Server & Data Center
40-LayerBackplanes with 35:1 aspect ratio drills, ±3 mil backdrill, and ≤500 µm cooling channels.
- 40L / 0.300 in stackups
- 15 µm copper-filled microvias
- Cooling evidence >100 W/cm²
Industry Solutions
Stackups, Evidence & Timelines Proven in Mirror Data
40-layer / 0.300 in stackups, 24 h PCB prototypes, and -55~125 °C stress results are lifted straight from our mirrored manufacturing datasets so each industry program starts with real evidence.
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Solutions Across High-Speed, Automotive, Medical & Consumer
Each industry route links PCB fabrication, PCBA coverage, and documentation so teams can align compliance, reliability, and cost windows with one playbook.
Automotive / EV
IATF 16949-40~125 °C stress windows, PPAP packs, and ROSE ≤1.5 µg/cm² cleanliness data.
- PPAP Level 3 kits
- DBC 140–350 µm copper
- 85/85/1000 h damp heat
Medical Devices
ISO 13485DHR-ready builds with AOI >95%, 40× microscope checks, and ROSE ≤1.5 µg/cm² logs.
- DHF/DHR templates
- 85/85/1000 h humidity
- Steam-aging solderability
Telecom / 5G
RF & Optical15 µm microvias, PTFE hybrids, and ±5% TDR/VNA correlation for 28–112G links.
- PTFE / FR-4 hybrids
- ≤0.25 mm microvias
- ±5% impedance reports
Aerospace & Defense
AS9100Mission electronics with stackup evidence, humidity proofs, and full traceability.
- AS9100 traceability
- Thermal shock -55~125 °C
- Conformal coat & cleanliness logs
Drone / UAV
Weight CriticalLightweight avionics, RF payloads, and power boards with IPC Class 3 focus.
- HDI + RF hybrids
- Embedded antennas
- Vibration & drop validation
Industrial Control & Automation
24/7 DutyPLC, motion, and IO module PCBAs ruggedized for noise, heat, and cabinet installs.
- Mixed-signal isolation
- High-current copper pours
- DIN-rail mechanical formats
Power & New Energy
High CurrentSolar, ESS, wind, and EV charger power stages with creepage/clearance evidence.
- Thick copper stackups
- Bidirectional converter tests
- Thermal + surge data
Robotics & Automation
Motion ControlController, drive, and perception PCBAs with deterministic networking and safety IO.
- Servo drive power stages
- Fieldbus / EtherCAT ready
- Sensor fusion modules
Security / Security Equipment
24/7 MonitoringCameras, access control, intrusion, and fire systems with PoE and backup coverage.
- IP camera + NVR boards
- Access + biometric controllers
- Battery backup power PCBs
Capabilities Underpinning Every Program
Lean on common process controls—from impedance correlation to cleanliness and box-build traceability—to keep launches predictable.
Quickturn Prototypes
24–48 h PCB prototypes with stackup, coupon, and cleanliness evidence baked in.
Learn more →Advanced PCB Manufacturing
HDI, RF hybrids, heavy copper, metal-core, and controlled impedance stackups.
Learn more →Drilling & Vias
Blind/buried, via-in-pad, backdrill, half-hole, and profiling controls ready to deploy.
Learn more →Testing & Quality
AOI, X-ray, flying probe, and FCT packaged with traceability for every industry handoff.
Learn more →From Discovery To Launch With One Team
Every industry engagement follows a structured playbook that keeps stackups, qualification evidence, and downstream PCBA plans aligned from the first call.
Discovery & Evidence Pull
Collect stackups, AVL limits, and stress targets; attach matching mirror data (e.g., 24 h prototypes, 40L stackups).
Stackup & DFM Alignment
Review dielectrics, copper, panelization, and cleanliness windows (ROSE ≤1.5 µg/cm², ±10% solder paste) before tooling.
Pilot & Validation
Execute -55~125 °C thermal shock, 85/85/1000 h damp heat, 5 Grms vibration, AOI >95%, then package reports for MP handoff.
Frequently Asked Questions
Quick answers for timelines, qualification evidence, and collaboration flows when we onboard your program.
What data underpins your industry playbooks?
Mirror datasets capture 40-layer / 0.300 in stackups, ±3 mil backdrill tolerances, 24 h PCB prototypes, ROSE ≤1.5 µg/cm² cleanliness, and -55~125 °C stress reports across high-speed, automotive, medical, and consumer programs.
How quickly can stackups and DFM reviews complete?
Discovery to stackup alignment typically closes in 3–5 business days; PCB prototypes follow the 24–48 h quick-turn promise published by lstpcb's EMS service.
Do you package compliance evidence?
Yes. Every launch includes stackup/coupon files, cleanliness & humidity logs, SPC dashboards, and ISO 13485 / IATF 16949 / AS9100 certificate bundles.
Need A Data-Backed Industry Launch?
Send stackups, stress targets, or PPAP / AS9100 checklists and we will return a mitigation plan with real mirror data inside 24 hours.