Microvia Technology
Precisely drilled laser microvias (blind, buried, stacked, staggered, via-in-pad) enable ultra-high routing density and improved signal integrity.
HDI PCB Capability
High-Density Interconnect (HDI) PCB Manufacturing
APTPCB specializes in advanced High-Density Interconnect (HDI) PCB solutions enabling compact, high-performance electronic devices. We offer comprehensive HDI manufacturing from concept to production, including microvia technology, sequential build-up (SBU), fine-line routing, and controlled impedance for smartphones, wearables, medical devices, automotive, aerospace, and high-speed networking applications.
Get an Instant Quote
The APTPCB Advantage in HDI PCB Manufacturing
HDI PCBs are crucial for modern electronics demanding smaller footprints, increased functionality, and superior electrical performance. APTPCB leverages cutting-edge technology and processes to deliver advanced HDI solutions.
Sequential Build-Up (SBU)
Multi-lamination processes allow for complex HDI structures (1+N+1, 2+N+2, Any Layer HDI/ELIC) that optimize space and performance.
Fine Line & Space
Achieving minimal trace widths and spaces (3/3 mil) for high-density interconnects with tighter capabilities down to 2/2 mil possible.
Controlled Impedance
Ensuring precise impedance control (±5%) for high-speed signal transmission and signal integrity.
Advanced Materials
Utilizing a wide range of high-performance and specialty materials (FR4, high-Tg, polyimide, Rogers, Arlon, Teflon, Taconic) tailored to your application.
Integrated Assembly Services
Comprehensive HDI PCB assembly services with SMT, THT, mixed assembly, and component sourcing for complete turnkey solutions.
HDI PCB Manufacturing Capabilities – Detailed Specifications
| Item | Capability | Notes |
|---|---|---|
| Max Layer Count | Up to 32 Layers (Standard), 64 Layers (Advanced) | For highly complex and integrated designs |
| HDI Build Configurations | 1+N+1, 2+N+2, 3+N+3, 4+N+4, Any Layer HDI (ELIC) | Full spectrum from moderate to ultra-high density interconnection |
| Min Trace/Space (Finished) | 3/3 mil (0.076 mm) | Tighter capabilities down to 2/2 mil (0.0508 mm) possible after DFM review |
| Min Flex Core Thickness | 0.001″ (0.025 mm) | For adhesiveless polyimide film (relevant for HDI rigid-flex) |
| Copper Weights (Finished) | 0.5–2 oz (18–70 µm) | Standard for HDI; up to 3 oz (105 µm) in specific rigid core layers |
| PCB Thickness | 0.40–8.0 mm | Customizable based on application and layer count |
| Max Panel Size | 24 × 18 inch (610 × 457 mm) | Optimized for laser drilling machine capabilities |
| Min Mechanical Drill Diameter | 0.006″ (0.15 mm) | For through-holes in core layers |
| Min Laser Drill Diameter (Microvia) | 0.003″ (0.075 mm) | Advanced capability for microvias; standard is 0.004″ (0.10 mm) |
| Microvia Types | Blind, Buried, Stacked, Staggered, Via-in-Pad (VIP) | Supporting complex HDI layer interconnections |
| Max Through-Hole Aspect Ratio | 10:1 | For mechanical drills |
| Max Blind Via Aspect Ratio | 0.75:1 | For laser-drilled microvias |
| Min Finished Hole Size (PTH) | 0.006″ (0.15 mm) | Smallest finished plated through-hole |
| Min Annular Ring | 1 mil (0.025 mm) | For reliable via connections |
| Controlled Impedance Tolerance | ±5% | Highly precise control for critical high-speed signals |
| Base Materials | FR4 (Standard/Mid/High Tg), Halogen-free FR4, Polyimide, Rogers, Arlon, Teflon, Taconic, Specialty High-Frequency Materials | Diverse material selection for optimal electrical and thermal performance |
| Surface Finishes | ENIG, Immersion Tin, Immersion Silver, OSP, Electrolytic Gold (Hard/Soft), Lead-free HASL | Comprehensive options including Soft Wire Bondable Gold |
