18-layer FR4 builds with blind/buried vias, ±5% impedance releases, and Class 3 documentation tuned for server, medical, and industrial platforms.

Dynamic flex and LCP stackups with adhesiveless copper, coverlay registration ≤35 µm, and bend qualification for wearables and radar harnesses.

3–12 layer flex cores laminated to rigid sections with laser depth checks, epoxy-filled transitions, and press-fit fixturing for aerospace harnesses.

1+N+1 to 5+N+5 HDI with 0.10 mm microvias, copper-filled VIPPO, and sequential lam presses logging delta-T/pressure every 30 seconds.

Metal-core and heavy copper platforms with >12 W/m·K thermal paths, copper coins, and flatness controls above 150 °C continuous use.

01005 and 0.20 mm pitch placement, inline SPI/AOI/AXI, ICT/boundary scan, and serialized travelers from prototype through mass production.

Orbotech LDI, YAG/CO₂ lasers, vacuum lamination, and SPC-driven plating centers visualized inside the facilities tour.

Panasonic/ASM SMT lines with selective solder, conformal coat, and robotic depanel plus automated stencil cleaning routines.

Reference designs, evaluation boards, and turnkey box-build examples ready for procurement teams to benchmark.

Cross-section, TDR, ion chromatography, and failure analysis labs with <15 minute logging between checkpoints.

ISO/IATF/AS9100 credentials, PPAP templates, and audit-ready control plans maintained by the compliance team.

Environmental stress, HALT/HASS, and burn-in chambers plus electrical validation bays for system-level sign-off.

0.075–0.10 mm laser microvias with 60–80 µm dielectric spacing and copper-filled VIPPO keep planarity ≤15 µm while ΔR stays ≤10% through 1,000 IST cycles.

Up to four sequential presses log temperature/pressure every 30 s, hold registration within ±25 µm, and keep dielectric growth within ±5% for controlled-impedance coupons.

1+N+1 to 5+N+5 builds use ≤100 µm microvias and resin-filled VIPPO to route 0.35 mm BGAs; stacked vias are X-rayed after each lamination cycle.

Mechanical drilling supports 0.25 mm holes through 2.4 mm cores (10:1 AR) and pulse plating delivers ≥25 µm barrel copper verified by microsections.

Depth-controlled backdrill leaves ≤0.15 mm residue with ±75 µm depth accuracy while TDR overlays prove 92–100 Ω differential targets.

Expanded holes hold ±0.025–0.05 mm, barrel copper remains 25–28 µm after ream, and ionic cleanliness stays ≤1.56 µg/cm² to protect insertion force.

Copper-filled via-in-pad structures keep planarity ≤15 µm, void area <5%, and laser diameters at 0.075–0.10 mm for 0.35 mm pitch packages.

Coupons sweep 100–4000 MHz with solder-mask offsets (−2 Ω SE / −8 Ω diff) recorded so stackups release within ±5% tolerance.

Inline AOI captures 25 µm detail while 130 kV 3D X-ray resolves 5 µm voxels; BGA voids stay ≤20% and copper fill evidence is archived per lot.

Flying probe touches 0.10 mm pads, hipot pushes 500 V, and Kelvin continuity stay ≤20 mΩ with IPC-9252 reporting on every lot.

Embedded/buried/I-coins add >12 W/m·K thermal paths, hold planarity above 150 °C continuous use, and pass ±125 °C cycling for 500 cycles.

Electroless nickel 3–6 µm plus 0.05–0.125 µm gold keeps CSP pads flat and vacuum-packed panels retain >12 months of solderability.

3–5 µm nickel, 0.10–0.15 µm palladium, and 0.05 µm gold provide wire-bond readiness with phosphorus <9% to mitigate black-pad risk.

Edge fingers receive 1–1.5 µm hard gold over 3–6 µm nickel with chamfer ±3° and wear testing beyond 500 mating cycles.

Lead-free HASL controls solder thickness at 1–40 µm with ≤25 µm planar swing while cleanliness remains ≤1.56 µg/cm².

0.20–0.50 µm OSP films survive double reflow within 12 h and neutral rinses hold copper color shift to ΔE <2.

0.12–0.25 µm silver layers keep contact resistance <10 mΩ and sulfur barriers maintain whiteness for 12 months of storage.

