Server & Data Center
40-LayerBackplanes with 35:1 aspect ratio drills, ±3 mil backdrill, and ≤500 µm cooling channels.
- 40L / 0.300 in stackups
- 15 µm copper-filled microvias
- Cooling evidence >100 W/cm²
Industry Solutions
40-layer / 0.300 in stackups, 24 h PCB prototypes, and -55~125 °C stress results are lifted straight from our mirrored manufacturing datasets so each industry program starts with real evidence.
Each industry route links PCB fabrication, PCBA coverage, and documentation so teams can align compliance, reliability, and cost windows with one playbook.
Backplanes with 35:1 aspect ratio drills, ±3 mil backdrill, and ≤500 µm cooling channels.
-40~125 °C stress windows, PPAP packs, and ROSE ≤1.5 µg/cm² cleanliness data.
DHR-ready builds with AOI >95%, 40× microscope checks, and ROSE ≤1.5 µg/cm² logs.
15 µm microvias, PTFE hybrids, and ±5% TDR/VNA correlation for 28–112G links.
Mission electronics with stackup evidence, humidity proofs, and full traceability.
Lightweight avionics, RF payloads, and power boards with IPC Class 3 focus.
PLC, motion, and IO module PCBAs ruggedized for noise, heat, and cabinet installs.
Solar, ESS, wind, and EV charger power stages with creepage/clearance evidence.
Controller, drive, and perception PCBAs with deterministic networking and safety IO.
Cameras, access control, intrusion, and fire systems with PoE and backup coverage.
Lean on common process controls—from impedance correlation to cleanliness and box-build traceability—to keep launches predictable.
24–48 h PCB prototypes with stackup, coupon, and cleanliness evidence baked in.
Learn More →HDI, RF hybrids, heavy copper, metal-core, and controlled impedance stackups.
Learn More →Blind/buried, via-in-pad, backdrill, half-hole, and profiling controls ready to deploy.
Learn More →AOI, X-ray, flying probe, and FCT packaged with traceability for every industry handoff.
Learn More →Every industry engagement follows a structured playbook that keeps stackups, qualification evidence, and downstream PCBA plans aligned from the first call.
Collect stackups, AVL limits, and stress targets; attach matching mirror data (e.g., 24 h prototypes, 40L stackups).
Review dielectrics, copper, panelization, and cleanliness windows (ROSE ≤1.5 µg/cm², ±10% solder paste) before tooling.
Execute -55~125 °C thermal shock, 85/85/1000 h damp heat, 5 Grms vibration, AOI >95%, then package reports for MP handoff.
Share stackup templates, compliance bundles, and coupon libraries directly from the industry pages to keep qualification on track.
40-layer references, impedance coupons, and thermal vouchers mirroring current server programs.
Download Stackups →PPAP-ready templates, FMEA samples, and humidity / cleanliness data for EV control programs.
Get PPAP Kit →ISO 13485 certificates, DHR templates, and AOI/X-ray logs tied to medical launches.
View Compliance Docs →PTFE hybrid stackups, TDR plots, and VNA overlays for 28–112G infrastructure builds.
See RF Proof →PLC stackups, mixed-signal isolation notes, and DIN-rail mechanical guidelines.
Access IO Kit →Creepage/clearance tables, thick copper stackups, and converter stress data.
Review Power Data →See how engineering artifacts, validation plans, and production controls converge for industry programs already in market.
±3 mil backdrill, 35:1 drills, and ≤500 µm cooling data mirrored from hyperscale fabrics.
Explore server routeDBC 350 µm copper, -40~125 °C thermal shock, and PPAP Level 3 templates ready for review.
View automotive routeISO 13485 controls with AOI >95%, microscope photos, and ROSE ≤1.5 µg/cm² logs packaged for DHRs.
See medical routeQuick answers for timelines, qualification evidence, and collaboration flows when we onboard your program.
Mirror datasets capture 40-layer / 0.300 in stackups, ±3 mil backdrill tolerances, 24 h PCB prototypes, ROSE ≤1.5 µg/cm² cleanliness, and -55~125 °C stress reports across high-speed, automotive, medical, and consumer programs.
Discovery to stackup alignment typically closes in 3–5 business days; PCB prototypes follow the 24–48 h quick-turn promise published by lstpcb's EMS service.
Yes. Every launch includes stackup/coupon files, cleanliness & humidity logs, SPC dashboards, and ISO 13485 / IATF 16949 / AS9100 certificate bundles.
Send stackups, stress targets, or PPAP / AS9100 checklists and we will return a mitigation plan with real mirror data inside 24 hours.