INSPECTION • REFLOW • TRACEABILITY

BGA Reballing Services for PCBA

Restore bare-die or packaged BGAs with pad conditioning, precision ball placement, controlled reflow, and full inspection so every device returns to your PCBA line plug-and-play ready.

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IPC Certified

Workmanship

X-ray + AOI

Inspection

Tape & Reel / Tray

Packaging

8 gated stepsProcess

Continuity + X-rayTesting

Tape/Reel + VacuumPackaging

Batch + Date codeTraceability

BGA first ball placement for PCB assembly

BGA first ball placement is a crucial step in the PCB assembly process, ensuring that BGA components are securely attached to the PCB for reliable performance. This process plays a key role in achieving optimal electrical and mechanical connections, especially in high-density, high-performance applications.

At APTPCB, we offer comprehensive PCB manufacturing and assembly services, which include precise integration of BGA components, ensuring the quality and functionality of your products across various industries. Whether for consumer electronics, industrial systems, or specialized applications, we ensure your PCBs are built to the highest standards.

BGA first ball placement process for new bare die chips

At APTPCB, we offer comprehensive PCB manufacturing and assembly services, including the critical process of first ball placement for new bare die BGA components. This essential step ensures that BGA components are properly prepared for high-performance PCB assemblies, enabling your devices to meet the most stringent reliability and performance standards.

Here's a detailed breakdown of the BGA first ball placement process for new bare die BGA chips, an integral part of our PCB assembly services:

Why professional BGA reballing matters

BGA first-ball placement is critical for creating reliable electrical and mechanical connections. Our turnkey PCB manufacturing and assembly teams integrate reballing so refurbished components meet the same standards as new silicon—ready for consumer, industrial, medical, and automotive deployments.

Every lot runs through documented inspection, reflow, cleaning, and packaging steps to guarantee repeatable performance when devices return to your SMT line.

Eight-step BGA reballing workflow

1
Incoming inspection
Verify pad integrity, substrate condition, cleanliness, and surface finish before processing.
2
Pad conditioning
Flux application, pre-tinning, cleaning, and microscopic inspection to ensure solderability.
3
Stencil alignment
Select proper aperture diameter, align die to stencil, and lock fixtures for repeatability.
4
Ball placement
Dispense pre-formed balls, distribute evenly, and confirm no missing or doubled locations.
5
Reflow soldering
Lead-free or leaded profiles (e.g., SAC305 / Sn63Pb37) precisely controlled for wetting and coplanarity.
6
Post-reflow inspection
Visual microscopy plus X-ray imaging to detect voids, bridges, or misalignment in hidden joints.
7
Final cleaning
Remove flux residues with IPA or approved chemistries, then verify surface condition.
8
Packaging & labeling
Tape-and-reel or tray load, vacuum seal with desiccant, and label alloy, diameter, batch, and date.

Inspection and quality control

Inspection tools

High-magnification review

Microscopy validates pad condition, solder sphere placement, and coplanarity.

X-ray analysis

Non-destructive imaging confirms internal joint quality for BGAs, QFNs, CSPs.

Moisture management

Dry cabinets, vacuum sealing, and MSL handling keep components production-ready.

Post-solder testing

Continuity checks

Electrical continuity and resistance measurements verify every connection.

Sample destructive testing

Cross-sections and pull/shear tests validate solder joint integrity when required.

Documentation

Inspection photos, X-ray images, and traveler data accompany each batch for traceability.

The importance of quality control in BGA reballing

Quality control is essential throughout the BGA reballing process to ensure that the component performs as expected. Here's how APTPCB maintains high-quality standards:

Advantages of professional BGA reballing services

Choosing professional BGA reballing services offers several advantages:

Why choose APTPCB

Capability highlights

Full-spectrum PCB solutions

Fabrication, PCBA, reballing, and box-build handled by one accountable team.

Advanced equipment

Latest reflow ovens, X-ray systems, automated alignment, and MSL-controlled storage.

Experience & expertise

IPC-certified engineers with deep failure analysis and process optimization knowledge.

Quality & support

Traceability

Batch, alloy, ball diameter, and production date captured on every traveler.

Compliance

Processes aligned with IPC/WHMA-A-620 and customer-specific quality requirements.

Responsive service

Dedicated support teams coordinate prototypes, repairs, and volume refurb programs.

Need BGA reballing coverage?

Share device lists, alloys, ball diameters, and required throughput—we’ll return a documented process, schedules, and pricing within one business day.

BGA Reballing Services for PCBA

Get an Instant Quote

Incoming inspection

Pad conditioning

Stencil alignment

Ball placement

Reflow soldering

Post-reflow inspection

Final cleaning

Packaging & labeling