326},"Test en circuit (ICT)","/pcba/ict-test",{"label":328,"path":329},"Test flying probe","/pcba/flying-probe-testing",{"label":331,"path":332},"Test fonctionnel (FCT)","/pcba/fct-test",{"label":334,"path":335},"Inspection finale & emballage","/pcba/final-quality-inspection",{"label":337,"path":338},"Contrôle qualité entrant","/pcba/incoming-quality-control",{"heading":340,"linkClass":341,"links":342},"Applications sectorielles (entrée)","text-nowrap",[343,346,349,352,355,358,361,364,367,370,373],{"label":344,"path":345},"Serveurs / data center","/industries/server-data-center-pcb",{"label":347,"path":348},"Automobile / EV","/industries/automotive-electronics-pcb",{"label":350,"path":351},"Médical","/industries/medical-pcb",{"label":353,"path":354},"Télécom / 5G","/industries/communication-equipment-pcb",{"label":356,"path":357},"Aérospatial & défense","/industries/aerospace-defense-pcb",{"label":359,"path":360},"Drones / UAV","/industries/drone-uav-pcb",{"label":362,"path":363},"Contrôle industriel & automatisation","/industries/industrial-control-pcb",{"label":365,"path":366},"Énergie & nouvelles énergies","/industries/power-energy-pcb",{"label":368,"path":369},"Robotique & automatisation","/industries/robotics-pcb",{"label":371,"path":372},"Sécurité / équipements de sécurité","/industries/security-equipment-pcb",{"label":374,"path":375},"Aperçu de l’industrie PCB →","/pcb-industry-solutions",1791586992476]