Stackup Templates Bundle
4/6/8-layer CSV pack for rapid edits.
Materials
Controlled Impedance Stackups
Reference stackups, tolerances, and CSV templates for rapid impedance planning across FR-4, low-loss, and hybrid builds.
Sofortangebot anfordern
2L / 4L / 6L / 8L / 10L
Layer Counts
+/-5% - +/-10% Zo
Tolerance
CSV ready
Templates
Stackup & Impedance Ranges
| Structure | Typical | Notes |
|---|---|---|
| 2-Layer FR-4 | SE 50 Ohm microstrip (+/-10%) | Baseline proto / power planes |
| 4-Layer FR-4 | SE 50 Ohm microstrip, Diff 100 Ohm stripline (+/-10%) | Standard digital designs |
| 6-Layer Low-Loss | SE 50 Ohm stripline, Diff 100 Ohm dual stripline (+/-5%) | 10-25 Gbps signal integrity |
| 6-Layer HDI | Microvia build-up + VIPPO (+/-5%) | Compact routing with stacked vias |
| 8-Layer Hybrid | Rogers microstrip + FR-4 core stripline (+/-5%) | RF front end with digital core |
| 10-Layer Backplane | SE/Diff stripline (+/-5%) | Thick panels with backdrill |
Tolerances assume paired coupon design and +/-5% to +/-10% acceptance per IPC-TM-650; confirm with program targets.
Downloads & Templates
TDR Coupon Pack
SE 50 Ohm & Diff 100 Ohm coupon geometries.
Impedance Examples
Reference widths for common materials.
Reference Stackups
2-Layer Standard FR-4
Layers: 2 | Thickness: 1.6 mm
- •SE 50 Ohm - microstrip (+/-10%)
4-Layer Standard FR-4
Layers: 4 | Thickness: 1.6 mm
- •SE 50 Ohm - microstrip (+/-10%)
- •Diff 100 Ohm - stripline (+/-10%)
4-Layer Low-Loss
Layers: 4 | Thickness: 1.6 mm
- •SE 50 Ohm - microstrip (+/-5%)
- •Diff 100 Ohm - stripline (+/-5%)
6-Layer Low-Loss
Layers: 6 | Thickness: 1.6 mm
- •SE 50 Ohm - stripline (+/-5%)
- •Diff 100 Ohm - dual stripline (+/-5%)
6-Layer HDI Low-Loss
Layers: 6 | Thickness: 1.6 mm
- •SE 50 Ohm - microstrip (+/-5%)
- •Diff 100 Ohm - dual stripline (+/-5%)
6-Layer Hybrid (RO4350B + FR-4)
Layers: 6 | Thickness: 1.6 mm
- •SE 50 Ohm - microstrip on RO4350B (+/-5%)
- •Diff 100 Ohm - stripline in FR-4 (+/-5%)
8-Layer Balanced Low-Loss
Layers: 8 | Thickness: 1.6 mm
- •SE 50 Ohm - microstrip/stripline mix (+/-5%)
- •Diff 100 Ohm - dual stripline (+/-5%)
8-Layer Hybrid (Rogers + FR-4)
Layers: 8 | Thickness: 1.6 mm
- •SE 50 Ohm - microstrip on Rogers (+/-5%)
- •Diff 100 Ohm - dual stripline in FR-4 (+/-5%)
10-Layer Backplane-Grade
Layers: 10 | Thickness: 2.4 mm
- •SE 50 Ohm - stripline (+/-5%)
- •Diff 100 Ohm - dual stripline (+/-5%)
Design Checklist & Process Controls
Design Checklist
- •Document target Zo, trace geometry, and coupon locations in the fab drawing.
- •Specify materials (Dk/Df), copper roughness, and spread glass where skew matters.
- •Align stackup choice with connector/backdrill strategy and assembly constraints.
Process Controls
- •CAM applies width compensation per solver input; offsets tracked in SPC.
- •Lamination profiles logged per stack to maintain dielectric thickness.
- •TDR/VNA correlation with coupon acceptance maps attached to each lot.
Typical Use Cases
High-Speed Digital
- •25-112 Gbps links with +/-5% Zo control
- •Backplane, switch, and router line cards
- •Pairs with backdrill and press-fit windows
RF / Hybrid
- •Rogers microstrip launches with FR-4 digital routing
- •Antenna / PA matching networks
- •Requires tight material tolerance and stack registration
HDI & Compact SoCs
- •Microvia fanout with VIPPO / cavity requirements
- •High layer-count compute modules
- •Pairs with sequential lamination control
Related Capabilities & Resources
Capabilities
Resources
Related Products
Frequently Asked Questions
How do I choose the right stackup template?
Start from layer count, impedance targets, and material family. Use the CSV to document dielectric thickness, copper weights, and coupon plan for engineering review.
What tolerance can I expect on impedance?
Standard programs hold +/-10% on FR-4 baselines; low-loss, hybrid, and high-speed programs run +/-5% with coupon correlation and SPC tracking.
Can templates be customized for my build?
Yes. Share the CSV with your target stack and we will return a validated stackup with materials, press parameters, and coupon strategy.
Ready to validate your stackup?
Send us your impedance targets, materials, and connector plan, we will deliver a tuned stackup and acceptance workflow.