Mechanical • Laser • Backdrill • VIPPO
Comprehensive PCB Drilling & Interconnect Manufacturing
In the sophisticated realm of PCB fabrication, the drilling process serves as the critical intersection between mechanical precision and electrical performance. From standard through-holes to advanced HDI laser microvias and signal integrity backdrilling, we execute complex interconnects with micron-level tolerances.
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Complex Drilling Requirements?
Whether your project requires a simple mounting hole or a complex multi-lamination HDI stack with backdrilled connectors, our team is ready to execute your design with precision.
Precision Interconnect Manufacturing
In the sophisticated realm of PCB fabrication, the drilling process serves as the critical intersection between mechanical precision and electrical performance. It is the defining stage where layer-to-layer connectivity is established, signal paths are forged, and thermal characteristics are determined.
At APTPCB, we understand that our role goes beyond simply drilling holes. Prior to production, our MI engineers and CAM engineers—supported by a dedicated QA team—thoroughly review your design data, generate the engineering documentation, and provide feedback if anything compromises manufacturability.
Using advanced manufacturing technologies, we bring your complex interconnect architectures to life with absolute fidelity to your Gerber and ODB++ specifications. From standard rigid boards to high-density HDI rigid-flex platforms, our facility is equipped to handle the full spectrum of drilling requirements with micron-level tolerances.
1. Mechanical Drilling: The Foundation of Vertical Interconnection
For the vast majority of PCB designs, mechanical CNC drilling remains the backbone of manufacturing. We employ a fleet of high-speed, dynamic-depth-controlled spindles capable of processing thousands of hits per minute while maintaining strict positional accuracy relative to internal copper layers.
Through-Hole Conductivity & Isolation
The fundamental unit of any PCB is the through hole—its execution determines long-term reliability.
- Plated Through Hole (PTH): Monitored electroless/electrolytic plating delivers ductile, uniform via barrels that survive assembly reflow.
- Non-Plated Through Hole (NPTH): Drilled after plating or fully tented to guarantee electrical isolation for mounting and mechanical features.
- Mechanical Drill Hole: Smooth-wall drilling across wide aspect ratios for both signal and power interconnects.
Component Interface & Assembly Tolerances
- Component Lead Hole: Precision sizing for standard THT devices.
- Pin-In-Hole / Pin Via: Supports pin-in-paste processes where hole volume governs solder paste requirements.
- Press-Fit Hole / Via: ±0.05 mm tolerances plus immersion finishes for gas-tight cold welds.
- Wire Via: Small-diameter drill hits for direct wire termination.
Complex Shaping, Slots & Routing
- Plated Slot / Metallized Slot: Continuous plating for high-current blade connectors and DC jacks.
- Through-Slot Metallized Hole: Serves as shielding or mechanical guides.
- NPTH Slot / Long Slot: Creates creepage air gaps or precision sliders.
- Geometric Versatility: Oval, oblong, rectangular, square holes, plus key slots for polarized connectors.
Mechanical Integration Features
- Mounting / Screw Holes: Standard NPTH for chassis attachment.
- Countersink / Counterbore: Depth-controlled recesses so hardware sits flush.
- Chamfered / Beveled Hole: Prevents chafing and simplifies insertion.
- Tooling / Guide / Pilot Hole: Maintained per panel drawings for alignment and profiling.
2. High-Density Interconnect (HDI) and Laser Architectures
As electronic devices shrink, the demand for routing density outpaces the physical limits of mechanical drilling. APTPCB employs state-of-the-art laser ablation technology to manufacture HDI boards that drive today's mobile and computing sectors.
Laser Process Capabilities
- Laser Drill Hole: Advanced laser systems tuned for each laminate stack-up.
- CO2 Laser Via: Rapid removal of dielectric materials such as prepreg, ABF, or RCC.
- UV Laser Via: High-precision ablation of copper and dielectric with minimal heat-affected zones.
- Hybrid Drill Hole: Registration systems align mechanical through-holes with laser microvias on high layer-count builds.
Microvia Stacking & Topologies
- Microvia / Ultra-Fine Microvia: Diameters below 0.10 mm for adjacent-layer links.
- Blind Via: Connects outer to inner layers without penetrating the stack.
- Buried Via / Buried Microvia: Fully encapsulated interconnects located on internal cores.
- Blind & Buried Via Combinations: Sequential lamination merges multiple via types and laser steps.
Advanced Interconnect Structures
- Stacked Via / Stacked Microvia: Laser via directly over buried via, copper-filled and planarized.
- Staggered Via: Offsets for better stress relief.
- HDI Sequential Microvia: Managed SBU cycles build multi-tier interconnects.
- Skip Via: Links Layer n to Layer n+2 through dual dielectrics.
