[{"data":1,"prerenderedAt":378},["ShallowReactive",2],{"blog-fr4-material-properties-ru":3,"header-nav-ru":47},{"title":4,"description":5,"date":6,"lastUpdated":6,"category":7,"image":8,"readingTime":9,"wordCount":10,"timeRequired":11,"htmlContent":12,"tags":13,"slug":21,"jsonld":22},"Свойства материала FR4: Dk, Tg, плотность, спецификация CTE","Что такое FR-4 и его ключевые свойства: диэлектрическая проницаемость, Tg, Td, CTE, плотность и теплопроводность, а также выбор High-Tg FR-4.","2026-10-09","materials","/assets/img/pcb/fr4/pcb-fr4-pcb-hero.webp",4,617,"PT4M","\u003Ch2 id=\"key-takeaways\" data-anchor-en=\"key-takeaways\">Ключевые выводы\u003C/h2>\n\u003Cul>\n\u003Cli>\u003Cstrong>Значение FR-4:\u003C/strong> 'FR' означает \u003Cstrong>Flame Retardant\u003C/strong> (огнестойкий), а '4' обозначает эпоксидную смолу, армированную стеклотканью, в соответствии со стандартами NEMA LI 1-1998 и UL94 V-0.\u003C/li>\n\u003Cli>\u003Cstrong>Диэлектрическая проницаемость FR4 (Dk):\u003C/strong> Обычно составляет от \u003Cstrong>4,2 до 4,7 на частоте 1 ГГц\u003C/strong> и снижается с ростом частоты в зависимости от соотношения стекла и смолы.\u003C/li>\n\u003Cli>\u003Cstrong>Термические пороги (Tg, Td):\u003C/strong> Стандартный FR-4 имеет температуру стеклования ($T_g$) $130\\text{--}140^\\circ\\text{C}$, Mid-$T_g$ составляет $150^\\circ\\text{C}$, а High-$T_g$ достигает $170\\text{--}180^\\circ\\text{C}$ для бессвинцовой пайки ($260^\\circ\\text{C}$).\u003C/li>\n\u003Cli>\u003Cstrong>Коэффициент теплового расширения (CTE):\u003C/strong> По оси Z стандартный FR-4 расширяется со скоростью $50\\text{--}70\\text{ ppm/}^\\circ\\text{C}$ ниже $T_g$ и возрастает до $250\\text{--}300\\text{ ppm/}^\\circ\\text{C}$ выше $T_g$.\u003C/li>\n\u003Cli>\u003Cstrong>Физические показатели:\u003C/strong> Плотность \u003Cstrong>$1,85\\text{ г/см}^3$\u003C/strong>, модуль Юнга \u003Cstrong>22--24 ГПа\u003C/strong> и умеренная теплопроводность \u003Cstrong>$0,25\\text{--}0,35\\text{ Вт/(м}\\cdot\\text{К)}$\u003C/strong>.\u003C/li>\n\u003C/ul>\n\u003Cdiv data-component=\"BlogQuickQuoteInline\">\u003C/div>\n\n\u003Ch2 id=\"fr-4\" data-anchor-en=\"what-is-fr-4-composition-and-grades\">Что такое FR-4? Состав и градации\u003C/h2>\n\u003Cp>Термин \u003Cstrong>материал FR4 для печатных плат\u003C/strong> обозначает композитную структуру из двух основных компонентов:\u003C/p>\n\u003Col>\n\u003Cli>\u003Cstrong>Тканое стекловолокно:\u003C/strong> Стеклонить E-glass (типы 106, 1080, 2116, 7628) обеспечивает механическую прочность и стабильность размеров.\u003C/li>\n\u003Cli>\u003Cstrong>Эпоксидная смоляная матрица:\u003C/strong> Термореактивный полимер с антипиренами, обеспечивающий диэлектрическую изоляцию и фиксацию медной фольги.