Multiple Base Materials
Aluminum, copper, and iron base materials from leading manufacturers (Ximai, Bergquist, and others) for tailored thermal performance.
Metal PCB Capability
APTPCB specializes in aluminum, copper-based, and iron-based metal core PCB (MCPCB) manufacturing for LED lighting, power electronics, and automotive applications. Our metal core PCBs deliver superior thermal conductivity, excellent heat dissipation, and reliable performance in demanding thermal environments.
Metal core PCBs are engineered for applications requiring superior thermal management and heat dissipation. APTPCB offers comprehensive metal core PCB solutions with multiple base material options.
Aluminum, copper, and iron base materials from leading manufacturers (Ximai, Bergquist, and others) for tailored thermal performance.
1–4 layer metal core PCB designs supporting diverse thermal management requirements and circuit complexity.
0.5–4 oz copper thickness options enabling precise thermal and electrical performance tuning.
HASL, ENIG, OSP, immersion silver, and hard gold plating options for diverse soldering and reliability requirements.
Manufacturing capability up to 43.3″ × 19″ for large thermal management applications.
Combine metal core, flex, rigid-flex, rigid, and ceramic PCBs in a single project under one manufacturer.
| Item | Description | Notes |
|---|---|---|
| Layer Count | 1–4 layers metal core PCB | Standard metal core configurations |
| Metal Base Material | Aluminum base / Copper base / Iron base | Multiple base material options |
| Material Manufacturers | Ximai (China), Bergquist (USA), and other specified brands on request | Leading material suppliers |
| Final Thickness | 0.02″–0.18″ (0.5–4.6 mm), Tg approx. 130°–170° | Thickness range depending on laminate |
| Surface Treatment | Regular leaded: HASL; Lead-free: lead-free HASL, ENIG (gold), OSP, immersion silver | Comprehensive surface finish options |
| Max / Min Board Size | Min: 0.2″ × 0.2″; Max: 43.3″ × 19″ | Large board size capability |
| Min Trace Width / Clearance (0.5 oz) | 4 / 4 mil | 0.5 oz copper weight specifications |
| Min Trace Width / Clearance (1 oz) | 5 / 5 mil | 1 oz copper weight specifications |
| Min Trace Width / Clearance (2 oz) | 5 / 7 mil | 2 oz copper weight specifications |
| Min Trace Width / Clearance (3 oz) | 7 / 8 mil | 3 oz copper weight specifications |
| Min Trace Width / Clearance (4 oz) | 10 / 10 mil | 4 oz copper weight specifications |
| Min Hole Ring (0.5 oz) | 4 mil | 0.5 oz copper weight hole ring |
| Min Hole Ring (1 oz) | 5 mil | 1 oz copper weight hole ring |
| Min Hole Ring (2 oz) | 7 mil | 2 oz copper weight hole ring |
| Min Hole Ring (3 oz) | 10 mil | 3 oz copper weight hole ring |
| Min Hole Ring (4 oz) | 16 mil | 4 oz copper weight hole ring |
| Copper Thickness (circuit layer) | 0.5–4 oz | Standard copper weight range |
| Min Hole Size and Tolerance | Min: 30 mil (0.5–2.0 mm board); 45 mil (2.0–4.6 mm board); PTH: ±4 mil; NPTH: ±3 mil | Drilling precision specifications |
| Plating Thickness (HASL PTH) | Copper: 20–35 μm; Tin: 5–20 μm | HASL plating specifications |
| Plating Thickness (ENIG) | Nickel: 100–200 μ″; Gold: 2–4 μ″ | ENIG immersion gold specifications |
| Plating Thickness (Hard Gold) | Nickel: 100–200 μ″; Gold: 4–8 μ″ | Hard gold plating specifications |
| Plating Thickness (Golden Finger) | Nickel: 100–200 μ″; Gold: 5–15 μ″ | Golden finger specifications |
| Immersion Silver | 6–12 μ″ | Immersion silver finish thickness |
| OSP | Film thickness: 8–20 μ″ | Organic Solderability Preservative |
| Solder Mask Color (Glossy) | Green, black, red, yellow, white, purple, blue | Glossy solder mask color options |
| Solder Mask Color (Matt) | Matt green, matt black | Matt solder mask color options |
| Solder Mask Resolution (Thickness) | 0.2–1.6 mil | Solder mask thickness range |
| Solder Mask Resolution (Dam) | Green: 4 mil; Other colors: 5 mil | Solder dam specifications |
| Solder Mask Hole Plug Diameter | 10–25 mil | Via hole plug diameter range |
| Silk Screen Color | White, black | Silkscreen color options |
| Silk Screen Size | Min line width: 5 mil; Min character height: 24 mil | Silkscreen sizing specifications |
| Testing Voltage | Testing fixture: 50–300 V; Flying probe: 30–250 V | Electrical testing voltage range |
| Profile / Routing (CNC Tolerance) | ±5 mil | CNC routing tolerance |
| Profile / Routing (V-cut Tolerance) | ±5 mil | V-cut routing tolerance |
| Profile / Routing (Min Slot) | 40 mil | Minimum slot dimension |
| Profile / Routing (V-cut Angle) | 15°, 20°, 30°, 45°, 60° | Available V-cut angles |
| Bow and Twist | ≤1% | Board flatness specification |
| Accepted Standards | IPC Class 2, IPC Class 3, ISO 9000 | Quality and manufacturing standards |
| Typical lead time | 7–15 working days | Varies by complexity and production volume; metal core PCBs are generally faster than multi-layer rigid designs |
Metal core PCBs are ideal for applications requiring superior thermal management and heat dissipation in demanding environments.
