SPI (Solder Paste Inspection)
Controls solder paste volume and alignment to reduce soldering defects.
Quality Assurance
APTPCB performs rigorous Final Quality Inspection (FQI) on every shipment before it leaves our factory. It is the last quality gateβconfirming that every PCB and PCBA is correct, clean, traceable, and safe to use. Final Quality Inspection is built into every order, not a separate paid service.
Controls solder paste volume and alignment to reduce soldering defects.
Checks component presence, orientation, and visible solder joints after reflow.
Inspects hidden solder joints under BGA, LGA, QFN and power packages.
Verifies electrical connectivity and component values where test access exists.
Executes power-up and device-specific functional checks according to your procedures.
Last verification layer ensuring correct labeling, completeness, and safe packing.
Contact APTPCB today to discuss your PCB manufacturing and PCB assembly needs, and learn how our integrated Final Quality Inspection and complete PCBA Quality & Testing system can help you ship more reliable products with greater confidence.