RF / MICROWAVE / 5G
Design RF and microwave antenna PCBs on Rogers/PTFE, hybrid FR-4, or copper-backed structures with precise impedance, cavity machining, and VNA testing.
APTPCB engineers model antenna stackups, dielectric constants, and ground references across Rogers, PTFE, and hybrid builds.
We control etch compensation, cavity routing, plated slots, and copper roughness so antennas maintain matching and gain.
Assembly services include selective silver/ENEPIG, press-fit coax, and conformal coating to protect RF structures.
5G/6G radios, radar, IoT, aerospace, and automotive antennas built on RF platforms.
VNA S-parameters, impedance coupons, and IR thermography ensure antennas meet design specs.
RF-focused manufacturing with precise dielectric control and assembly support.
Patch, slot, phased array, mmWave, and conformal antennas.
Select laminates (RO4350B, RO3003, RT/duroid) and copper roughness levels for frequency targets.
RF boards undergo impedance/VNA tests, thermal shock, humidity, and cross-sections to ensure consistency.
Stackup & RF Review
Align dielectric constants and layout with performance goals.
Imaging & Etch
LDI with fine compensation for RF geometries.
Cavity & Drill
Machine cavities, slots, and vias.
Plating & Finish
Apply silver/ENEPIG with tight thickness control.
Assembly Prep
Plan soldering, coax attachment, and coating.
Validation & Test
VNA, impedance, and environmental tests.
We assist with stackup design, launch structures, and impedance modeling.
SPC monitors etch, plating, and testing for repeatability.
Frequency Range
Typical antenna builds
Impedance
Coupon verified
Thermal Conductivity
Ceramic-backed options
Hi-Pot
Isolation testing available
Materials, machining, and testing tuned for RF performance.
Rogers/PTFE hybrids matched to frequency.
Cavities, slots, and waveguides held tight.
±5% validated with coupons.
Environmental tests for telecom/aerospace.
Combine RF layers with FR-4 logic.
Full SI data packages.
Layout tweaks, cavity trims, and VNA sweeps keep gain and bandwidth on spec before mass build.
Humidity, thermal cycling, and salt-mist screening make outdoor and telecom arrays mission ready.
We combine RF stackup expertise with advanced fabrication for consistent antennas.
5G/6G, radar, automotive V2X, IoT, aerospace, and medical antennas rely on precise RF stackups.
Stable materials and machining keep matching and gain on target.
Massive MIMO and base station arrays.
ADAS radar, telematics, and V2X antennas.
Radar, EW, and satellite antennas.
Calibration and instrumentation antennas.
Diagnostic and therapy RF devices.
Smart home and wearable antennas.
Wireless sensors and inspection tools.
Co-packaged optics and mmWave modules.
Material, impedance, and cavity control are critical for antenna performance.
Choosing the right Dk/Df combination for frequency.
Precise routing needed for waveguides and filters.
Any variation detunes matching networks.
Finish affects solderability, reflectivity, and bonding.
Moisture or temperature shifts can drift performance.
Customers expect SI and test records.
Material Playbooks
Recommend RF laminates and acceptable alternates.
Machining Guides
Cavity, slot, and plating tolerances defined upfront.
Impedance Modeling
Stackup simulations and coupon testing provided.
Finish Recommendations
Guidance on silver, ENEPIG, or bare copper.
Environmental Testing
Humidity and thermal cycling available.
Innovation Roadmap
Emerging technologies shaping the future of manufacturing, signal integrity, and system integration.
01
28/39/73 GHz phased arrays with integrated feed networks and phase-matched traces.
02
Active beam steering using tunable capacitors and RF switches on hybrid PTFE/FR-4 stacks.
03
Integrated RF + digital on single PCB with cavity shielding and selective finishes.
04
Machine learning for impedance matching and pattern optimization, paired with EM simulation and VNA validation.
Use premium RF materials only where necessary; combine with FR-4 for control logic. Standardize cavity depths, finishes, and panel sizes to streamline quoting. Share frequency targets, antenna size, and assembly plans so we can build the most efficient platform.
Use PTFE only under RF sections.
Full VNA for qualification, sampling for production.
Early reviews prevent over-spec’d machining.
Panelize multiple antennas to maximize usage.
Reuse assembly fixtures across SKUs.
Standardize finish choices to cut cost.
Silver for RF, ENIG/OSP for control areas.
Reserve RF laminates for ongoing programs.
Quality, environmental, and industry credentials supporting reliable manufacturing.
Quality management for fabrication, assembly, and testing.
Environmental controls across plating, lamination, and finishing.
Medical device traceability, cleanliness, and documentation.
Automotive APQP/PPAP with lot-level traceability.
Aerospace-grade configuration and production controls.
Printed board reliability standards for rigid and flex builds.
Safety certifications covering flammability and insulation.
Hazardous substance compliance with lot-backed declarations.
Quality & Cost Console
Unified dashboard connecting HDI quality checkpoints with the economic levers that compress cost.
Process & Reliability
Stack-Up Validation
Pre-Lamination Strategy
• Rotate outlines, mirror flex tails
• Share coupons across programs
• Reclaim 5-8% panel area
Registration
Registration
Laser Metrology
• Online laser capture
• ±0.05 mm tolerance band
• Auto-logged to SPC
Testing
Testing
Electrical Test
• TDR coupons per panel
• IPC-6013 Class 3
• Force-resistance drift logged
Integration
Integration
Assembly Controls
• Nitrogen reflow
• Inline plasma clean
• 48h logistics consolidation
Architecture
Architecture
Cost Strategy
• Balance cost vs performance
• Standardize on common cores
• Low-loss only on RF layers
Microvia Planning
Microvia Planning
Via Cost Savings
• Avoid stacked microvias
• Share backdrill tools
• Minimize fill costs
Utilization
Utilization
Panel Optimization
• Rotate for nesting efficiency
• Share test coupons
• Standardize tooling
Execution
Execution
Supply Chain Levers
• Pool low-loss material
• Dual-source laminates
• Match finish to need
Send stackups, frequency targets, and panel drawings—our team replies with DFx notes, SI plan, and lead time within one business day.
Answers on materials, finishes, and RF testing.
