Wearables
Foldable display hinge
0.075 mm PI, copper coins, PSA stiffeners, and 20k-cycle bend testing for consumer hinge devices.
0.075 mm20k cyclesPSA stiffener
FLEX / RIGID-FLEX PCBA
Flex & Rigid-Flex Assembly — Carriers, Stiffeners, Reliability
Carrier tooling, stiffener bonding, laser coverlay, and staged handling purpose-built for flex boards, tails, and rigid-flex harnesses that must survive tight bends and connectors.
- Adhesiveless PI + LCP stackups with 25 µm coverlay registration
- Carrier pallets, vacuum fixtures, and peelable mask handling
- Stiffener, PSA, and heat-spreader bonding windows
- Dynamic bend + thermal cycling sign-offs tied to MES lots
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Tuned for thin flex cores
Lines, tooling, and inspection routines are configured around thin dielectrics and complex bend radii.
25 µm
Coverlay registration
Laser-prepped openings and cameras verify copper exposure.
01005 / 0.3 mm
Placement window
SMT heads, carriers, and reflow recipes mapped for flex films.
10,000 cycles
Dynamic bend proof
Mandrel and torsion rigs tied to SPC to validate every build.
FLEX COVERAGE
Coverage tailored for flex and rigid-flex builds
From stackup intake to carriers, stiffeners, SMT, and final test, every stage is anchored to reliability deliverables.
Stackup & stiffeners
Capture PI/LCP thickness, copper weights, PSA and FR-4 stiffener layouts.
Carrier & tooling
Vacuum, framed, and Kapton-backed pallets prevent distortion through print/reflow.
Assembly & handling
Low-tension peel, nitrogen reflow, selective solder, and hand ops with microscopes.
Reliability & test
AOI/X-ray plus bend, thermal shock, and continuity verification per tail.
WORKFLOW
Evidence-driven flex workflow
Each traveler ties stackup details, tooling, and verification checkpoints to the build.
1
Stackup intake
Review PI/LCP stackup, stiffener map, copper balance, and bend radii with engineering.
2
Tooling & carriers
Design vacuum plates, peel tabs, PSA/stiffener presses, and alignment pins.
3
Assembly & inspection
SMT/THT with flexible carriers, inline AOI, X-ray for BGA/buried joints, and 100% visual.
4
Reliability release
Mandrel bend, flex-to-install, and thermal cycling data logged before shipment.
PORTFOLIO
Representative flex & rigid-flex programs
Wearables, radar harnesses, and medical imaging tails proven on flex-ready cells.
Wearables
Radar
Medical
CAPABILITIES
Capabilities built around thin cores
Carrier-ready SMT, stiffener bonding, and verification kits specific to flex builds.
Materials
PI / LCP thickness0.05–0.15 mm
Copper0.25–2 oz mixed flex/rigid
Coverlay25 µm laser aligned
StiffenersFR-4, PI, SUS, aluminum
Assembly
Placement01005 / 0.3 mm CSP
ReflowNitrogen 8/10 zones
Selective solderLaser + mini-wave
BondingPSA, epoxy, heat-spreader
Reliability
Dynamic bend≤6×T, up to 20k cycles
Thermal shock-40~125 °C, 500 cycles
ContinuityLive monitoring
TraceabilityMES + barcodes
Controlled environment
ESD flooring, MSD storage, low-humidity staging, and microscope workstations tuned for flex.
QUALITY
Quality controls for flex builds
Handling, inspection, and reliability sign-offs aligned with flex-specific failure modes.
Low-stress handling
Antistatic trays, magnetic clamps, and microscope-assisted touch-up prevent creasing.
Optical + X-ray coverage
AOI with flex-specific rules plus X-ray for rigid transitions and hidden pads.
Bend & thermal proof
Mandrel cycling, flex-to-install, and thermal shock data appended to each C of C.
Industries & use cases
Consumer wearables
Foldable hinges, display interposers, haptics, and antenna tails.
Telecom & radar
LCP flex lines, phased array feeds, and rigid-flex controllers.
Medical & imaging
Sterilizable probe tails, catheter flex, and UDI-ready harnesses.
Industrial automation
Robotic harnesses, sensor tails, and wear-resistant flex jumpers.
Flex & rigid-flex assembly review
Upload your stackup, Gerber, BOM/AVL, stiffener outline, and bend criteria to receive a detailed assembly and reliability plan.
Frequently Asked Questions
Everything you need to know about HDI PCB technology