Up to 64 Layers / HDI / Heavy Copper
Rigid PCB Manufacturing Capabilities
High-reliability rigid PCBs for industrial, automotive, telecom, medical, and high-speed digital applications-supporting complex stack-ups, HDI structures, heavy copper, and fine-pitch SMT with engineered DFM support.
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Rigid PCB Manufacturing Capabilities - APTPCB
APTPCB is a professional PCB manufacturer and assembler, focused on high-reliability rigid PCBs for industrial, automotive, telecom, medical and high-speed digital applications. Our production lines support complex stack-ups, HDI structures, heavy copper designs and fine-pitch SMT.
On this page you can find our key rigid PCB manufacturing capabilities. For any requirement beyond the values listed here, please contact us - in many cases we can evaluate and support custom solutions.
We can work with almost all common PCB engineering data formats, including native PCB design files from major EDA tools. However, to ensure maximum accuracy and avoid any ambiguity in mass production, we strongly recommend providing standard Gerber files (together with drill files and, where applicable, ODB++ or IPC-2581 data) as the final manufacturing documents.
Engineered Support for Complex Rigid PCB Designs
Our engineering team is experienced in complex rigid PCB designs including HDI, high layer counts, high copper thickness, fine-pitch BGAs and mixed-signal layouts. We work closely with PCB designers to convert demanding electrical and mechanical requirements into a stable and manufacturable stack-up.
Before you finalize your Gerber, ODB++ or IPC-2581 data, our CAM and process engineers are available to review your design rules, propose practical optimizations and recommend the most suitable processes for your target performance, reliability and cost.
Rigid PCB Manufacturing Capabilities
| Item | Capability |
|---|---|
| Max layer count | Up to 64 layers rigid PCB |
| Finished board size | Min 10 × 10 mm, max 610 × 1100 mm |
| Finished board thickness range | 0.20 - 8.0 mm |
| Board thickness tolerance (< 1.0 mm) | ±0.10 mm |
| Board thickness tolerance (≥ 1.0 mm) | ±10% |
| Inner layer min trace/space | 2 / 2 mil |
| Outer layer min trace/space | 2 / 2 mil |
| Max inner copper thickness | Up to 20 oz |
| Max outer copper thickness | Up to 20 oz |
| Min mechanical drill / annular ring | 0.15 mm / 0.127 mm |
| Min laser drill / annular ring | 0.075 mm / 0.075 mm |
| Mechanical drill aspect ratio | Up to 20 : 1 |
| Laser drill aspect ratio | 1 : 1 (microvias) |
| Via types | Through-hole, blind, buried, via-in-pad, stacked & staggered microvias |
| Via filling & plugging | Resin-filled, copper-capped, plugged and tented vias available |
| Press-fit hole tolerance | ±0.05 mm |
| Plated through-hole (PTH) tolerance | ±0.075 mm |
| Non-plated through-hole (NPTH) tolerance | ±0.05 mm |
| Countersink tolerance | ±0.15 mm |
| Copper-to-board-edge clearance | Standard ≥ 0.20 mm (tighter on request) |
| Layer-to-layer registration | Typical ±50 μm |
| Solder mask registration | Typical ±75 μm |
| Controlled impedance (single-ended) | ±5 Ω (≤ 50 Ω), ±7% (> 50 Ω) |
| Controlled impedance (differential) | ±5 Ω (≤ 50 Ω), ±7% (> 50 Ω) |
| Impedance support | Impedance coupons and measured report available on request |
| Standard laminates | All mainstream rigid laminates on the market can be supported according to customer BOM |
| Popular FR-4 materials | Standard FR-4 (Tg 135-150 °C), mid-Tg & high-Tg FR-4 (Tg ≥ 170 °C), halogen-free FR-4 |
| High-speed / RF materials | Low-loss / high-speed laminates such as Rogers RO4xxx/RO3xxx, Isola, Panasonic Megtron series, PTFE-based materials (on request) |
| Custom laminates | Most commercial laminates can be sourced and matched to your requirements |
| Solder mask type | LPI (liquid photoimageable) solder mask, matte or glossy |
| Standard solder mask colors | Green, matte green, black, matte black, white, blue, red, yellow |
| Custom solder mask colors | Additional colors (e.g. grey, orange, purple, etc.) and custom color matching available on request |
| Min solder mask dam | 0.075 mm |
| Min solder mask opening spacing | 0.10 mm |
| Silkscreen (legend) colors | Standard white and yellow, other colors on request |
| Silkscreen min text height | 0.60 mm recommended |
| Surface finishes | HASL, Lead-free HASL (RoHS), ENIG, ENEPIG, OSP, Immersion Tin, Immersion Silver, hard gold for edge fingers |
| Gold fingers | Bevel 30° / 45°, selectable hard-gold thickness, chamfered edge |
| Peelable mask | Available on request |
| Carbon ink / jumper | Available on request |
| HDI capability | 1-3 sequential build-up (SBU), stacked and staggered microvias |
| Fine-pitch BGA support | Support for BGAs down to 0.3 mm pitch with HDI via-in-pad fan-out |
| Board warpage | ≤ 0.75% (measured per IPC) |
| Electrical test | 100% E-test (flying probe or fixture) for all production boards |
| Hi-pot test range | 50 - 3000 V available on request |
| Cleanliness / ionic contamination | Process control according to IPC requirements |
| Accepted data formats | We can accept native PCB design files as well as Gerber, ODB++, IPC-2581 and other common engineering formats; however, we strongly recommend standard Gerber (plus drill data) as the final manufacturing files for best accuracy |
| DFM support | Free design-for-manufacturing review, stack-up and impedance suggestions |
| Compliance | RoHS compliant, UL and other certifications for applicable products |
| Production types | Quick-turn prototypes, small & medium batch and volume production |
Talk to Us Early About Impedance, Materials and Special Processes
For controlled impedance, high-speed digital or RF designs, we strongly recommend involving APTPCB early in the design phase. We can provide optimized stack-ups, material selection advice, impedance calculations, via structure proposals (blind/buried, via-in-pad, back-drilling) and recommendations for solder mask and surface finish tailored to your assembly process.
If your project requires special laminates, custom solder mask colors, heavy copper, thick gold fingers or any non-standard process, please contact our engineering team in advance. Sharing your requirements and preliminary design files up front allows us to confirm feasibility, avoid redesign loops and keep both lead time and cost under control.
Frequently Asked Questions
What is your maximum rigid PCB capability?
Up to 64 layers, 610×1100 mm size, 0.20-8.0 mm thickness, and copper weights up to 20 oz on inner and outer layers.
How fine can you go on traces and drilling?
Inner/outer layers down to 2/2 mil, laser drills to 0.075 mm, mechanical drills to 0.15 mm with aspect ratios up to 20:1.
Do you support HDI and fine-pitch BGAs?
Yes-1-3 SBU HDI with stacked/staggered microvias, via-in-pad, and BGA fan-out down to 0.3 mm pitch.
Which laminates and finishes are available?
Mainstream FR-4 (standard to high-Tg), halogen-free, Rogers/Isola/Panasonic/PTFE low-loss options, and finishes including HASL, LF-HASL, ENIG, ENEPIG, OSP, Immersion Tin/Silver, and hard gold fingers.
Can you provide impedance control and testing?
Yes-impedance coupons and reports on request, 100% E-test, optional hi-pot up to 3000 V, and IPC-based cleanliness controls.
Request Rigid PCB Manufacturing Support
Share stack-up needs, impedance targets, and special materials-we will propose manufacturing options, DFM guidance, and lead times for your rigid PCB build.