
POWER ONLY
Mixed copper multilayer
Heavy copper on power layers, standard copper on control and signal layers in one stackup.
ConvertersDrives

3–10 OZ FINISHED COPPER
APTPCB builds heavy copper PCBs with 3–10 oz finished copper for power supplies, motor drives, inverters and EV charging hardware. Send the current map and temperature-rise budget; engineering checks copper weight, spacing, lamination and assembly before the order is released.
Use heavy copper (3 oz / 105 µm finished copper or more) when a trace on standard 1–2 oz copper would have to be too wide to fit, or when a board replaces wiring or a bus bar. Thicker copper carries the same current in a narrower trace, spreads heat from power parts, and holds up better at plated holes and connector pins.
The price is in fabrication: thick copper needs etch compensation, wider spacing, resin-rich lamination and slower drilling. Those limits are listed by copper weight on the heavy copper PCB capabilities page (trace/space, annular ring and lamination rules), so you can check a layout before asking for a quote.
COPPER WEIGHT VS CURRENT
It depends on width, copper weight, allowed temperature rise and how well the board spreads heat. The widths below are external traces on a 1.6 mm FR-4 board at 25 °C ambient, no airflow, for a 20 °C rise, taken from our IPC-2152 heavy copper sizing guide. Use them to pick a starting copper weight, then confirm with IPC-2152 for your stackup.
RFQ CHECKLIST
State finished copper per layer, not starting foil. Most heavy copper quotes stall on that one point.
WHY APTPCB
Engineering checks copper weight against your current and spacing before anything is quoted as final, so you do not pay for 10 oz where 4 oz on the power layers does the job. Mixed constructions, with heavy copper on power layers and standard copper on signal layers, are reviewed as one stackup.
Board fabrication and assembly are quoted together when you need them. Heavy copper boards absorb a lot of soldering heat, so the reflow and selective soldering profile for thick copper through-hole joints is planned with the stackup, not after the boards arrive.
CONSTRUCTIONS
The construction is chosen from where the current flows and how the board is mounted.



COPPER WEIGHT MATRIX
Pick the lightest copper that meets current and temperature rise. Every step up widens the minimum spacing and adds fabrication cost.
If the heat comes from a few parts rather than the current path, a metal core or copper coin may solve it for less. See the high thermal conductivity PCB guide for the comparison.



QUALITY RECORDS
Thick copper failures show up at resin fill, hole walls and finished copper thickness, so that is where inspection is focused.
Copper thickness confirmed by microsection against the weight on the drawing.
Resin fill between thick traces checked for voids before the lot moves on.
Netlist test on every board; hipot where the RFQ calls for it.
Each of these puts high current through the board itself.
AC-DC and DC-DC stages where copper weight sets trace width and heat.
Chargers, BMS and power distribution with long high-current paths.
IGBT and MOSFET stages with through-hole power terminals.
Inverters and combiner boards; see the power and energy PCB page for the full board mix.
COST
Copper weight is only part of it. These are the items that move the quote.
Quality
Per lot
Cost
Fabrication
Cost
Design
Questions buyers and power engineers ask before ordering.
Upload the fabrication package with current paths and temperature-rise targets. Engineering confirms copper weight per layer, spacing, lamination and assembly before pricing.