Released build package
DFX findings, BOM/AVL risks, substitutions, assembly notes, and test intent are dispositioned against one revision before release.
DFXBOM/AVL
ENGINEERING RELEASE TO PILOT
NPI PCB Assembly — Controlled First Builds to Pilot
NPI PCB assembly is the controlled transition from released design data to repeatable first builds and pilot production, with DFX, first-article evidence, test disposition, and revision control at each gate.
- Released-data DFX review
- BOM/AVL risk disposition
- First-article evidence pack
- Golden-unit pilot handoff
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NPI release readiness
Each first build is tied to an approved revision, documented inspection evidence, and an explicit release decision.
48–72 h
Assembly window
Assembly-only scheduling for released, build-ready packages.
<24 h
DFX response
Gerber/ODB++, BOM/AVL, assembly, and test-access risks returned for disposition.
100%
Revision traceability
Traveler, FAI photos, inspection logs, test status, and ECO baseline packaged per lot.
NPI PROGRAM
How an NPI build moves from data release to pilot
The program advances only when data, material risk, first-article evidence, test results, and revision status have a named disposition.
Engineering release
Gerber/ODB++, BOM, centroid, drawings, and test intent are checked against one revision before the work order is released.
First-article build and disposition
Seven SMT lines support NPI scheduling, with SPI/AOI, risk-based X-ray, FAI review, and controlled rework before lot release.
Pilot transfer package
Golden-unit status, approved ECOs, recipes, travelers, inspection evidence, and test disposition establish the repeatable baseline.
PLAYBOOK
NPI launch workflow
Six release gates keep every revision aligned with the evidence the pilot-production team needs later.
1
Release build data
Gerber/ODB++, BOM/AVL, centroid, drawings, test intent, target quantity, and revision identifier.
2
Disposition DFX and supply risk
Resolve stack-up, stencil, polarity, access, AVL, lifecycle, and substitution questions before purchase and setup.
3
Build and release the first article
NPI-scheduled SMT runs SPI/AOI, risk-based X-ray, FAI review, and documented nonconformance disposition.
4
Disposition test results
Record firmware, access maps, flying-probe or ICT/FCT results, failed-unit analysis, and retest status.
5
Control ECO and pilot handoff
Lock the golden unit, approved ECO baseline, recipes, travelers, FAI record, and pilot transfer package.
NPI CONTROL POINTS
Three records that make a first build transferable
Speed matters, but NPI becomes repeatable only when engineering decisions, first-article evidence, and the approved baseline travel together.
CAPABILITIES
NPI capability stack for controlled engineering release
Assembly, inspection, test, and documentation are tied to the same revision so first-build findings can become a stable pilot baseline.
SMT
Lines7 SMT lines with NPI scheduling
Component window01005–100 mm, 0.4 mm BGA
Changeover<30 min SMED
ReflowNitrogen, multi-profile
THT / Mechanics
Selective solder3 cells
Hand insertIPC-A-610 Class 3
ReworkBGA/QFN reball + micro-mod
Enclosure prepPilot box-build ready
Test & Data
InspectionSPI • 2D/3D AOI • X-Ray
TestFlying probe, ICT/FCT, boundary-scan
DocumentationFAI packs, Pareto, FPY
TraceabilityLot + serialized test
Revision-controlled engineering environment
MSD controls, offline kitting, work-order revision checks, and ECO disposition keep each first build tied to its approved baseline.
QUALITY
Evidence required to release a first build
Inspection data is useful only when it is tied to the released revision, dispositioned findings, and the baseline selected for pilot transfer.
Package and first-article control
Stack-up, stencil, assembly, and access reviews are linked to FAI photos and dimensional checks for the released revision.
Inspection and nonconformance disposition
SPI/AOI, targeted X-ray, MSD controls, and rework records show what passed, what changed, and what requires approval.
Test and baseline control
Flying-probe or ICT/FCT plans, boundary-scan, firmware version, golden-unit status, and retest results are captured in travelers.
Which NPI stage is your build at?
EVT · Prove the design works
Build focus: released data, DFX findings, first articles, and functional test. Exit decision: the design meets agreed functional acceptance criteria and every issue has an owner.
DVT · Prove the design is robust
Build focus: design robustness, inspection and test coverage, and root causes for recurring rework. Exit decision: validation passes without undocumented manual workarounds.
PVT · Prove the process is repeatable
Build focus: production tooling, work instructions, line balance, and process evidence. Exit decision: agreed yield and test thresholds hold across the pilot lot without uncontrolled intervention.
Pilot transfer · Lock the production baseline
Build focus: approved BOM/AVL, golden unit, programs, recipes, travelers, ECO status, and open actions. Exit decision: the customer approves the controlled production baseline.
NPI RFQ and release checklist
- Released Gerber or ODB++ files with fabrication, assembly, paste, and revision identifiers
- Approved BOM and AVL with manufacturer part numbers, alternates, consigned parts, and lifecycle risks
- Centroid data with reference designators, rotation convention, polarity, and do-not-place status
- Assembly drawings, special process notes, workmanship class, coating, cleaning, and packaging requirements
- Test intent with access map, firmware or programming files, acceptance criteria, and golden-unit plan
- Target quantity, required build date, first-article approval owner, ECO rules, and pilot-handoff deliverables
NPI RELEASE-GATE MATRIX
Six gates from engineering release to pilot transfer
Each gate names the decision, evidence, and controlled output needed before the program advances.
Engineering release
Gates 1–2 · Release the build inputs
- Data / package releaseGerber/ODB++, centroid, drawings, test intent
- BOM / AVL risk releaseLifecycle, alternates, substitutions, MSD status
First build
Gates 3–4 · Release the physical evidence
- First-article and inspection releaseFAI, SPI/AOI, risk-based X-ray, rework status
- Test dispositionProgram version, results, failures, retest status
Pilot handoff
Gates 5–6 · Release the repeatable baseline
- Golden-unit / ECO controlApproved unit, deviation status, revision history
- Pilot transfer packageTraveler, recipes, FAI, test record, open actions
NPI control
Contain ECO cost before setup
- Decision pointBefore line setup
- Controlled recordApproved release package
NPI control
Match test investment to the learning goal
- Decision pointBefore fixture commitment
- Controlled recordTest coverage and disposition
NPI control
Transfer proven settings into pilot
- Decision pointBefore pilot release
- Controlled recordPilot transfer package
Frequently Asked Questions
Everything you need to know about HDI PCB technology
NPI PCB assembly with a controlled release path
Upload the release package to receive a DFX- and BOM-risk review tied to the first-build and pilot-handoff requirements.
- Revision-specific DFX and BOM/AVL review
- First-article, inspection, and test disposition
- Golden-unit and pilot-transfer records