High-Speed Loss Budget
Megtron 6/7/U keep insertion loss within 0.3–0.5 dB/in at 28–56 GHz, critical for 56/112 G lanes.
- Df as low as 0.0010 (Megtron U)
- Spread-glass mitigates weave skew
- Supports long backplanes and AI fabrics
Materials
Panasonic Megtron 4/6/7/U PCB Manufacturing
We build Megtron 4/6/7/U stacks for AI accelerators, PCIe Gen5/Gen6 cards, and 56/112 Gbps backplanes. The stack notes, glass mapping, and loss-control data come from Panasonic datasheets plus RayPCB/RayMing deployments, allowing us to hit COM budgets and warpage targets consistently.
Get an Instant Quote
Why Teams Choose Megtron
Thermal & Mechanical Headroom
Tg ≥200 °C with 45–55 ppm/°C Z-axis CTE keeps sequential lam builds stable through multiple reflows.
- Low-CTE bonds microvia stacks
- Warpage <0.7% on 600 mm panels
- Lead-free assembly proven
Predictable SI Validation
Material constants align with Panasonic data; we ship Ra/Rz, TDR, and COM overlays for each lot.
- Huray coefficients from measurements
- COM template for 56/112 G lanes
- S-parameters zipped with pack
Megtron Portfolio Coverage
| Series | Dk / Df @10 GHz | Use Case |
|---|---|---|
| Megtron 4 | Dk 3.6 / Df 0.008 | Enhanced FR-4 replacement for 25–28 G |
| Megtron 6 | Dk 3.4 / Df 0.002 | 56 G SerDes, PCIe Gen5 backplanes |
| Megtron 7 | Dk 3.3 / Df 0.0014 | 112 G PAM4 cards with low loss |
| Megtron U | Dk 3.2 / Df 0.0010 | Ultra-low loss for long-reach AI fabrics |
| Megtron 8 / GX | Dk 3.25 / Df 0.0011 | Co-extruded low-loss options (on request) |
Representative Megtron Properties
| Material / Thickness | Dielectric Constant | Dissipation Factor | Notes |
|---|---|---|---|
| Megtron 6 (0.010 in) | 3.40 ±0.05 | 0.0020 | Workhorse for 56 G backplanes |
| Megtron 7 (0.008 in) | 3.30 ±0.03 | 0.0014 | Spread-glass laminate |
| Megtron U (0.006 in) | 3.20 ±0.03 | 0.0010 | Ultra-low loss / optical modules |
| Megtron 4 (0.014 in) | 3.60 ±0.05 | 0.0080 | FR-4 drop-in for 10–25 G |
| Megtron 6 Prepreg R-5725 | 3.40 | 0.0025 | Pairs with stacked microvia builds |
Panasonic datasheet values mirrored via RayPCB archives; verify actual lots for solver entries.
Megtron Stackup References
18-Layer Megtron 6 Backplane
Differential stripline fabrics with VIPPO connectors and copper coins.
- Spread-glass callouts per layer
- Backdrill residual <8 mil
- COM/eye report included
12-Layer Megtron 7 Accelerator
Mix of Megtron 7 signals and Megtron 6 planes for PCIe Gen6 cards.
- 3/3 mil LDI imaging
- VIPPO fill + planarization logs
- VLP copper spec archived
8-Layer Megtron U Link Board
Short-reach 112 G lane board with air cavity connectors.
- Hybrid Megtron U/6 combination
- Cavity milling ±25 µm
- S-parameters zipped with data pack
Megtron Manufacturing Controls
Prebake & Lamination
All cores/prepregs baked at 120 °C and pressed with documented temperature/pressure ramps.
- Prebake 2–4 h before lam
- Press curves captured as SPC
- Thickness SPC ±5%
Microvia Reliability
Stacked microvias qualified via IST/CAF, cross-sections, and plating thickness checks.
- IST >1000 cycles target
- CAF coupons run per lot
- Laser drill + fill recipes logged
Copper Roughness Documentation
VLP/HVLP foil certs attached with Ra/Rz plus micro-etch SPC for solver inputs.
- Profilometer snapshots in traveler
- Huray factors shared
- Loss model overlay vs measurement
SI Validation Package
TDR, VNA, eye/COM analysis and optional crosstalk sweeps accompany shipments.
- ±5% impedance acceptance
- Insertion loss vs frequency table
- COM score summary
Application Snapshots
AI Accelerator Baseboards
Megtron 7/6 mix with heavy copper rails for accelerator sleds.
- Copper coin heat paths
- VIPPO connectors
- Thermal/ESS data packs
Hyperscale Backplanes
Megtron 6 18–26 layer backplanes for 56 G/112 G fabrics.
- Backdrill depth control ±3 mil
- Connector pad reinforcement
- Serial-numbered coupons
PCIe Gen6 Cards
Megtron 7/U cards with 3/3 mil lines and stacked microvias.
- VIPPO + filled via planarity
- S-parameters zipped per lot
- Compliance-ready COM data
Megtron Stack Selection Prompts
Questions we run through before freezing a Megtron program.
Channel targets
Loss budget, reach, and connector set drive Megtron 4 vs 6 vs 7/U choice.
- Lane length
- Connector families
HDI strategy
Define stacked/staggered microvias, VIPPO, and coin locations early.
- Via stack plan
- Coin/backdrill notes
Validation scope
Agree on TDR, IL, COM, and ESS deliverables per build.
- Coupon placement
- COM/eye requirements
Megtron FAQ
Do you stock Megtron laminates?
Yes. Megtron 4/6/7 cores and 6-series prepregs are stocked in common thicknesses; Megtron U or specialty glass styles can be expedited from Panasonic.
How do you control roughness for SI models?
Foil certificates and profilometer measurements are attached to every traveler, and Huray coefficients are updated to match measured S-parameters.
What validation data ships with each lot?
TDR coupons, insertion loss sweeps, COM/eye templates (upon request), IST for microvias, and environmental/ESS logs for qualification lots.