\u003C/li>\n\u003C/ol>\n\u003Ch2 id=\"fr4\" data-anchor-en=\"common-fr-4-grades-in-industry\">Спецификация характеристик материала FR4\u003C/h2>\n\u003Ctable>\n\u003Cthead>\n\u003Ctr>\n\u003Cth>Свойство\u003C/th>\n\u003Cth>Метод испытания (IPC-TM-650)\u003C/th>\n\u003Cth>Стандартный FR-4 (Mid-Tg)\u003C/th>\n\u003Cth>High-Tg FR-4\u003C/th>\n\u003Cth>Единица измерения\u003C/th>\n\u003C/tr>\n\u003C/thead>\n\u003Ctbody>\u003Ctr>\n\u003Ctd>Glass Transition Temp ($T_g$)\u003C/td>\n\u003Ctd>2.4.24 (DSC)\u003C/td>\n\u003Ctd>135 - 150 °C\u003C/td>\n\u003Ctd>170 - 180 °C\u003C/td>\n\u003Ctd>°C\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Decomposition Temp ($T_d$)\u003C/td>\n\u003Ctd>2.4.24.6 (TGA 5% loss)\u003C/td>\n\u003Ctd>310 - 325 °C\u003C/td>\n\u003Ctd>340 - 355 °C\u003C/td>\n\u003Ctd>°C\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Time to Delamination (T260)\u003C/td>\n\u003Ctd>2.4.24.1 (TMA)\u003C/td>\n\u003Ctd>5 - 15 min\u003C/td>\n\u003Ctd>30 - 60+ min\u003C/td>\n\u003Ctd>min\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Time to Delamination (T288)\u003C/td>\n\u003Ctd>2.4.24.1 (TMA)\u003C/td>\n\u003Ctd>0 - 2 min\u003C/td>\n\u003Ctd>10 - 30 min\u003C/td>\n\u003Ctd>min\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Z-Axis CTE (Below $T_g$)\u003C/td>\n\u003Ctd>2.4.24 (TMA)\u003C/td>\n\u003Ctd>50 - 70\u003C/td>\n\u003Ctd>40 - 50\u003C/td>\n\u003Ctd>ppm/°C\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Z-Axis CTE (Above $T_g$)\u003C/td>\n\u003Ctd>2.4.24 (TMA)\u003C/td>\n\u003Ctd>250 - 300\u003C/td>\n\u003Ctd>220 - 260\u003C/td>\n\u003Ctd>ppm/°C\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Z-Axis Expansion (50-260°C)\u003C/td>\n\u003Ctd>2.4.24 (TMA)\u003C/td>\n\u003Ctd>4.0 - 5.5%\u003C/td>\n\u003Ctd>2.3 - 3.2%\u003C/td>\n\u003Ctd>%\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Dielectric Constant ($D_k$, 1 GHz)\u003C/td>\n\u003Ctd>2.5.5.9\u003C/td>\n\u003Ctd>4.3 - 4.6\u003C/td>\n\u003Ctd>4.2 - 4.5\u003C/td>\n\u003Ctd>-\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Loss Tangent ($D_f$, 1 GHz)\u003C/td>\n\u003Ctd>2.5.5.9\u003C/td>\n\u003Ctd>0.016 - 0.022\u003C/td>\n\u003Ctd>0.012 - 0.018\u003C/td>\n\u003Ctd>-\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Volume Resistivity\u003C/td>\n\u003Ctd>2.5.17\u003C/td>\n\u003Ctd>10^8 - 10^9\u003C/td>\n\u003Ctd>10^8 - 10^9\u003C/td>\n\u003Ctd>MΩ·cm\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Surface Resistivity\u003C/td>\n\u003Ctd>2.5.17\u003C/td>\n\u003Ctd>10^7 - 10^8\u003C/td>\n\u003Ctd>10^7 - 10^8\u003C/td>\n\u003Ctd>MΩ\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Dielectric Breakdown\u003C/td>\n\u003Ctd>2.5.6\u003C/td>\n\u003Ctd>> 40\u003C/td>\n\u003Ctd>> 45\u003C/td>\n\u003Ctd>kV\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Flexural Strength (Lengthwise)\u003C/td>\n\u003Ctd>2.4.4\u003C/td>\n\u003Ctd>> 450\u003C/td>\n\u003Ctd>> 500\u003C/td>\n\u003Ctd>MPa\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Peel Strength (1 oz copper)\u003C/td>\n\u003Ctd>2.4.8\u003C/td>\n\u003Ctd>1.4 - 1.8 (8 - 10)\u003C/td>\n\u003Ctd>1.4 - 1.8 (8 - 10)\u003C/td>\n\u003Ctd>N/mm (lb/in)\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Moisture Absorption\u003C/td>\n\u003Ctd>2.6.2.1\u003C/td>\n\u003Ctd>0.15 - 0.25\u003C/td>\n\u003Ctd>0.10 - 