0.8–1.2 µm tin with a 150 °C/1 h post-bake suppresses whiskers and limits intermetallic growth to <1.5 µm.

LDI-written masks enforce ≥0.10 mm dams, color-specific bridges of 5.5–7.5 mil, and single-side via plugs capped at 35.4 mil drills.

ROSE testing holds Class 2 at ≤1.56 µg/cm² and Class 3 at ≤0.78 µg/cm², with SIR coupons ≥100 MΩ after 85 °C/85% RH.

• •Rigid PCB Capability
• •Flex PCB Capability
• •Rigid-Flex PCB Capability
• •HDI PCB Capability
• •Metal PCB Capability

• •PCB Assembly Capability
• •Prototype Assembly
• •Mass Production Assembly
• •Assembly File Requirements
• •Assembly Process
• •PCB Assembly FAQ

• •Controlled Impedance Stackups
• •Material AVL & Vendors
• •Downloads & Materials Hub

• •PCB Equipment Tour
• •SMT Equipment Overview
• •PCB Laboratory
• •Electronic Laboratory
• •PCB & PCBA Products

• •Quality Assurance Programs
• •AOI / X-Ray / ICT
• •Electrical Test
• •Traceability & Documentation
• •BOM & Cost Guidance
• •Blog & Insights

• •Microvia ≤0.10 mm
• •Sequential Lamination
• •Any-Layer / ELIC
• •High Aspect Ratio
• •Backdrill
• •Press-Fit Holes
• •VIPPO (Via-in-Pad)
• •Copper Coin Thermal
• •Surface Finishes (ENIG / ENEPIG)
• •Cleanliness & Ionic

• •Drilling, lamination, plating, and imaging CTQs run with Cp/Cpk ≥1.33; 3σ boundary hits notify factory engineering within two hours for corrective action.
• •Dashboards log hole diameter, copper thickness, mask shift, and ΔR sampling every 30 panels so PPAP traceability is always within a single barcode scan.

• •Travelers capture prebake, lamination, AOI, AXI, and FAI checkpoints with <15 min spacing. Audit retrieval stays under 60 seconds per lot using serialized IDs.
• •Release reports bundle TDR traces, ionic cleanliness (≤1.56 / ≤0.78 µg/cm²), and microsection photos up to 1,000× magnification, plus 8D close-out notes when trends shift.

• •Workmanship follows IPC-A-600/6012 Class 3 alongside ISO 9001, ISO 14001, ISO 13485, IATF 16949, AS9100, UL, and RoHS/REACH credentials refreshed quarterly.
• •PPAP, FAI, certificates of conformance, and material declarations ship in PDF/XML formats, and change notices issue ≥30 days before AVL or process updates.

• •Material AVL tagged with lead times, resin content, and Dk/Df ranges for sub-24-hour RFQ support. Alerts fire when inventory drops below two-week safety stock on key laminates.
• •Design package checklist covers Gerbers/ODB++, IPC-2581, controlled impedance notes, and stackup targets. Missing items such as 01005 pad data or blind-via specs trigger redlines within 12 hours.
• •Early risk review references IPC-4761 via protection and IPC-2221 creepage rules for safety-critical builds. Findings quantify clearance shortfalls in 0.05 mm steps so mitigations remain traceable.

• •Control plan ties drilling, lamination, plating, and imaging CTQs to AIAG-VDA PFMEA severity rankings. Sampling frequency is documented in panels-per-lot with escalation thresholds set ahead of launch.
• •Qualification run includes microsection, ionic cleanliness, and TDR coupons with baseline data stored for audits. ΔR results must stay within ±5% and cleanliness ≤1.56 µg/cm² before green light.
• •SPC dashboards monitor hole diameter, copper thickness, and solder mask alignment with Cp/Cpk alerts to factory engineering. When Cp drops below 1.33, MES issues corrective tasks and locks shipments.

• •PCBA readiness bundle locks stencil thickness, fiducials, and paste window per IPC-7525 before SMT kickoff. Stencil thickness options are documented in 0.02 mm increments to match component mix.
• •DFT review aligns flying probe, ICT, and boundary scan requirements so fixtures can be commissioned in parallel. Coverage metrics verify ≥95% nodal contact before production approval.
• •Logistics plan documents serialization, packing, and ESD handling per IEC 61340 for shipment readiness. Packaging torque and label checks complete within 8 hours of final QA sign-off.