Compute
Compute accelerator
0.3 mm BGA with boundary-scan, underfill, and vacuum reflow logs.
Boundary-scanUnderfillVacuum
0.3 MM PITCH • 01005 • VOID CONTROL
Fine-Pitch BGA & QFN Assembly — Predictable Hidden Joints
DFM, stencil/paste, ±25 µm placement, nitrogen reflow, AXI/void tracking, underfill, and controlled rework keep hidden joints reliable across pilots and volume lots.
- BGA/QFN down to 0.3 mm pitch
- 01005 passives with ±25 µm placement
- 3D AOI + AXI + void analytics
- Underfill, staking, and ≤3-cycle rework
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Fine-pitch readiness
We pair process controls with inspection data so hidden joints ship with evidence.
0.3 mm
Pitch capability
Via-in-pad, PoP, copper-filled microvias supported.
±25 µm
Placement accuracy
Vision + vacuum support keep CpK ≥1.33.
<10%
BTC void target
Stencil/paste/profile tuning + vacuum dwell.
COVERAGE
Coverage from DFM to rework
Every gate—DFM, stencil, placement, reflow, inspection, underfill, rework—is coordinated by the same team so yield holds and rework cycles stay controlled.
DFM & land pattern
Pad design, mask clearance, via-in-pad fills, and copper balance reviews limit warpage.
Stencil & paste
80–120 µm step/nano stencils, Type 5/6 paste, and support tooling lock print windows.
Placement & reflow
±25 µm placement, vacuum support, nitrogen reflow ΔT ≤5 °C with thermocouples.
Inspection & rework
3D AOI, sample AXI, void reports, underfill, staking, and ≤3-cycle rework procedures.
PLAYBOOK
Fine-pitch workflow
Defined gates keep high-density BGA/QFN builds stable from intake through rework.
1
Package intake
Collect drawings, pad stacks, paste specs, and void targets.
2
Process tuning
Stencil/paste selection, placement, and reflow simulations.
3
Production run
SMT with 100% SPI/AOI, vacuum support, and nitrogen reflow.
4
Inspection & analytics
AXI, void reports, ionic checks, and SPC dashboards.
5
Underfill & rework
Execute underfill/staking and controlled ≤3-cycle rework with post-AXI.
PORTFOLIO
Representative fine-pitch programs
Hidden-joint builds we run every quarter with documented void control and rework limits.
Compute
Medical
Automotive
RF
CAPABILITIES
Fine-pitch capabilities
Tools, fixtures, and analytics sized for hidden-joint success.
Design enablement
Pitch0.3–0.5 mm
Passive01005
Stencil80–120 µm step
PasteType 5/6
Placement & reflow
Accuracy±25 µm
SupportVacuum + carriers
ReflowNitrogen ΔT ≤5 °C
VacuumDwell 15–25 s
Inspection & rework
AOI100% 3D
AXIRisk-based 3D
VoidAnalytics <10%
Rework≤3 cycles
Fine-pitch lab
Dedicated reflow, AXI, underfill, and rework labs with humidity control.
QUALITY
Quality controls
Inline inspection, AXI, and void analytics make hidden joints visible.
Solder print control
Area-ratio checks, paste height SPC, and printer feedback loops.
Void analytics
AXI sampling and C-SAM/void reports with <10% BTC targets.
Controlled rework
≤3 cycles with site dressing, paste print, and post-AXI verification.
Industries & use cases
Compute & AI
High-density BGAs with boundary-scan, underfill, and rework traceability.
Medical
Cleanliness, AOI/AXI, and rework logs for Class II/III devices.
Automotive
Void/hi-pot data and PPAP-ready evidence for ECUs and inverters.
RF & connectivity
Shielded RF modules with controlled reflow and void targets.
Fine-pitch engagement
Upload your files to receive a DFM, process, and inspection plan for hidden joints.
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