0.18\u003C/td>\n\u003Ctd>%\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Thermal Conductivity\u003C/td>\n\u003Ctd>ASTM E1461\u003C/td>\n\u003Ctd>0.25 - 0.35\u003C/td>\n\u003Ctd>0.30 - 0.40\u003C/td>\n\u003Ctd>W/m·K\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Flammability Rating\u003C/td>\n\u003Ctd>UL 94\u003C/td>\n\u003Ctd>V-0\u003C/td>\n\u003Ctd>V-0\u003C/td>\n\u003Ctd>Class\u003C/td>\n\u003C/tr>\n\u003C/tbody>\u003C/table>\n\u003Ch2 id=\"fr-4-2\" data-anchor-en=\"fr4-material-properties-datasheet-at-a-glance\">Часто задаваемые вопросы о FR-4\u003C/h2>\n\u003Ch3 id=\"fr4-2\" data-anchor-en=\"electrical-performance-fr4-dielectric-constant-and-loss\">Какова плотность материала FR4?\u003C/h3>\n\u003Cp>Плотность отвержденного стеклотекстолита FR-4 составляет \u003Cstrong>1,85 г/см³\u003C/strong>.\u003C/p>\n\u003Ch3 id=\"fr-4-1\" data-anchor-en=\"1-dk-variations-by-glass-style\">Какова диэлектрическая проницаемость FR-4 на частоте 1 ГГц?\u003C/h3>\n\u003Cp>На частоте 1 ГГц относительная диэлектрическая проницаемость ($Dk$) обычно составляет \u003Cstrong>4,2--4,5\u003C/strong>.\u003C/p>\n\u003Ch3 id=\"high-tg-fr-4\" data-anchor-en=\"2-high-frequency-attenuation\">Когда следует выбирать High-Tg FR-4 вместо стандартного?\u003C/h3>\n\u003Cp>High-Tg FR-4 ($T_g \\ge 170^\\circ\\text{C}$) обязателен для бессвинцовой пайки RoHS, многослойных плат от 6 слоев и промышленной электроники.\u003C/p>\n\u003Ch2 id=\"thermal-properties-tg-td-and-cte\" data-anchor-en=\"thermal-properties-tg-td-and-cte\">Связанные ресурсы и технические руководства\u003C/h2>\n\u003Cul>\n\u003Cli>\u003Ca href=\"/ru/blog/glass-transition-temperature-tg\">/blog/glass-transition-temperature-tg\u003C/a> - Deep dive into Tg thermal reliability thresholds\u003C/li>\n\u003Cli>\u003Ca href=\"/ru/blog/what-is-dielectric-constant\">/blog/what-is-dielectric-constant\u003C/a> - Dielectric constant fundamentals and impedance control\u003C/li>\n\u003Cli>\u003Ca href=\"/ru/materials\">/materials\u003C/a> - Complete substrate material catalog and high-frequency laminates\u003C/li>\n\u003Cli>\u003Ca href=\"/ru/pcb\">/pcb\u003C/a> - Full multilayer rigid PCB fabrication specifications and tolerances\u003C/li>\n\u003C/ul>\n\n\u003Csection class=\"related-links\" aria-label=\"Related\">\u003Ch3>Related links\u003C/h3>\u003Cul>\u003Cli>\u003Ca href=\"/ru/blog/glass-transition-temperature-tg\">/blog/glass-transition-temperature-tg\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/ru/blog/what-is-dielectric-constant\">/blog/what-is-dielectric-constant\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/ru/materials\">/materials\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/ru/pcb\">/pcb\u003C/a>\u003C/li>\u003C/ul>\u003C/section>",[14,15,16,17,18,19,20],"FR4 Material","FR4 Properties","PCB Substrate","FR4 Dielectric Constant","FR4 Tg","Thermal Conductivity","PCB