Alumina and aluminum nitride ceramic PCBs with plated copper circuits

ALUMINA AND ALN CERAMIC PCB

Ceramic PCB Manufacturer for Alumina and AlN Circuit Boards

APTPCB manufactures ceramic PCBs on 96% alumina (Al₂O₃) and aluminum nitride (AlN) using DPC, DBC and LTCC processes, for power modules, LED and laser drivers, RF parts and sensors. Tell us the heat load, voltage and assembly method, and engineering recommends the substrate and process before quoting.

  • 96% alumina and aluminum nitride
  • DPC, DBC and LTCC processes
  • 1–2 layer ceramic circuits
  • Brittle-substrate assembly handling

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96% Al₂O₃ / AlNSubstrates
DPC / DBC / LTCCProcesses
1–2 layersLayers
190 × 140 mmMax substrate

When is a ceramic PCB worth the cost over FR-4 or metal core?

Choose ceramic when the board itself has to conduct heat and insulate at the same time, run hot, or keep a stable dielectric for RF. Alumina and AlN have no organic resin, so the substrate holds its shape and properties at temperatures that would degrade FR-4 or an IMS dielectric.

Ceramic costs more per square inch and is brittle, so it is usually reserved for the part of the system that needs it: a power module substrate, an LED or laser driver, a sensor or an RF circuit. If the heat problem could be solved with an aluminum board or thicker copper, compare ceramic with MCPCB, heavy copper and copper coin in the high thermal conductivity PCB guide.

PROCESS ROUTE

DPC, DBC or LTCC: which ceramic PCB process fits your design?

The process sets how fine the circuit can be, how thick the copper can be and whether you get more than one layer.

  • DPC (direct plated copper): copper is plated onto the ceramic, so lines can be fine (down to 0.05 mm on thin copper) and vias can be copper-filled. Choose it for LED, sensor and RF circuits that need detail.
  • DBC (direct bonded copper): thick copper foil is bonded to the ceramic at high temperature. Choose it for power modules where current and heat spreading matter more than fine lines. For DBC versus AMB on power modules, see how to select DBC or AMB ceramic substrates.
  • LTCC (low-temperature co-fired ceramic): ceramic layers are fired together with printed conductors, which allows multilayer RF modules with buried passives.
  • Line, via, copper and tolerance limits for each route are listed on the ceramic PCB capabilities page (DPC, DBC and LTCC limits).

RFQ CHECKLIST

What do you need to send for a ceramic PCB quote?

Ceramic quotes depend on substrate grade and process more than on board size, so state them, or the requirements behind them.

  • Files: Gerber or ODB++, drill file and a mechanical drawing with revision.
  • Substrate: alumina or AlN (or the thermal target if you want a recommendation), and thickness.
  • Process and copper: DPC, DBC or LTCC, and finished copper on each side.
  • Features: minimum line and space, via type and size, and laser-cut outlines or scribe lines.
  • Finish and assembly: surface finish, wire bonding (gold or aluminum wire), solder or sinter attach.
  • Electrical and thermal: working voltage, power per part and the operating temperature range.
  • Records: inspection class, electrical test, and the reports needed with each lot.

WHY APTPCB

Why choose APTPCB as your ceramic PCB supplier?

You get a substrate and process recommendation tied to your heat load and assembly, not a default to the most expensive ceramic. Alumina, AlN, DPC, DBC and LTCC are quoted by the same engineering team, along with FR-4, metal core and heavy copper alternatives when ceramic is not needed.

Ceramic boards crack if they are handled or soldered like FR-4. When assembly is part of the order, fixturing and soldering profiles are planned for the substrate; see how to solder on ceramic PCBs for the process background.

CERAMIC PCB MANUFACTURING PROCESS

How a ceramic PCB order is built

Each step is matched to the chosen substrate and process route.

1

Review heat, voltage and assembly

Power per part, operating temperature, working voltage and attach method are checked.

2

Confirm substrate and route

Alumina or AlN, thickness, and DPC, DBC or LTCC are fixed.