High-power LED modules, street lighting, and display backlighting with aluminum IMS for efficient heat dissipation.
Power converters, voltage regulators, and power supply modules requiring reliable thermal management.
Engine control units, power distribution modules, and thermal management systems for automotive applications.
Industrial motor drives, power inverters, and thermal control systems for industrial applications.
High-power consumer devices requiring efficient heat dissipation and thermal stability.
Review thermal requirements, select appropriate metal base material (aluminum, copper, or iron), and define layer stack-up.
Prepare metal base substrate, apply dielectric layer, and ensure proper bonding for thermal conductivity.
Pattern copper circuit layers, etch traces according to design specifications, and verify line/space tolerances.
Perform precision drilling for through-holes and vias, apply copper plating, and verify hole quality.
Apply selected surface finish (HASL, ENIG, OSP, immersion silver), and verify finish thickness and uniformity.
Apply solder mask and silkscreen legend, verify registration and alignment, and perform quality inspection.
Route final profile using CNC or V-cut, perform electrical testing, and conduct final quality verification.
Our engineering team provides comprehensive DFM guidance to optimize your metal PCB designs for performance, reliability, and cost-effectiveness.
Guidance on choosing the optimal metal base material (aluminum, copper, or iron) for your thermal and electrical requirements.
Assisting in designing for efficient heat dissipation and validating thermal performance against application requirements.
Optimizing layer configuration, dielectric thickness, and copper weight for balanced thermal and electrical performance.
Help define design rules and stack-ups in CAD tools based on APTPCB's manufacturing capabilities and tolerances.
Metal core PCBs are often only one part of a complete project. Many customers also need rigid, flex, rigid-flex, or ceramic PCBs in the same design. APTPCB can support all of these technologies under one roof.
Combine metal core, flex, rigid-flex, rigid, and ceramic PCBs in a single project without coordinating multiple suppliers.
Our engineering team reviews all PCB types together, ensuring compatibility and optimizing the complete solution.
Streamlined manufacturing and logistics coordination, treating APTPCB as your one-stop PCB manufacturing partner.
Consolidated BOM and manufacturing reduces complexity and cost compared to managing multiple suppliers.
A metal core PCB uses a metal base (aluminum, copper, or iron) instead of traditional FR-4. The metal base provides excellent thermal conductivity, enabling efficient heat dissipation for LED, power electronics, and automotive applications.
We support aluminum (most common), copper, and iron-based metal cores. Aluminum is preferred for cost-effectiveness and thermal performance; copper offers higher thermal conductivity; iron provides magnetic properties for specific applications.
Aluminum-based MCPCBs typically offer 1–3 W/m·K thermal conductivity, while copper-based designs reach 5–10 W/m·K. This is significantly higher than FR-4 (0.3 W/m·K), enabling efficient heat transfer.
Yes, metal core PCBs are ideal for high-power LED drivers, power supplies, and automotive modules. The metal base efficiently dissipates heat, extending component life and improving reliability.
APTPCB supports 1–4 layer metal core PCBs. Most applications use 1–2 layers, with the metal base providing thermal management.
We offer HASL, ENIG, OSP, and immersion silver finishes. Surface finish selection depends on your assembly process and environmental requirements.
Lead times typically range from 7–15 working days depending on complexity and production volume. Metal core PCBs are generally faster to produce than multi-layer rigid designs.
Yes, we support metal core, flex, rigid-flex, rigid, and ceramic PCB types. We can also combine metal core sections with standard FR-4 in specialized designs.
If your LED, power, or automotive design is close to capability limits, or you need special stack-ups or finishes, our engineers will review feasibility, suggest optimizations, and provide a fast quotation. We support all metal core, flex, rigid-flex, rigid, and ceramic PCB types in a single manufacturing solution.