ROGERS / PTFE / LOW-LOSS
Build RF/microwave PCBs on Rogers/PTFE laminates with tight impedance, cavity machining, and VNA testing for telecom, aerospace, and automotive applications.
APTPCB engineers design Rogers/PTFE stackups, dielectric thickness, and copper roughness aligned with RF performance targets.
We perform precision etching, cavity routing, plated slots, and via fences to maintain matching and Q factors.
Assembly covers silver/ENEPIG finishes, soldering, wire bonding, and coating for telecom, aerospace, and automotive RF modules.
RF boards for telecom, automotive radar, aerospace, and industrial sensing built on microwave-grade Rogers/PTFE laminates.
Impedance coupons, VNA/S-parameters, and environmental tests ensure Microwave PCBs meet spec.
RF-focused fabrication with tight process control, finishing, and testing.
Backhaul radios, phased arrays, radar, mmWave, and hybrid RF/FR-4 systems.
Select laminates with required Dk/Df, thickness, and copper roughness.
Microwave boards built on Rogers/PTFE laminates undergo VNA, impedance, humidity, and thermal cycling tests to meet telecom, automotive, and aerospace requirements.
Stackup & RF Review
Align Dk/Df and copper roughness with frequency targets.
Imaging & Etch
LDI with compensation for RF geometries.
Cavity & Drill
Machine cavities, slots, and via fences.
Plating & Finish
Apply silver/ENEPIG with tight tolerances.
Assembly Prep
Plan soldering, wire bond, or coax attachment.
RF Validation
Impedance, VNA, and environmental testing.
CAM + RF engineers guide stackups, cavity design, and impedance models.
Process control for etch, plating, and testing ensures repeatability.
Frequency Range
Typical microwave builds
Impedance
Coupon verified
Thermal Options
Ceramic hybrids
Hi-Pot
Isolation testing available
Low loss, stable Dk, and high reliability for RF designs.
Minimal insertion loss up to mmWave.
Tight dielectric tolerance preserves matching.
Cavities and slots produced accurately.
Combine microwave (Rogers/PTFE) signal layers with FR-4 for cost-efficient designs.
Integrate antennas and logic on one board.
Complete SI packages.
Microwave laminates (Rogers/PTFE) deliver consistent RF performance across harsh environments.
5G/6G telecom, radar, satellite, automotive ADAS, medical, and industrial RF modules rely on microwave laminates built on Rogers/PTFE systems.
Low-loss stackups keep matching and gain stable.
RRU, BTS, and small cell radios.
Radar, V2X, and telematics.
Satcom, EW, and radar modules.
RF instrumentation and calibration fixtures.
Imaging and therapy RF platforms.
Wireless sensors and gateways.
Co-packaged optics and mmWave modules.
RF power amplifiers and sensors.
Keep impedance, cavity, and finish control in check for RF fidelity.
Premium laminates require lead time.
Tight tolerances needed for filters and waveguides.
Any variation detunes matching networks.
Finish affects solderability, bondability, and insertion loss.
Humidity and temperature can shift Dk.
RF customers expect detailed VNA reports.
Material Planning
Reserve microwave-grade Rogers laminates and define acceptable alternates.
Machining Playbooks
Set depth, plating, and tolerance standards.
Impedance Modeling
Stackup simulations plus coupon testing per lot.
Finish Guidance
Silver, ENIG, or ENEPIG recommendations.
Environmental Testing
Humidity and thermal cycling available.
Innovation Roadmap
Emerging technologies shaping the future of manufacturing, signal integrity, and system integration.
01
28/39/73 GHz and beyond with ultra-low-loss PTFE and hybrid stackups for 5G/6G.
02
Integrated optical transceivers on microwave PCB with tight SI and thermal control.
03
Electroless plating for fine-pitch traces and rapid microwave prototyping.
04
Machine learning for impedance matching and layout, paired with EM simulation and physical validation.
Microwave/Rogers PTFE materials are premium—reserve them for RF layers and pair with FR-4 elsewhere. Standardize stackups, finishes, and test scopes to keep lead time and pricing predictable. Tactics that keep microwave laminates and hybrid stack-ups under control.
Use microwave laminates only where needed.
Define when full VNA testing is required.
Early reviews prevent over-spec’d machining.
Panelize antennas for better yield.
Reuse assembly fixtures across similar designs.
Choose finishes based on true needs.
Silver vs ENEPIG vs ENIG based on application.
Reserve laminates for recurring builds.
Quality, environmental, and industry credentials supporting reliable manufacturing.
Quality management for RF PCB fabrication.
Environmental controls for lamination and plating.
Traceability for medical RF builds.
Automotive compliance for radar PCBs.
Aerospace governance for satcom and avionics.
Performance standard for high-reliability RF PCBs.
Flammability and dielectric compliance.
Hazardous substance compliance.
Quality & Cost Console
Unified dashboard connecting HDI quality checkpoints with the economic levers that compress cost.
Process & Reliability
Stack-Up Validation
Pre-Lamination Strategy
• Rotate outlines, mirror flex tails
• Share coupons across programs
• Reclaim 5-8% panel area
Registration
Registration
Laser Metrology
• Online laser capture
• ±0.05 mm tolerance band
• Auto-logged to SPC
Testing
Testing
Electrical Test
• TDR coupons per panel
• IPC-6013 Class 3
• Force-resistance drift logged
Integration
Integration
Assembly Controls
• Nitrogen reflow
• Inline plasma clean
• 48h logistics consolidation
Architecture
Architecture
Cost Strategy
• Balance cost vs performance
• Standardize on common cores
• Low-loss only on RF layers
Microvia Planning
Microvia Planning
Via Cost Savings
• Avoid stacked microvias
• Share backdrill tools
• Minimize fill costs
Utilization
Utilization
Panel Optimization
• Rotate for nesting efficiency
• Share test coupons
• Standardize tooling
Execution
Execution
Supply Chain Levers
• Pool low-loss material
• Dual-source laminates
• Match finish to need
Share stackups, frequency targets, and assembly plans—we respond with DFx notes, SI plan, and timeline within one business day.
Questions on materials, finishes, and testing.