3

Drill and laser-process

Holes and outlines are laser- or mechanically cut in the ceramic.

4

Metallize and pattern

Copper is plated, bonded or co-fired, then imaged to the approved line widths.

5

Finish

Surface finish for soldering or wire bonding, plus solder mask where specified.

6

Test and inspect

Electrical test, dimensions, flatness, adhesion and finish checks per the plan.

SUBSTRATE SELECTION

Alumina vs aluminum nitride: which ceramic PCB substrate should you choose?

Alumina covers most ceramic PCB work at lower cost. AlN is chosen when the heat flux is too high for alumina.

96% alumina (Al₂O₃)

Thermal conductivity20–27 W/m·K
Typical useLED, sensors, RF circuits, general power
ProcessesDPC, DBC, thick film
Relative costLower

Aluminum nitride (AlN)

Thermal conductivity140–180 W/m·K
Typical useHigh-power LED, laser drivers, IGBT and power modules
ProcessesDPC, DBC
Relative costHigher

Other ceramics (by review)

Silicon nitride (Si₃N₄)Toughness for power cycling; quoted by engineering review
LTCCMultilayer RF modules with integrated passives
When to askThermal cycling or layer count beyond 1–2 layer alumina/AlN
Relative costProject-specific

What the substrate does not decide

Junction temperature also depends on die attach, solder, copper thickness and the heatsink. APTPCB builds the substrate to the approved drawing; module and system qualification stay with the product owner.

Ceramic PCB substrate for a power module

POWER

AlN for concentrated heat

Power modules and laser drivers are where AlN usually earns its cost.

Alumina ceramic PCB for LED and laser drivers

LED

Alumina handles most LED boards at lower cost.

Ceramic PCB for radar and RF modules

RF

Stable dielectric for RF circuits and modules.

QUALITY RECORDS

How are ceramic PCBs inspected before shipment?

Ceramic failures show up as cracks, weak copper adhesion and finish problems, so those are checked on every lot.

IPC-A-600 Class 2 / Class 3IPC-TM-650 2.4.8 peel strengthIPC-TM-650 2.4.14 solderability

Copper adhesion

Peel strength checked against the capability limit for the process route.

Dimensions and flatness

Outline, holes and bow and twist measured on the brittle substrate.

Electrical test

100% opens and shorts test by flying probe or fixture.

Where ceramic PCBs are used

Each of these needs the board to carry heat, insulate or hold a stable dielectric.

IGBT and power modules

DBC on alumina or AlN for power stages in drives, inverters and chargers.

LED and laser drivers

High heat flux in a small area, often on AlN.

RF and microwave parts

Antennas, filters and amplifiers that need a stable dielectric.

Sensors and medical devices

Small, stable circuits that run hot or in harsh conditions.

COST

What drives ceramic PCB price?

The substrate and process route set most of the cost; features and finish add the rest.

Quality

Records you can ask for

Per lot

  • Electrical test100% opens and shorts
  • DimensionsOutline and holes
  • AdhesionPeel strength
  • CoCWith each shipment

Cost

Ceramic PCB cost drivers

Fabrication

  • SubstrateAlN > alumina
  • ProcessDPC, DBC or LTCC
  • Laser workDrilling and cutting
  • FinishENEPIG/gold for bonding

Cost

How to lower ceramic PCB cost

Design

  • SubstrateAlumina unless AlN is needed
  • SizeStandard substrate sizes
  • FeaturesAvoid minimums you do not need
  • FinishMatch to attach method

Ceramic PCB manufacturer FAQ

Questions buyers and engineers ask before ordering ceramic boards.

Get your ceramic PCB quoted with the substrate and process confirmed

Upload the files with heat load, voltage and assembly method. Engineering recommends alumina or AlN and DPC, DBC or LTCC, then returns DFM comments with the price.

  • Substrate and process recommendation
  • DFM on lines, vias and laser outlines
  • Assembly handling planned for ceramic
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