Automotive
Automotive inverter
PPAP-level ICT, burn-in, and hi-pot reporting with CAR traceability.
ICTBurn-inHi-pot
INSPECTION • TEST • RELIABILITY
Testing & Quality — Evidence for Every Lot
Inline SPI/AOI/AXI, flying probe, ICT/FCT, boundary-scan, burn-in, ESS, and cleanliness programs run under one traveler so supply chain, engineering, and quality share the same coverage data.
- 100% SPI and 3D AOI with SPC
- Flying probe + ICT/FCT + boundary-scan
- Hi-pot ≤5 kV and ionic cleanliness logs
- 12–48 h burn-in & ESS tied to MES
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Coverage that keeps FPY at 98–99%
Layered inspection, electrical test, and reliability screens expose risk before boards ship.
100%
SPI/AOI
Closed-loop printer feedback and 12 µm AOI.
≥80%
ICT nets
Fixtures, limit files, and golden samples governed in MES.
12–48 h
Burn-in/ESS
Thermal, humidity, vibration, and hi-pot up to 5 kV.
COVERAGE
Coverage from inspection through reliability
Inspection, test, and reliability teams share the same travelers, SPC dashboards, and corrective action loops so any deviation is captured in hours, not days.
Inspection layer
3D SPI, pre/post AOI, sample AXI, and post-wave AOI feed SPC dashboards.
Electrical test
Flying probe, ICT/FCT, boundary-scan, and firmware load under one plan.
Reliability & safety
Burn-in 12–48 h, ESS, hi-pot ≤5 kV, ground bond, and leakage tests.
Traceability & reporting
MES logging, cleanliness reports, CAR status, and waveform archives per lot.
PLAYBOOK
Testing & quality workflow
Coverage is planned alongside build so fixtures, screens, and reports are ready before the first lot.
1
DFT intake
Upload BOM, XY, netlists, schematics, and reliability specs for review.
2
Coverage architecture
Map SPI/AOI, ICT/boundary-scan, FCT, and burn-in to CTQs.
3
Fixture & program build
ICT, flying probe, boundary-scan, firmware load, and burn-in recipes locked in MES.
4
Execute & monitor
Run inspection/test/ESS with SPC dashboards and live alerts on CpK, FPY, and trends.
5
Report & improve
Deliver FPY, CAR, cleanliness, hi-pot, and burn-in logs with corrective actions.
PORTFOLIO
Representative test programs
Examples of inspection + electrical + reliability stacks we run each quarter.
Automotive
Medical
Industrial
RF
CAPABILITIES
Inspection, test & reliability capabilities
Equipment and processes tuned for proof of quality across regulated industries.
Inspection
SPI3D, ±10% volume
AOI12 µm 3D pre/post
AXI3D sampling, 5–10 µm slices
Post-waveAOI + X-ray
Electrical test
Flying probe0.01 mm accuracy
ICT≥80% nets, Kelvin, MDA
Boundary-scanIEEE 1149.1/.6
FCTCustom fixtures + firmware
Reliability & safety
Burn-in12–48 h, 125 °C
ESSThermal, humidity, vibration
Hi-pot≤5 kV AC/DC
Cleanliness≤1.56 µg/cm²
Controlled test labs
ESD and humidity-controlled labs with MES logging, fixture storage, and calibration programs.
QUALITY
Quality stack
Layered inspection + electrical + reliability data ensures no build ships without evidence.
Inline inspection
3D SPI/AOI, sample AXI, and post-wave verification with SPC alerts.
Electrical coverage
Flying probe, ICT, boundary-scan, and FCT maintained with golden units and firmware control.
Reliability proof
Burn-in/ESS, hi-pot, ground bond, and cleanliness logs attached to each traveler.
Industries & use cases
Automotive electronics
PPAP-ready FPY, ICT, burn-in, and hi-pot logs for ECU and inverter programs.
Medical devices
ISO 13485 cleanliness, traceability, and reliability evidence for Class II/III builds.
Industrial & energy
Rugged controllers verified with ESS, hi-pot, and conformal coat inspections.
Compute & RF
Boundary-scan, FCT, RF calibration, and thermal screens for high-value boards.
Testing & quality engagement
Upload files to receive a coverage proposal with inspection, ICT/FCT, burn-in, and reporting scope.
Frequently Asked Questions
Everything you need to know about HDI PCB technology