Stackup","fr4-material-properties",{"blog":23,"breadcrumb":32,"faq":46},{"@context":24,"@type":25,"headline":4,"description":5,"image":8,"url":26,"datePublished":6,"dateModified":6,"timeRequired":11,"keywords":27,"articleSection":7,"author":28,"publisher":31},"https://schema.org","BlogPosting","https://aptpcb.com/ru/blog/fr4-material-properties","FR4 Material, FR4 Properties, PCB Substrate, FR4 Dielectric Constant, FR4 Tg, Thermal Conductivity, PCB Stackup",{"@type":29,"name":30},"Organization","APTPCB",{"@type":29,"name":30},{"@context":24,"@type":33,"itemListElement":34},"BreadcrumbList",[35,40,44],{"@type":36,"position":37,"name":38,"item":39},"ListItem",1,"Home","https://aptpcb.com/",{"@type":36,"position":41,"name":42,"item":43},2,"Blog","https://aptpcb.com/ru/blog",{"@type":36,"position":45,"name":21,"item":26},3,null,{"pcbManufacturingColumns":48,"capabilityColumns":172,"resourceColumns":208,"pcbaColumns":253},[49,97,126,155],{"heading":50,"links":51},"Категории PCB",[52,55,58,61,64,67,70,73,76,79,82,85,88,91,94],{"label":53,"path":54},"PCB FR-4","/pcb/fr4-pcb",{"label":56,"path":57},"Высокоскоростные PCB","/pcb/high-speed-pcb",{"label":59,"path":60},"Многослойные PCB","/pcb/multilayer-pcb",{"label":62,"path":63},"HDI PCB","/pcb/hdi-pcb",{"label":65,"path":66},"Гибкие PCB","/pcb/flex-pcb",{"label":68,"path":69},"Rigid-Flex PCB","/pcb/rigid-flex-pcb",{"label":71,"path":72},"Керамические PCB","/pcb/ceramic-pcb",{"label":74,"path":75},"PCB с толстой медью","/pcb/heavy-copper-pcb",{"label":77,"path":78},"PCB с высокой теплопроводностью","/pcb/high-thermal-pcb",{"label":80,"path":81},"Антенные PCB","/pcb/antenna-pcb",{"label":83,"path":84},"Высокочастотные PCB","/pcb/high-frequency-pcb",{"label":86,"path":87},"СВЧ PCB","/pcb/microwave-pcb",{"label":89,"path":90},"PCB с металлическим сердечником","/pcb/metal-core-pcb",{"label":92,"path":93},"High-Tg PCB","/pcb/high-tg-pcb",{"label":95,"path":96},"Backplane PCB","/pcb/backplane-pcb",{"sections":98},[99],{"heading":100,"links":101},"RF и материалы",[102,105,108,111,114,117,120,123],{"label":103,"path":104},"PCB Rogers","/materials/rf-rogers",{"label":106,"path":107},"Taconic PCB","/materials/taconic-pcb",{"label":109,"path":110},"Teflon PCB","/materials/teflon-pcb",{"label":112,"path":113},"Arlon PCB","/materials/arlon-pcb",{"label":115,"path":116},"Megtron PCB","/materials/megtron-pcb",{"label":118,"path":119},"ISOLA PCB","/materials/isola-pcb",{"label":121,"path":122},"FR-4 Spread Glass","/materials/spread-glass-fr4",{"label":124,"path":125},"Стек-апы с контролируемым импедансом","/pcb/pcb-stack-up",{"sections":127},[128],{"heading":129,"links":130},"Производство / стек-апы",[131,134,137,140,143,146,149,152],{"label":132,"path":133},"Quickturn-прототипы","/pcb/quick-turn-pcb",{"label":135,"path":136},"NPI и малые партии (PCB)","/pcb/npi-small-batch-pcb-manufacturing",{"label":138,"path":139},"Высокосерийное производство","/pcb/mass-production-pcb-manufacturing",{"label":141,"path":142},"PCB с большим числом слоев","/pcb/high-layer-count-pcb",{"label":144,"path":145},"Процесс изготовления PCB","/pcb/pcb-fabrication-process",{"label":147,"path":148},"Передовое производство