Rogers High-Frequency Laminates
RO4000, RO3000, RT/duroid, TMM series for RF/microwave designs
- •RF
- •Microwave
- •High-Frequency
Materials & Stackups
Materials
Overview of stackups, FR-4 variants, low-loss materials, vendor lists, and controlled impedance stackups.
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Material Families & Stackups
Filter by program focus and open detailed stackup notes.
Arlon High-Performance Materials
CLTE-XT, 85N, 25N for thermal and RF applications
- •RF
- •Thermal
- •High-Frequency
Megtron Low-Loss Laminates
Megtron 6, 7 for high-speed digital and RF designs
- •Low-Loss
- •High-Speed
- •RF
Taconic RF Materials
RF-35, RF-43, RF-60 for microwave and antenna designs
- •RF
- •Microwave
- •Antenna
Isola High-Tg & Low-Loss
IS620, IS680, IS410 for high-reliability and high-speed
- •High-Tg
- •Low-Loss
- •Automotive
PTFE/Teflon Laminates
Pure PTFE and hybrid PTFE/FR-4 for RF and high-frequency
- •RF
- •PTFE
- •Microwave
Spread Glass FR-4
Standard and spread glass FR-4 for cost-effective designs
- •FR-4
- •Standard
- •Cost-Effective
Material Programs
Reference playbooks linking stackup design, availability, and reliability.
Reliability Stackups
- •High Tg FR-4 with bake windows, lamination pressure, and VIPPO readiness.
- •Sequential lamination notes tied to Class 3 reliability targets.
High-Speed & RF
- •Hybrid Rogers and low-loss FR-4 combos with impedance offsets ready for solvers.
- •Copper roughness and launch guidance for 10-28 Gbps and RF bands.
Thermal Management
- •MCPCB, copper coin, and ceramic options with thermal conductivity specs and CTE notes.
- •Interface material, backdrill, and heat spreading recommendations.
Featured Material Data
Quick reference ranges pulled from the materials library. Full table lives on the Materials List page.
| Category | Tg Range | Dk | Df | Notes |
|---|---|---|---|---|
| FR-4 | 130–150 °C | 3.8–4.2 @1MHz | 0.015–0.025 @1MHz | General purpose FR-4 for standard digital designs. |
| High‑Tg FR-4 | 170–200 °C | 3.6–3.9 @1MHz | 0.010–0.018 @1MHz | High reflow cycles, better dimensional stability. |
| Low‑Loss FR-4 | ≥ 170 °C | 3.3–3.7 @10GHz | 0.001–0.003 @10GHz | For high‑speed 10–25 Gbps signaling. |
| Halogen‑Free FR‑4 | 150–170 °C | 3.6–3.9 @1MHz | 0.012–0.020 @1MHz | RoHS/REACH compliant halogen‑free resin systems; general and high‑reliability builds. |
Download the full AVL on the Materials List page.
Readiness Checklist
Key items we complete before locking stackups into production builds.
Stackup Release Checklist
- •AVL tags stackups with availability tiers, alternates, and lead time notes.
- •Template library covers Gerber naming, dielectric order, and copper weights.
- •Material certs and CoC packages map to lot numbers for Class 3 / automotive programs.
- •Materials cross-link to capabilities (microvia, backdrill, finishes) before release.
Documentation Package
- •Gerbers/ODB++ + fabrication drawing
- •Stackup CSV with coupon plan
- •Impedance targets and tolerances
- •Change log and traceability notes
Quality Correlation
- •TDR/VNA acceptance (±5% typical)
- •Dielectric thickness logs for solver
- •AOI images and ET coverage snapshots
- •SPC tracking of mean/σ/Cpk across lots
Connect With Capabilities
Material choices tie directly into drilling, impedance, and assembly workflows.
Microvia <=0.10 mm
Blind and buried via strategies matched to materials.
TDR Impedance Testing
Coupon design and measurement to validate stackup targets.
Backplane PCB
High layer count programs using low-loss and hybrid stacks.
Frequently Asked Questions
Common questions about materials, stackups, and impedance validation.
How do I choose between FR-4, Low-Loss, and RF materials?
Match to your signaling: standard FR-4 for general digital, low-loss FR-4 for 10–25 Gbps, and RF laminates (e.g., Rogers) for RF/mmWave or tighter loss control.
Can you review my stackup and propose alternates?
Yes. Share layer count, targets, and constraints; we return tuned stackups with alternates, availability tiers, and risks.
Do you provide coupons and impedance testing?
Yes. We supply TDR coupons and acceptance (±5% typical), with correlation notes and dielectric thickness logs.
What are Express / NPI / MP lead time tiers?
Express prioritizes quick turns on approved stacks; NPI balances speed and validation; MP is production with full documentation and supply alignment.
Need stackup guidance or material samples?
Share your target stackup or BOM and we will respond with materials recommendations, lead time, and risk notes.