Diverse Material Options
Utilizing 96% Alumina (Al₂O₃) and Aluminum Nitride (AlN) for tailored thermal performance.
Ceramic PCB Capability
Ceramic PCB Manufacturing Capabilities
APTPCB specializes in high-performance Ceramic PCB solutions using advanced manufacturing processes such as DPC, LTCC, and DBC. Our ceramic PCBs offer superior thermal management, high reliability, and excellent electrical performance for demanding applications in power electronics, automotive, medical devices, aerospace & defense, and high-frequency RF systems.
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The APTPCB Advantage in Ceramic PCB Manufacturing
Ceramic PCBs are chosen for their exceptional thermal conductivity, robust mechanical properties, and ability to withstand high temperatures and harsh environments.
Advanced Production Technologies
Expertise in DPC (Direct Plated Copper), LTCC (Low-Temperature Co-fired Ceramic), and DBC (Direct Bonded Copper) processes.
Fine Line & Space Technology
Achieving ultra-fine circuit patterns for high-density integration.
Precision Drilling & Laser Processing
Capable of micro-drilling and high-accuracy laser outlining.
Excellent Thermal & Mechanical Reliability
Meeting stringent standards for thermal cycling, adhesion, and solderability.
Comprehensive DFM Support
Engineering team provides Design for Manufacturability guidance to optimize ceramic PCB designs.
Ceramic PCB Manufacturing Capabilities – Detailed Specifications
| Item | Capability Category | Detailed Specification | Notes |
|---|---|---|---|
| 1 | Base Ceramic Materials | 96% Alumina (Al₂O₃) / Aluminum Nitride (AlN) | Excellent thermal and electrical properties |
| 2 | Thermal Conductivity | Al₂O₃: 20–27 W/m·K | AlN: 180–220 W/m·K | Critical for high-power and heat dissipation applications |
| 3 | Substrate Size (Max) | Standard: 114×114 mm, 120×120 mm, 140×130 mm, 190×140 mm | Custom sizes available upon request |
| 4 | Material Thickness | 0.2–1.5 mm (0.2, 0.25, 0.3, 0.38, 0.5, 0.635, 0.8, 1.0, 1.2, 1.5 mm) | Range to meet diverse application needs |
| 5 | Production Technologies | DPC (0.5–10 oz) | LTCC | DBC | Comprehensive ceramic manufacturing solutions |
| 6 | Layers | 1–2 layers | Single and double-sided ceramic PCBs |
| 7 | Copper Weight (Finished) | H/H, 1/1, 2/2, 3/3, 4/4, 5/5, 6/6, 7/7, 8/8, 9/9, 10/10 oz | Achievable with DPC/DBC processes |
| 8 | Min. Line Width / Spacing (DPC) | 0.05–0.6 mm depending on copper weight | Fine line technology for high-density designs |
| 9 | Min. Drilling Holes | 0.06 mm (2.4 mil) | High-precision mechanical drilling |
| 10 | Hole Diameter Tolerance | ±20% (for drilling holes) | Standard tolerance specification |
| 11 | Drilling Shift Angle | ±0.025 mm | Precision in hole alignment |
| 12 | Laser Drilling Capabilities | 0.1–0.6 mm depending on board thickness | Laser drilling for specific hole requirements |
| 13 | Min. Hole-to-Hole Spacing | 0.15 mm (center to center) | For densely packed vias/holes |
| 14 | Copper Plating Filled Via (DPC) | Aspect Ratio ≤5:1, Board Thickness ≤0.635 mm | For enhanced thermal and electrical performance |
| 15 | Outer Shape to Copper Distance | 0.15–0.2 mm | Critical for outline precision |
| 16 | Outer Dimensions Tolerance | ≤±0.05 mm | High precision for overall board dimensions |
| 17 | Laser Outline / Cutting | Multiple tolerance specs: ±0.025–0.1 mm | Max cutting thickness ≤3.0 mm |
| 18 | Solder Mask Thickness | 10–30 µm (line surface) | For precise solder mask application |
| 19 | Solder Mask Tolerance | ±0.05 mm | For accurate solder mask openings |
| 20 | Min. Solder Mask Opening (Pad) | 0.15 mm | For fine pitch pads |
| 21 | Silkscreen (Legend) Min. Width | 0.15 mm | For clear and precise component marking |
| 22 | Surface Finishes | OSP | Immersion Silver | Immersion Tin | ENIG | ENEPIG | Comprehensive range for diverse bonding methods |
| 23 | Copper Foil Peel Strength | >2 N/mm (per IPC-TM-650 2.4.8) | Ensuring robust adhesion of copper to ceramic |
| 24 | Thermal Resistance | 350±10°C, 15 min without delamination (per IPC-TM-650 2.4.7) | High-temperature reliability for demanding applications |
| 25 | Solderability | >95% wetting (per IPC-TM-650 2.4.14) | Ensuring reliable solder joint formation |
| 26 | Bow & Twist | ≤0.3 mm (3‰ per 100 mm) | For optimal flatness |
| 27 | Quality Standards | IPC-A-600 Class 2 / Class 3 | All PCBs manufactured to rigorous industry standards |
| 28 | Certifications | ISO 9001:2015, UL Certified | RoHS & REACH compliant; IATF 16949 (automotive) on request |
| 29 | Electrical Test | 100% E-test (Flying Probe or Fixture Test) | Comprehensive testing for opens/shorts and continuity |
| 30 | Typical lead time | 10–25 working days | Varies by material selection, complexity, and production volume; early engagement recommended |
Ceramic PCB Applications
Ceramic PCBs are ideal for demanding applications requiring superior thermal management and reliability.