PCB","/pcb/advanced-pcb-manufacturing",{"label":150,"path":151},"Специализированное производство PCB","/pcb/special-pcb-manufacturing",{"label":153,"path":154},"Многослойная ламинированная структура","/pcb/multilayer-pcb-lamination-services",{"heading":156,"links":157},"Специализации и ресурсы",[158,161,164,166,169],{"label":159,"path":160},"Финишные покрытия PCB (ENIG / ENEPIG / HASL / OSP / Immersion)","/pcb/pcb-surface-finishes",{"label":162,"path":163},"Сверловка и переходные отверстия (Blind / Buried / Via-in-Pad / Backdrill / Half Hole)","/pcb/pcb-drilling",{"label":165,"path":125},"Стек-ап PCB (Standard / High-Layer / Flex / Rigid-Flex / Aluminum)",{"label":167,"path":168},"Профилирование (Milling / V-Scoring / Depaneling)","/pcb/pcb-profiling",{"label":170,"path":171},"Качество и инспекция (AOI + X-Ray / Flying Probe / PCB DFM Check)","/pcb/pcb-quality",[173,178,183,188,193,198,203],{"links":174},[175],{"label":176,"path":177},"Возможности rigid PCB","/capabilities/rigid-pcb",{"links":179},[180],{"label":181,"path":182},"Возможности rigid-flex","/capabilities/rigid-flex-pcb",{"links":184},[185],{"label":186,"path":187},"Возможности flex PCB","/capabilities/flex-pcb",{"links":189},[190],{"label":191,"path":192},"Возможности HDI PCB","/capabilities/hdi-pcb",{"links":194},[195],{"label":196,"path":197},"Возможности metal PCB","/capabilities/metal-pcb",{"links":199},[200],{"label":201,"path":202},"Возможности ceramic PCB","/capabilities/ceramic-pcb",{"links":204},[205],{"label":206,"path":207},"Возможности PCB с толстой медью","/capabilities/heavy-copper-pcb",[209,220,244],{"heading":210,"links":211},"Загрузки",[212,215,218],{"label":213,"path":214},"Даташиты материалов / технологические примечания","/resources/downloads-materials",{"label":216,"path":217},"Рекомендации по DFM для PCB","/resources/dfm-guidelines",{"label":153,"path":219},"/pcb/multi-layer-laminated-structure",{"heading":221,"links":222},"Инструменты",[223,226,229,232,235,238,241],{"label":224,"path":225},"Просмотрщик Gerber","/tools/gerber-viewer",{"label":227,"path":228},"Просмотр PCB","/tools/pcb-viewer",{"label":230,"path":231},"Просмотр BOM","/tools/bom-viewer",{"label":233,"path":234},"3D-просмотр","/tools/3d-viewer",{"label":236,"path":237},"Симулятор схем","/tools/circuit-simulator",{"label":239,"path":240},"Калькулятор импеданса","/tools/impedance-calculator",{"label":242,"path":243},"Калькулятор ширины дорожки","/tools/trace-width-calculator",{"heading":245,"links":246},"FAQ и блог",[247,250],{"label":248,"path":249},"FAQ","/resources/faq",{"label":251,"path":252},"Блог","/blog",[254,284,308,341],{"heading":255,"links":256},"Основные услуги",[257,260,263,266,269,272,275,278,281],{"label":258,"path":259},"Сборка PCB под ключ","/pcba/turnkey-assembly",{"label":261,"path":262},"Сборка PCB: NPI и малые партии","/pcba/npi-assembly",{"label":264,"path":265},"Сборка PCB: серийное производство","/pcba/mass-production",{"label":267,"path":268},"Сборка гибких и rigid-flex 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