- Z-Axis Via: Specialized vertical methods for exotic laminates.
3. Via-in-Pad, Filling, and VIPPO Technology
The miniaturization of components like BGAs and QFNs often eliminates the space required for traditional fanout vias or dogbone via patterns. The solution is Via-in-Pad, and APTPCB offers the full suite of IPC-4761 plugging and filling processes to support this.
Via-in-Pad Configurations
- Via-in-Pad Open: Lowest cost, but susceptible to solder wicking.
- Via-in-Pad Plugged: Partially plugs the barrel to restrict solder flow.
- Via-in-Pad Filled: Completely fills the barrel for uniform surfaces.
- Via-in-Pad Capped: Adds plated metal over the fill for solderability.
- Via-in-Pad Plated Over (VIPPO): Drill → plate → fill → planarize → cap for perfectly flat pads.
Material Science in Via Filling
- Resin / Epoxy-Filled Via: Non-conductive fill matched to laminate CTE.
- Non-Conductive Filled Via: Provides electrical isolation beneath the cap.
- Conductive Filled Via: Legacy silver/copper paste for special cases.
- Copper-Filled Via: Solid copper plating for stacked microvias.
- Epoxy Backfilled Via: Smooths controlled-depth features for planar surfaces.
Tenting & Protection
- Via Tenting / Tented Via: Covered with dry-film mask.
- Via Plugging: Solder mask ink forced into the hole.
- Soldermask-Defined Plugged Via: Mask opening governs plug geometry.
- Plugged & Capped Via: Hermetic seal combining resin plug and metal cap.
- Via Overprint: Overcoats plugs to guarantee insulation.
4. Signal Integrity: Backdrilling and Impedance Control
In the era of 5G, 112G PAM4, and PCIe Gen5, the physical structure of the via can degrade signal quality. APTPCB implements advanced drilling techniques to mitigate these effects.
Backdrilling (Stub Removal)
- Backdrilled Via: Controlled-depth drilling from the secondary side removes copper stubs.
- Stub Removal Drill: Tight depth tolerances protect active layers.
- Via Barrel Relief: Manages transition zones for cleaner signal paths.
High-Speed & RF Optimization
- Controlled Impedance Via: Dialed-in diameters and anti-pad clearances.
- High-Speed / Differential Pair Via: Precise registration preserves coupling.
- RF / Microwave Via: Smooth walls and exact geometry minimize loss.
- Shielding Structures: Dense via fences, stitching, and Faraday cages protect sensitive RF blocks.
5. Thermal Management and Power Delivery
Heat is the primary enemy of reliability in power electronics. APTPCB manufacturing capabilities are integral to your thermal management strategy.
- Thermal Via / Via Array: Dense fields transfer heat to inner planes or heatsinks.
- Heat Dissipation Via: Copper-filled or heavy-copper drills maximize thermal mass.
- Metal Core Via (MCPCB): Drilling through aluminum/copper substrates, including resin-core isolation.
- Power / Ground / High-Current Via: Optimized drilling and plating for up to 10 oz copper barrels.
- Copper-Dome / Copper-Capped Via: Enhances surface heat spreading.
6. Board Edge and Mechanical Fabrication
Your PCB is often part of a larger mechanical assembly. We provide specialized edge machining to facilitate system integration.
- Castellated Hole / Castellation: Half-plated holes along panel borders so modules can be surface mounted.
- Edge Plated Hole / Edge Via: Wrap-around plating for chassis ground or EMI shielding.
- Edge Slot / Via for Board-Edge Module: Creates precise connector interfaces.
- Via for Shield Can: Dedicated drill hits to retain and ground RF cans.
7. Quality Assurance, Testing, and Reliability
A drilled hole is only as good as its verification. We integrate drilling into a holistic quality control ecosystem.
Testing & Verification
- Test Via / Probe Via: Reserved nodes for electrical connectivity checks.
- ICT Test Hole / Flying-Probe Via: Clean, unmasked pads for probe access.
- Fiducial / Alignment / Registration Hole: Confirms layer-to-layer alignment and supports AOI.
Reliability Processes
- Cross-Section Analysis: Coupon destruction verifies plating integrity.
- Desmear: Plasma-prepared hole cycles to remove drill smear (melted resin) from the hole wall, ensuring perfect interconnection between barrel and internal copper layers.
- Moisture Relief Holes: Vent, gas, and vacuum relief holes prevent delamination.
- Solder Thieving Hole: Protects against solder bridging during wave processes.
- Deep / Multi-Depth / Step-Drilled Holes: Precision Z-axis control for blind mechanical features.
- Non-Functional Pad Via: Added or removed per signal-integrity requirements.
- Cavity / Embedded Via: Supports die or component embedding.