ALN • AL₂O₃ • DBC/DPC
AlN, Al₂O₃, and DBC/DPC ceramic PCBs with 120–190 W/m·K conductivity, embedded copper, and Class 3 inspection for power, RF, and medical electronics.
We engineer ceramic stackups (AlN, Al₂O₃, DBC/DPC) with thick copper, plated vias, and selective finishes to move heat efficiently and provide RF stability.
Our CAM team plans laser patterning, copper etch, via fill, and metallization to support wire bond, solder attach, and high-voltage isolation.
Assembly support includes silver sintering, solder attach, wire/ribbon bonding, and conformal coating tailored to ceramic substrates.
Power modules, RF amplifiers, medical devices, and aerospace electronics that leverage ceramic platforms.
ASTM D5470 conduction, Hi-Pot 4 kV, and wire bond validation ensure ceramic boards meet mission-critical requirements.
We deliver DPC, DBC, and thick copper ceramic PCBs with turnkey assembly and testing.
DPC AlN, DBC Al₂O₃, copper-backed ceramic, hybrid ceramic/FR-4, and microchannel designs.
Match conductivity, dielectric strength, and CTE to device requirements.
Ceramic boards undergo D5470 conduction, Hi-Pot, wire pull, shear, and thermal cycling with documented reports.
Stackup & Thermal Review
Align conductivity, thickness, and copper features.
Patterning & Metallization
Laser or photo imaging, copper deposition, and etch.
Via Drilling & Fill
Drill, plate, and fill thermal vias or coins.
Surface Finish & Mask
Apply silver, ENEPIG, or specialized finishes.
Assembly Preparation
Plan solder attach, wire bond, or sintering steps.
Validation & Test
D5470, Hi-Pot, wire pull, and inspection.
We plan dielectric, copper, and via features to meet thermal and electrical specs.
SPC on metallization, via fill, and testing ensures repeatability.
Conductivity
AlN and Al₂O₃ options
Hi-Pot
Isolation per lot
Copper Thickness
DBC/DPC capability
Assembly
ENEPIG or silver finish
High thermal conductivity, low CTE, and RF performance.
120–190 W/m·K conductivity removes heat efficiently.
Low CTE prevents solder fatigue.
Copper coins, vias, and cavities built-in.
ENEPIG/Ag finishes for bond wires.
Eliminates extra heat spreaders.
Thermal & electrical reports included.
Hi-Pot screening up to 4 kV secures EV, medical, and industrial power modules.
Thermal simulation support aligns via fields, coins, and die attach for compact layouts.
Ceramic substrates handle heat and RF demands better than standard FR-4.
Power modules, RF/microwave, medical, aerospace, and automotive applications benefit from ceramic substrates.
High thermal conductivity and isolation keep performance stable.
IGBT/SiC modules and converters.
PA, T/R modules, and radar.
Mission-critical electronics.
Imaging probes and therapy devices.
Onboard chargers and lighting.
High-temp sensors and inspection tools.
Ceramic with flex tails for compact modules.
Load banks and metrology tools.
Manage thermal, mechanical, and assembly constraints unique to ceramic substrates.
AlN lead times require early planning.
Finish impacts reflectivity, solderability, and bonding.
Bonding dissimilar materials needs careful design.
Balancing dielectric thickness and heat flow.
Ceramic panels need custom fixturing and packaging.
Customers require detailed thermal/electrical reports.
Material Planning
Reserve AlN/Al₂O₃ lots and define alternates.
Finish Playbook
Select silver/ENEPIG based on assembly needs.
CTE Matching
Design guidance for bonding to metal bases or FR-4.
Thermal Modeling
Simulate conduction paths before fab.
Packaging & Handling Kits
Custom trays and instructions ship with each lot.
Innovation Roadmap
Emerging technologies shaping the future of manufacturing, signal integrity, and system integration.
01
Integrated cooling channels in AlN/Al₂O₃ for extreme thermal management in power modules.
02
Temperature and pressure sensors bonded directly into ceramic substrates for real-time monitoring.
03
Direct die-attach of wide-bandgap semiconductors on ceramic for 600V+ power electronics.
04
Electroless plating for complex routing, paired with FEA-validated thermal models and predictive performance.
Ceramic substrates and thick copper are expensive—reserve them for zones that truly need extreme thermal performance. Panelize small modules and reuse stackups to minimize waste and lead time. Provide heat flux, isolation, and assembly details early so we can choose the most cost-effective ceramic platform.
Use AlN only for high flux; Al₂O₃ for moderate needs.
Run full validation for qualification, sampling for volume.
Early reviews prevent over-spec’d copper or finish.
Combine multiple small boards per panel.
Reuse bonding and assembly fixtures across builds.
Combine ceramic under hotspots with FR-4 elsewhere.
Apply ENEPIG only on bond pads; use silver elsewhere.
Reserve ceramic substrates to avoid expedite fees.
Quality, environmental, and industry credentials supporting reliable manufacturing.
Quality management for ceramic PCB fabrication.
Environmental controls for copper bonding and plating.
Traceability for medical ceramic modules.
Automotive APQP/PPAP for Si₃N₄ AMB substrates.
Aerospace build governance.
Rigid and rigid-flex performance classes.
Dielectric safety and copper-clad compliance.
Hazardous substance compliance.
Quality & Cost Console
Unified dashboard connecting HDI quality checkpoints with the economic levers that compress cost.
Process & Reliability
Stack-Up Validation
Pre-Lamination Strategy
• Rotate outlines, mirror flex tails
• Share coupons across programs
• Reclaim 5-8% panel area
Registration
Registration
Laser Metrology
• Online laser capture
• ±0.05 mm tolerance band
• Auto-logged to SPC
Testing
Testing
Electrical Test
• TDR coupons per panel
• IPC-6013 Class 3
• Force-resistance drift logged
Integration
Integration
Assembly Controls
• Nitrogen reflow
• Inline plasma clean
• 48h logistics consolidation
Architecture
Architecture
Cost Strategy
• Balance cost vs performance
• Standardize on common cores
• Low-loss only on RF layers
Microvia Planning
Microvia Planning
Via Cost Savings
• Avoid stacked microvias
• Share backdrill tools
• Minimize fill costs
Utilization
Utilization
Panel Optimization
• Rotate for nesting efficiency
• Share test coupons
• Standardize tooling
Execution
Execution
Supply Chain Levers
• Pool low-loss material
• Dual-source laminates
• Match finish to need
Share stackups, heat flux maps, and assembly requirements—we reply with DFx notes, cost, and timeline within one business day.
Common questions about materials, conductivity, and assembly.
