Phase 1
- 1) Solder Paste Inspection (SPI): 3D SPI measures thickness, volume, area, and alignment to detect underprinting, excess paste, misalignment, and bridging.
- 2) Pre-reflow Inspection (AOI): Checks correct placement, orientation, polarity, types, and missing or misplaced parts before reflow to prevent rework.
- 3) Reflow Soldering & Wave Soldering Control: Lead-free profiles (e.g., SAC305), multiple reflow passes for double-sided SMT, and controlled wave soldering; every curve is documented for traceability.
