Assembly Services

PCBA Programs – Sourcing to System Delivery

Lifecycle-aware sourcing, SMT/THT assembly, ICT/FCT, firmware load and box-build delivery with MES traceability.

First-Pass Yield98–99%

SPI/AOI/AXI inline with SPC dashboards.

Coverage DesignICT + FCT

Fixtures, programming, and failure analysis.

TraceabilityMES Linked

Lot, reel, and date-code tied to serials.

Operators working on an SMT assembly line with inline inspection
Inline CoverageSPI / AOI / AXI
Test StrategyICT + FCT
Logistics ReadyBox-Build

Lifecycle Modules

Full-Stack PCBA Services

Pair sourcing, production, testing, and delivery modules to match any build stageβ€”from EVT spin to steady MP ramps.

Prototype PCB Assembly

EVT

24–72 h material confirmation, rapid stencil turns, and fixture-light builds for EVT/DVT loops.

  • DFM/DFA + BOM scrub <24 h
  • 01005 / 0.3 mm CSP capable lines
  • Documentation package after every spin
Explore Capability β†’

Turnkey PCBA

Lifecycle

Single accountable team for sourcing, assembly, test, and delivery.

  • AVL controls + alternates
  • ICT/FCT coverage options
  • Box-build logistics + burn-in
Explore Capability β†’

Flex & Rigid-Flex Assembly

Flex

Stiffener design, carrier tooling, and controlled handling for flex and rigid-flex harness builds.

  • Adhesiveless PI + LCP programs
  • Custom carriers + depanel tooling
  • Dynamic bend + reliability checks
Explore Capability β†’

Components & BOM

Supply

Lifecycle, alternates, and risk mitigation across suppliers and lots.

  • AVL & MPN mapping
  • PPV tracking dashboards
  • Obsolescence planning
Explore Capability β†’

SMT / THT Assembly

Production

Inline SPI/AOI/AXI, reflow profiling, selective soldering, and conformal coating.

  • Fine-pitch & BGA placement
  • Mixed-tech SMT + THT lines
  • SPC dashboards + ROSE logs
Explore Capability β†’

SMT Stencil & Tooling

Tooling

Laser-cut stencils, step-down programs, and carrier/tooling packages tuned for each build.

  • Stencil design review
  • Step/relief documentation
  • Carrier / wave pallet readiness
Explore Capability β†’

Testing & Quality

Coverage

Coverage design, ICT fixtures, boundary scan, functional test, and traceability.

  • ICT + FCT strategy
  • Serial tracking + MES hooks
  • Failure analysis & reporting
Explore Capability β†’

NPI Assembly

NPI

Rapid DFM feedback, proto-to-production, and EVT/DVT/PVT change control.

  • DFM/DFA + fixture readiness
  • Engineering change management
  • Pilot to ramp governance
Explore Capability β†’

Box Build Assembly

System

Final enclosure assembly, wiring, firmware load, burn-in, and logistics for ready-to-ship systems.

  • Sub-system integration
  • Labeling + serialization
  • Burn-in / ESS workflows
Explore Capability β†’

IC Programming & Test

Programming

Secure firmware load, device serialization, and verification before SMT or post-assembly.

  • Gang/programming fixtures
  • Secure image handling
  • Verification + trace logs
Explore Capability β†’

Mass Production

Volume

High-mix/high-volume programs with automotive-grade traceability.

  • Automotive PPAP packages
  • MES dashboards + SRM scorecards
  • 24/7 capacity visibility
Explore Capability β†’

BOM β†’ Box Build

Workflow Anchored in Evidence

Intake, process, coverage, and delivery checkpoints pull from mirrored SMT cells so every decision lands with data.

Intake

BOM & AVL Alignment

Lifecycle analysis, alternates, and PPV tracking across sources.

  • AVL + risk scoring
  • Drop-in alternates
  • Lot/date-code controls
Process

Process Engineering

Stencil, reflow, selective solder, and coating programs authored per build.

  • DFM/DFA review
  • Profile development
  • SMT line setup & SPC
Coverage

Coverage & Fixtures

ICT/FCT definition, fixture builds, firmware load, and calibration.

  • ICT coverage map
  • Boundary scan integration
  • Fixture management
Delivery

Box-Build & Logistics

System assembly, serialization, burn-in, and distribution ready.

  • Labeling & packaging
  • Burn-in & stress test
  • Global fulfillment

Quality & Coverage

Measured Yields and Traceability

Inline SPI/AOI/AXI, ICT/FCT coverage, and MES traceability convert into predictable FPY windows.

  • 98–99%First-Pass Yield

    SPI, AOI, AXI inline with SPC dashboards.

  • 24 hNPI Feedback Loop

    Engineering response for build issues and ECOs.

  • 100%Lot Traceability

    Lot, reel, and date-code linked to serialized units.

Templates & Guides

Assembly Resources

Pull checklists, coverage plans, and traceability worksheets directly into your build package.

PCBA Testing Library

Coverage templates, fixture briefs, and pass/fail logs.

Open β†’

Quality & Compliance

AS6081, IPC-A-610, traceability workflows, and scorecards.

Open β†’

Control Plan Template

DFM + PFMEA inputs, inspection plan, and reaction thresholds.

Open β†’

AQL Cheatsheet

Inspection levels, sampling plans, and defect categorization.

Open β†’

Traceability Toolkit

Serialization mapping, label formats, and retention policy.

Open β†’

Turnkey Checklist

Pre-build readiness, AVL alignment, and coverage sign-off.

Open β†’

PCBA FAQs

Clarity on alternates, fixtures, and box-build delivery.

How do you manage alternates and lifecycle risk?
We maintain AVL linkage, lifecycle scoring, and approved alternates. PPV tracking plus lot/date-code controls are tied to MES records and supplier scorecards.
What test coverage can you support?
ICT, boundary scan, functional test, burn-in, and ESS. We design fixtures, load firmware, and capture measurement data linked to every product serial.
Can you support box-build and final system delivery?
Yes. We assemble sub-systems, load firmware, perform system-level tests, manage packaging, and coordinate global distribution or drop-ship.

Ready to align sourcing, assembly, and coverage?

Upload BOM/AVL, Stackups, and test plansβ€”we return coverage + lead-times in under 24 hours.