| Solder Mask Colors | Green, Black, Blue, Red, White | Other colors available on request |
| Solder Mask Registration | Within 0.002″ (0.051 mm) | For precise solder mask openings |
| Solder Mask Min Dam Size | 0.003″ (0.076 mm) | For fine pitch components to prevent bridging |
| Legend (Silkscreen) Colors | White, Black, Red, Yellow | Other colors available on request |
| Min Legend Line Width/Height | 3.5/20 mil (0.089/0.508 mm) | For clear marking on dense boards |
| Thickness Tolerance | ±0.002″ (±0.051 mm) or ±10% (whichever is greater) | For precise board stack-up |
| Bow & Twist | ≤0.05% (typical, per IPC measurement) | For optimal flatness in complex HDI structures |
| Filled Vias | Conductive (copper-filled), Non-Conductive | Essential for stacked microvias and enhanced thermal management |
| Sequential Laminations | Up to 4 sequential laminations | For building advanced HDI structures |
| Quality Standards | IPC-A-600 Class 2/Class 3 | All PCBs manufactured to rigorous industry standards |
| Certifications | ISO 9001:2015, UL Certified | RoHS & REACH compliant; IATF 16949 (automotive) on request |
| Electrical Test | 100% E-test (Flying Probe or Fixture Test) | Comprehensive testing for opens/shorts and continuity |
| Quality Control & Inspection | AOI, 3D AOI, 3D SPI, X-Ray Inspection, First Article Inspection | Multi-point inspection throughout manufacturing |
| Typical lead time | 10–25 working days | Varies by HDI configuration, complexity, and production volume; early engagement recommended |
Integrated HDI PCB Assembly Services
APTPCB offers comprehensive HDI PCB assembly services, providing a complete turnkey solution from bare board manufacturing to fully tested, functional products.
| Item | Capability | Notes |
|---|---|---|
| Min SMT Component Size | 01005 (0.4 × 0.2 mm) | For ultra-dense component placement |
| Min BGA / CSP Pitch | 0.3 mm (12 mil) | Accurate placement for extremely fine-pitch packages (CPU, GPU) |
| Max Component Height | Up to 25 mm (top/bottom side) | Accommodating various component profiles |
| Assembly Technologies | SMT, THT, Mixed Assembly | Full range of assembly options |
| Soldering Processes | Lead-free Reflow, Wave Soldering (THT), Selective Soldering | Optimized processes for different component types and materials |
| Inspection & Testing | AOI, 3D AOI, 3D SPI, X-Ray Inspection, ICT, FCT | Rigorous post-assembly inspection to ensure quality and functionality |
| Conformal Coating | Available on request | For environmental protection in harsh conditions |
| Component Sourcing | Full Turnkey (Component Procurement & Assembly) | Streamlined supply chain management |
HDI PCB Manufacturing Process
- 1
Design Review & Intake
Collect HDI design files, layer stack-up requirements, impedance specifications, and performance targets. Verify compatibility with manufacturing capabilities.
- 2
Stack-up & Microvia Planning
Optimize layer configurations, define microvia placement strategy (blind, buried, stacked, staggered, VIP), and plan sequential lamination build-up.
- 3
Material & Impedance Design
Select base materials, define controlled impedance specifications, and validate electrical performance through simulation.
- 4
Sequential Lamination Build
Execute multi-stage lamination process (1+N+1, 2+N+2, etc.), drilling, plating, and patterning for each build stage.
- 5
Microvia Drilling & Processing
Perform laser drilling for microvias, copper fill/planarization, and stacking/staggering per design specifications.
- 6
Fine-Line Patterning & Plating
Pattern fine-line traces (3/3 mil or tighter), apply controlled plating, and maintain impedance tolerance throughout.