Power Electronics
LED lighting, IGBT modules, power converters with thermal conductivity up to 220 W/m·K.
Automotive
Engine control units, power modules, and high-reliability systems requiring thermal cycling validation.
Medical Devices
High-precision sensors, implantable devices, and diagnostic equipment with stringent reliability requirements.
Aerospace & Defense
High-temperature modules, RF/microwave components, and mission-critical systems.
High-Frequency & RF
Antennas, filters, amplifiers, and mmWave components requiring low-loss and high thermal performance.
Ceramic PCB Manufacturing Process
- 1
Material Selection & Intake
Review thermal conductivity requirements, electrical performance targets, and environmental constraints; select Al₂O₃ or AlN substrate.
- 2
Substrate Preparation
Prepare ceramic substrate, define layer stack, and plan copper plating strategy (DPC, LTCC, or DBC).
- 3
Copper Plating & Patterning
Apply copper plating, pattern circuits, and achieve fine-line specifications per design requirements.
- 4
Drilling & Laser Processing
Perform precision mechanical drilling and laser processing for holes, outlines, and custom features.
- 5
Surface Finish & Testing
Apply surface finish (ENIG, ENEPIG, etc.), perform 100% electrical testing, and validate thermal properties.
- 6
Quality Assurance & Reliability
Thermal cycling, adhesion testing, and comprehensive reliability validation before shipment.
Design for Manufacturability (DFM) Support
Our engineering team provides comprehensive DFM guidance to optimize your ceramic PCB designs for performance, reliability, and cost-effectiveness.
Material Selection Expertise
Guiding you in choosing the optimal ceramic substrate (Al₂O₃ or AlN) for your thermal and electrical requirements.
DFM Support for Ceramic Processes
Optimizing your layout for DPC, LTCC, or DBC processes, considering unique aspects like copper adhesion and plating filled vias.
Thermal Management Analysis
Assisting in designing for efficient heat dissipation and validating thermal performance.
Custom Stack-up & Via Design
Tailoring solutions for complex ceramic interconnects and high-density integration.
Frequently Asked Questions
What is a ceramic PCB?
A ceramic PCB uses a ceramic substrate (typically aluminum oxide or aluminum nitride) instead of FR-4. Ceramic substrates offer superior thermal conductivity, excellent electrical performance, and high reliability for demanding applications.
What ceramic materials do you support?
We support 96% Alumina (Al₂O₃) with 20–27 W/m·K thermal conductivity and Aluminum Nitride (AlN) with 180–220 W/m·K. AlN is preferred for extreme heat dissipation; Alumina offers cost-effectiveness.
What manufacturing processes do you use?
We support DPC (Direct Plated Copper), LTCC (Low-Temperature Co-fired Ceramic), and DBC (Direct Bonded Copper) processes. Each process offers different tradeoffs in cost, complexity, and performance.
What is the thermal conductivity advantage of ceramic PCBs?
Ceramic PCBs offer 20–220 W/m·K thermal conductivity compared to ~0.3 W/m·K for FR-4. This enables efficient heat dissipation, extending component life and improving reliability in high-power applications.
What is the maximum substrate size for ceramic PCBs?
APTPCB supports ceramic PCB substrates up to 190×140 mm. Larger sizes may be possible with special arrangements; contact our engineering team for custom requirements.
Can ceramic PCBs handle high-frequency applications?
Yes, ceramic PCBs are ideal for high-frequency RF and microwave applications. The low dielectric loss and stable dielectric constant ensure excellent signal integrity.
What is the typical lead time for ceramic PCBs?
Lead times typically range from 10–25 working days depending on complexity, material selection, and production volume. Early engagement with our engineering team helps optimize schedule.
Are ceramic PCBs more expensive than FR-4?
Yes, ceramic PCBs are more expensive than FR-4 due to specialized materials and manufacturing processes. However, the superior thermal performance and reliability often justify the cost for demanding applications.
Partner with APTPCB for High-Performance Ceramic PCB Solutions
The unique advantages of ceramic PCBs require specialized expertise in design and manufacturing. APTPCB's engineering team is ready to support your most challenging projects with advanced ceramic PCB manufacturing capabilities and dedicated engineering support.