Rogers High-Frequency Laminates
RO4000, RO3000, RT/duroid, TMM series for RF/microwave designs
- •RF
- •Microwave
- •High-Frequency
PCB Materials & Stackup Release
PCB Materials Selection for Stackups, RF, High-Speed and Thermal Boards
PCB material selection is the engineering step that matches laminate, copper, dielectric thickness and availability to signal integrity, thermal load, reliability class and production lead time before a stackup is released.
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Material Families & Stackups
Filter by program focus and open detailed stackup notes.
Arlon High-Performance Materials
CLTE-XT, 85N, 25N for thermal and RF applications
- •RF
- •Thermal
- •High-Frequency
Megtron Low-Loss Laminates
Megtron 6, 7 for high-speed digital and RF designs
- •Low-Loss
- •High-Speed
- •RF
Taconic RF Materials
RF-35, RF-43, RF-60 for microwave and antenna designs
- •RF
- •Microwave
- •Antenna
Isola High-Tg & Low-Loss
IS620, IS680, IS410 for high-reliability and high-speed
- •High-Tg
- •Low-Loss
- •Automotive
PTFE/Teflon Laminates
Pure PTFE and hybrid PTFE/FR-4 for RF and high-frequency
- •RF
- •PTFE
- •Microwave
Spread Glass FR-4
Standard and spread glass FR-4 for cost-effective designs
- •FR-4
- •Standard
- •Cost-Effective
Material Programs
Reference playbooks linking stackup design, availability, and reliability.
General digital and cost-controlled FR-4
- •Use standard FR-4 for general digital, analog and low-risk industrial boards where loss and heat are not the limiting factors.
- •Move to high-Tg or halogen-free FR-4 when reflow cycles, CAF risk, dimensional stability or compliance requirements justify it.
High-speed and RF material selection
- •Use low-loss FR-4, Megtron-class materials, Rogers/PTFE or hybrid stackups when insertion loss, Dk stability, skew or RF power matters.
- •Lock dielectric thickness, copper roughness, impedance coupons and allowed alternates before fabrication release.
Thermal, power and reliability stackups
- •Use MCPCB, heavy copper, ceramic, copper coin or high-Tg systems when heat flow, current density or thermal cycling drives reliability.
- •Validate CTE mismatch, plating reliability, solder profile and material availability before moving from NPI to production.
Featured Material Data
Quick reference ranges pulled from the materials library. Full table lives on the Materials List page.
| Category | Tg Range | Dk | Df | Notes |
|---|---|---|---|---|
| FR-4 | 130–150 °C | 3.8–4.2 @1MHz | 0.015–0.025 @1MHz | General purpose FR-4 for standard digital designs. |
| High‑Tg FR-4 | 170–200 °C | 3.6–3.9 @1MHz | 0.010–0.018 @1MHz | High reflow cycles, better dimensional stability. |
| Low‑Loss FR-4 | ≥ 170 °C | 3.3–3.7 @10GHz | 0.001–0.003 @10GHz | For high‑speed 10–25 Gbps signaling. |
| Halogen‑Free FR‑4 | 150–170 °C | 3.6–3.9 @1MHz | 0.012–0.020 @1MHz | RoHS/REACH compliant halogen‑free resin systems; general and high‑reliability builds. |
Download the full AVL on the Materials List page.
Readiness Checklist
Key items we complete before locking stackups into production builds.
Material Selection Matrix
- •Standard FR-4: best default for cost, availability and ordinary digital boards.
- •High-Tg FR-4: choose for extra reflow margin, thicker multilayers or reliability programs.
- •Low-loss FR-4 / Megtron-class: choose for 10–56 Gbps class channels when loss budget is tight.
- •RF/PTFE/Rogers/Taconic: choose for RF, microwave, antenna and stable Dk requirements.
- •MCPCB / ceramic / heavy copper: choose when heat spreading or current density is the design driver.
Stackup Release Checklist
- •Define layer count, target impedance, dielectric sequence and copper weights.
- •Specify laminate family, approved alternates, Tg, Dk/Df reference frequency and glass style if relevant.
- •Add coupon plan, TDR/VNA acceptance, solder finish, via structure and backdrill requirements.
- •Attach CoC/material cert expectations and revision-controlled fabrication drawing.
Risk Review Before Quote
- •Avoid over-specifying premium laminates when FR-4 meets the loss and thermal budget.
- •Avoid late material substitution on impedance-controlled or RF boards without solver review.
- •Check lead-time tiers for specialty laminates before promising quick-turn builds.
- •Escalate thermal, heavy copper and ceramic boards when assembly profile or CTE mismatch may dominate risk.
Connect With Capabilities
Material choices tie directly into drilling, impedance, and assembly workflows.
Microvia <=0.10 mm
Blind and buried via strategies matched to materials.
TDR Impedance Testing
Coupon design and measurement to validate stackup targets.
Backplane PCB
High layer count programs using low-loss and hybrid stacks.
Frequently Asked Questions
Common questions about materials, stackups, and impedance validation.
How should I choose a PCB material?
Start with the design constraint that can fail the product: signal loss, frequency, heat, reflow margin, voltage/current, bend requirement or availability. Then choose the least complex material family that satisfies that constraint and can be released with stackup and test evidence.
When is standard FR-4 enough?
Standard FR-4 is usually the practical default for general digital, analog and cost-sensitive boards when loss, heat and dimensional stability are not the dominant risks. High-Tg or low-loss FR-4 is used when reliability or signal integrity requires more margin.
When should I move from FR-4 to low-loss or RF laminates?
Move beyond standard FR-4 when insertion loss, Dk stability, skew, RF frequency, antenna behavior or microwave power affects performance. Low-loss FR-4 may cover many high-speed digital designs, while RF/PTFE/Rogers-class laminates are used for tighter RF and microwave control.
What data is needed for a stackup review?
Send layer count, board thickness, impedance targets, copper weights, signal speeds or RF bands, via structure, finish, operating temperature, preferred laminate or AVL, and any coupon or test requirements.
Do you provide impedance coupons and material certificates?
Yes. For impedance-controlled or reliability programs, APTPCB can align coupon plans, TDR or VNA acceptance, material certificates, CoC requirements and lot traceability with the released stackup.
Can APTPCB propose alternate PCB materials?
Yes. APTPCB can propose alternates when the electrical, thermal and reliability limits are clear. Alternates should be reviewed before release because Dk, Df, glass weave, copper roughness and dielectric thickness can change impedance or loss.
Need stackup guidance or material samples?
Share your target stackup or BOM and we will respond with materials recommendations, lead time, and risk notes.