- 7
Surface Finish & Testing
Apply surface finish (ENIG, OSP, etc.), perform 100% electrical testing, and validate impedance and signal integrity.
- 8
Quality Assurance & Inspection
Comprehensive AOI, X-ray inspection, microsection analysis, and reliability validation before shipment.
Design for Manufacturability (DFM) Support
Our engineering team provides comprehensive DFM guidance to optimize your HDI PCB designs for performance, reliability, and cost-effectiveness.
Expert Stack-up & Microvia Design
Optimizing layer configurations and microvia placement for maximum routing efficiency and signal integrity.
Material Selection Support
Advising on the best high-performance, low-loss, or specialty materials for your specific electrical and thermal needs.
Comprehensive DFM & DFA Reviews
Proactively identifying and resolving potential manufacturing and assembly challenges before production.
Signal & Power Integrity Analysis
Ensuring robust electrical performance for high-speed designs with precise impedance control and validation.
HDI PCB Applications
HDI PCBs enable next-generation electronics across multiple industries demanding miniaturization, high performance, and reliability.
Smartphones & Mobile Devices
Ultra-compact designs with high component density and advanced signal integrity for mobile processors and connectivity.
Wearable Electronics
Miniaturized HDI solutions for smartwatches, fitness trackers, and health monitoring devices with space constraints.
Medical Equipment
High-reliability HDI PCBs for diagnostic devices, implantable electronics, and medical sensors with biocompatibility requirements.
Automotive Electronics
Advanced driver assistance systems (ADAS), infotainment, and control modules with automotive-grade reliability (IATF 16949).
Aerospace & Defense
Mission-critical HDI solutions for avionics, radar systems, and defense electronics with extreme reliability requirements.
High-Speed Networking
Data center networking, 5G infrastructure, and high-frequency RF applications requiring controlled impedance and signal integrity.
Frequently Asked Questions
What is HDI (High-Density Interconnect)?
HDI refers to PCBs with higher wiring density than standard boards, achieved through microvias, fine-line routing, and sequential build-up. This enables compact, high-performance designs for smartphones, wearables, and advanced electronics.
What microvia sizes do you support?
We support laser-drilled microvias from 0.075–0.10 mm diameter. Microvias can be blind, buried, stacked, staggered, or via-in-pad (VIP) depending on your design requirements.
What is sequential build-up (SBU)?
Sequential build-up is a manufacturing process where HDI layers are built in stages, with lamination and drilling cycles repeated to create complex interconnection patterns. We support up to 4 sequential laminations.
What is the maximum layer count for HDI PCBs?
APTPCB supports 32–64 layer HDI PCBs. Layer count depends on your specific HDI configuration (1+N+1, 2+N+2, 3+N+3, 4+N+4, or ELIC).
What HDI configurations do you support?
We support 1+N+1, 2+N+2, 3+N+3, 4+N+4, and ELIC (Every Layer Interconnect) configurations. Each configuration offers different density and cost tradeoffs.
Can you support controlled impedance on HDI PCBs?
Yes, we maintain ±5% impedance tolerance on HDI designs through careful stack-up design, trace geometry optimization, and TDR coupon validation.
What is the minimum trace and space width on HDI PCBs?
Standard capability is 3/3 mil (0.076 mm) for both inner and outer layers. Tighter geometries are possible after design-for-manufacturing review.
What is your typical lead time for HDI PCBs?
Lead times typically range from 10–25 working days depending on complexity, layer count, HDI configuration, and production volume. Early engagement helps optimize schedule.
Partner with APTPCB for Next-Generation HDI PCB Innovation
The complexity of HDI PCBs demands close collaboration between designer and manufacturer. APTPCB encourages early engagement to leverage our expertise throughout your product development lifecycle. Share your preliminary layout, stack-up requirements, and performance targets with our engineering team.