Industry Solutions

Stackups, Evidence & Timelines Proven in Mirror Data

40-layer / 0.300 in stackups, 24 h PCB prototypes, and -55~125 °C stress results are lifted straight from our mirrored manufacturing datasets so each industry program starts with real evidence.

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<24 hDFM Feedback
ROSE ≤1.5 µg/cm²Cleanliness
85/85/1000 hHumidity Proof
AS9100 / ISO 13485Traceability

Solutions Across High-Speed, Automotive, Medical & Consumer

Each industry route links PCB fabrication, PCBA coverage, and documentation so teams can align compliance, reliability, and cost windows with one playbook.

Server & Data Center

40-Layer

Backplanes with 35:1 aspect ratio drills, ±3 mil backdrill, and ≤500 µm cooling channels.

  • 40L / 0.300 in stackups
  • 15 µm copper-filled microvias
  • Cooling evidence >100 W/cm²
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Automotive / EV

IATF 16949

-40~125 °C stress windows, PPAP packs, and ROSE ≤1.5 µg/cm² cleanliness data.

  • PPAP Level 3 kits
  • DBC 140–350 µm copper
  • 85/85/1000 h damp heat
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Medical Devices

ISO 13485

DHR-ready builds with AOI >95%, 40× microscope checks, and ROSE ≤1.5 µg/cm² logs.

  • DHF/DHR templates
  • 85/85/1000 h humidity
  • Steam-aging solderability
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Telecom / 5G

RF & Optical

15 µm microvias, PTFE hybrids, and ±5% TDR/VNA correlation for 28–112G links.

  • PTFE / FR-4 hybrids
  • ≤0.25 mm microvias
  • ±5% impedance reports
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Aerospace & Defense

AS9100

Mission electronics with stackup evidence, humidity proofs, and full traceability.

  • AS9100 traceability
  • Thermal shock -55~125 °C
  • Conformal coat & cleanliness logs
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Drone / UAV

Weight Critical

Lightweight avionics, RF payloads, and power boards with IPC Class 3 focus.

  • HDI + RF hybrids
  • Embedded antennas
  • Vibration & drop validation
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Industrial Control & Automation

24/7 Duty

PLC, motion, and IO module PCBAs ruggedized for noise, heat, and cabinet installs.

  • Mixed-signal isolation
  • High-current copper pours
  • DIN-rail mechanical formats
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Power & New Energy

High Current

Solar, ESS, wind, and EV charger power stages with creepage/clearance evidence.

  • Thick copper stackups
  • Bidirectional converter tests
  • Thermal + surge data
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Robotics & Automation

Motion Control

Controller, drive, and perception PCBAs with deterministic networking and safety IO.

  • Servo drive power stages
  • Fieldbus / EtherCAT ready
  • Sensor fusion modules
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Security / Security Equipment

24/7 Monitoring

Cameras, access control, intrusion, and fire systems with PoE and backup coverage.

  • IP camera + NVR boards
  • Access + biometric controllers
  • Battery backup power PCBs
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Capabilities Underpinning Every Program

Lean on common process controls—from impedance correlation to cleanliness and box-build traceability—to keep launches predictable.

Quickturn Prototypes

24–48 h PCB prototypes with stackup, coupon, and cleanliness evidence baked in.

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Advanced PCB Manufacturing

HDI, RF hybrids, heavy copper, metal-core, and controlled impedance stackups.

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Drilling & Vias

Blind/buried, via-in-pad, backdrill, half-hole, and profiling controls ready to deploy.

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Testing & Quality

AOI, X-ray, flying probe, and FCT packaged with traceability for every industry handoff.

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From Discovery To Launch With One Team

Every industry engagement follows a structured playbook that keeps stackups, qualification evidence, and downstream PCBA plans aligned from the first call.

Discovery & Evidence Pull

Collect stackups, AVL limits, and stress targets; attach matching mirror data (e.g., 24 h prototypes, 40L stackups).

Stackup & DFM Alignment

Review dielectrics, copper, panelization, and cleanliness windows (ROSE ≤1.5 µg/cm², ±10% solder paste) before tooling.

Pilot & Validation

Execute -55~125 °C thermal shock, 85/85/1000 h damp heat, 5 Grms vibration, AOI >95%, then package reports for MP handoff.

Kits That Support Each Industry Rollout

Share stackup templates, compliance bundles, and coupon libraries directly from the industry pages to keep qualification on track.

Server Stackup Playbook

40-layer references, impedance coupons, and thermal vouchers mirroring current server programs.

Download Stackups →

Automotive DFM Pack

PPAP-ready templates, FMEA samples, and humidity / cleanliness data for EV control programs.

Get PPAP Kit →

Telecom RF Evidence

PTFE hybrid stackups, TDR plots, and VNA overlays for 28–112G infrastructure builds.

See RF Proof →

Industrial Control IO Kit

PLC stackups, mixed-signal isolation notes, and DIN-rail mechanical guidelines.

Access IO Kit →

Power & New Energy Evidence

Creepage/clearance tables, thick copper stackups, and converter stress data.

Review Power Data →

Case Studies Across Server, Automotive & Healthcare

See how engineering artifacts, validation plans, and production controls converge for industry programs already in market.

Server & Data Center Backplanes

±3 mil backdrill, 35:1 drills, and ≤500 µm cooling data mirrored from hyperscale fabrics.

Explore server route

Automotive / EV Control Modules

DBC 350 µm copper, -40~125 °C thermal shock, and PPAP Level 3 templates ready for review.

View automotive route

Medical Imaging & Diagnostics

ISO 13485 controls with AOI >95%, microscope photos, and ROSE ≤1.5 µg/cm² logs packaged for DHRs.

See medical route

Frequently Asked Questions

Quick answers for timelines, qualification evidence, and collaboration flows when we onboard your program.

What data underpins your industry playbooks?

Mirror datasets capture 40-layer / 0.300 in stackups, ±3 mil backdrill tolerances, 24 h PCB prototypes, ROSE ≤1.5 µg/cm² cleanliness, and -55~125 °C stress reports across high-speed, automotive, medical, and consumer programs.

How quickly can stackups and DFM reviews complete?

Discovery to stackup alignment typically closes in 3–5 business days; PCB prototypes follow the 24–48 h quick-turn promise published by lstpcb's EMS service.

Do you package compliance evidence?

Yes. Every launch includes stackup/coupon files, cleanliness & humidity logs, SPC dashboards, and ISO 13485 / IATF 16949 / AS9100 certificate bundles.

Need A Data-Backed Industry Launch?

Send stackups, stress targets, or PPAP / AS9100 checklists and we will return a mitigation plan with real mirror data inside 24 hours.