Parallel DFM + kit prep
DFM reviews, PFMEA/control plan, and kit validation run the moment data lands so we release SMT in <24 h.
DFMPFMEA
DFX-FIRST NPI
NPI & Small Batch PCBA — DFX to Pilot Ramp
NPI engineers, expedited SMT lines, and quick-turn fixtures let us move from DFM to assembled units in 48–72 hours when needed.
- DFM & PFMEA release <24 h
- Quick-turn builds in 48–72 h
- Dedicated NPI engineers
- Inline SPC + trace pack
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NPI quick-turn readiness
Dedicated SMT lines and engineers keep prototypes moving fast.
48–72 h
Quick-turn build
Parallel DFM + kit prep + SMT on expedited lines.
<24 h
DFM/PFMEA release
Gerber/ODB++ checks, PFMEA/control plan approval.
100%
Traceability
NPI traveler, photos, AOI/SPI logs packaged per lot.
NPI PROGRAM
How we run quick-turn builds
Reserved NPI lines, BOM kitting, and DFM sign-off ensure prototypes are built correctly even on 48–72 h schedules.
DFM & kit readiness
Gerber/ODB++ ingest, stack-up/impedance checks, kit validation, and risk reviews within 24 h.
Dedicated SMT lines
Expedited SMT/Selective soldering with inline SPC, AOI, and NPI engineers on the floor.
Proof packages
AOI/SPI reports, photos, trace labels, and action logs delivered with the build.
PLAYBOOK
NPI launch workflow
Clear gates keep every revision aligned with the data your ramp team needs later.
1
Submit package
Gerber/ODB++, BOM, XY, test intent, risk notes.
2
DFX + quote
24-hour feedback covering stackup, panel, stencil, access, and AVL health.
3
Build & inspect
Dedicated NPI lanes run SPI/AOI/X-ray/FAI with ECO-aware changeovers.
4
Test & program
Flying probe or ICT/FCT plus firmware loading and boundary-scan.
5
Pilot handoff
Run-at-rate option with golden samples, travelers, and FPY/FAI data.
QUICK-TURN SNAPSHOTS
48–72 h prototype program
Three pillars keep NPI builds fast and visible.
CAPABILITIES
NPI-friendly capability stack
Process windows tuned for prototypes, ECO-heavy cycles, and small-batch pilots.
SMT
Lines7 dedicated NPI lanes
Component window01005–100 mm, 0.4 mm BGA
Changeover<30 min SMED
ReflowNitrogen, multi-profile
THT / Mechanics
Selective solder3 cells
Hand insertIPC-A-610 Class 3
ReworkBGA/QFN reball + micro-mod
Enclosure prepPilot box-build ready
Test & Data
InspectionSPI • 2D/3D AOI • X-ray
TestFlying probe, ICT/FCT, boundary-scan
DocumentationFAI packs, Pareto, FPY
TraceabilityLot + serialized test
Engineering environment
Dedicated NPI cells with MSD controls, offline kitting, and ECO controls keep each revision clean.
QUALITY
Quality stack for first builds
Evidence-first QA so EVT/DVT findings survive ECOs and transfer to ramp.
DFX + FAI locks
Stackup, stencil, and access reviews with FAI photos and dimensional checks on every first article.
Inspection discipline
100% SPI/AOI with targeted X-ray; MSD baking and nitrogen profiles for fine-pitch parts.
Test coverage
Flying probe or ICT/FCT plans, boundary-scan, and firmware version control captured in travelers.
Industries & use cases
Medical & wearable
ISO 13485 builds with cleanliness checks, UDI-ready serialization, and secure file handling.
Industrial & energy
Conformal coat options, hi-pot, and firmware load for rugged controllers.
IoT & connectivity
RF calibration support, boundary-scan, and regional packaging for pilots.
Compute & edge AI
High-layer boards with BGA/CSP, thermal interface prep, and functional validation.
NPI & Small Batch PCBA — quick, traceable builds
Upload your package to get a DFX-backed quote and build window in under 24 hours.
Frequently Asked Questions
Everything you need to know about HDI PCB technology