High-Temp Polyimide Platforms
33N/35N/85N hold Tg >250 °C with low CTE, perfect for avionics, burn-in, and metal-backed packages.
- Low-flow options (38N/37N) for bonding
- Matched to 0.8–1.3 ppm/°C Cu CTE
- Supports sequential lam HDI
Materials
Arlon PCB Laminates & Bondply
We manufacture Arlon polyimide, multifunctional epoxy, Thermount®, and CLTE/TC microwave laminates for avionics, RF, and rugged industrial programs. Using data captured from RayPCB builds, we catalog press curves, low-flow behavior, and microwave validation artifacts so 33N/35N, 45N, Thermount®, and CLTE-XT stacks meet IPC/MIL and RF targets.
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When to Deploy Arlon Laminates
Thermount® Moisture Control
Thermount® 55NT/85NT minimizes moisture uptake and warpage in mission-critical control electronics.
- Moisture regain <0.7%
- Dimensional stability in wide temps
- Great for flex-to-rigid transitions
CLTE/TC Microwave Performance
CLTE-XT, TC350/600, and AD-series deliver Df down to 0.0009 with low PIM for phased arrays and satcom payloads.
- Stable Dk vs temperature
- Low oxidation copper options
- Low PIM validation logs
Arlon Families We Build Regularly
| Series | Primary Use | Examples |
|---|---|---|
| Polyimide | Avionics, burn-in, metal-backed | 33N, 35N, 85N, 38N |
| Multifunctional Epoxy | Lead-free digital/HDI builds | 45N, 47N, 49N, 44N |
| Thermount® | Low moisture & low CTE control | 55NT, 55LK, 85NT |
| Microwave PTFE | RF/microwave arrays, radar | CLTE-XT, CLTE-MW, TC350, TC600 |
| Bondply / Adhesives | Hybrid integration | HF-50, 37N low-flow, PTFE bondply |
Representative Arlon Properties
| Material | Dielectric Constant @1 MHz/10 GHz | Df | Notes |
|---|---|---|---|
| 33N Polyimide | 3.5 @1 MHz | 0.015 | High-Tg, low-flow for bonding copper coins |
| 35N High-Temp | 3.5 @1 MHz | 0.012 | Preferred for avionics backplanes |
| 45N Multifunctional Epoxy | 3.7 @1 MHz | 0.014 | Lead-free compatible HDI builds |
| Thermount® 55NT | 3.5 @1 MHz | 0.017 | Reinforced non-woven aramid |
| CLTE-XT | 2.94 @10 GHz | 0.0015 | Low PIM microwave laminate |
| TC350 | 3.5 @10 GHz | 0.003 | 0.85 W/m·K thermal conductivity |
Values referenced from Arlon datasheets mirrored on RayPCB; verify against lot-specific certs for solver accuracy.
Sample Arlon Stackups
10-Layer Avionics Polyimide
33N/38N cores with HF-50 bondply and copper coins for thermal paths.
- Symmetric build limits warp <0.7%
- Coin machining drawings included
- IST/CAF data packages
6-Layer Thermount® Control
Thermount® 55NT outer plies bonded to 45N epoxy for rugged controllers.
- Moisture bake + storage logs
- Selective ENIG for connectors
- TDR coupons ±5% impedance
8-Layer CLTE-XT Microwave
CLTE-XT RF layers mixed with 45N support and aluminum backers.
- Bondply choice CLTE-PK or PTFE film
- Backdrill documentation
- PIM/VSWR report pack
Arlon-Specific Manufacturing Controls
Polyimide Press Management
Press temperature/pressure ramps recorded for each polyimide lamination.
- Ramp ≤4 °C/min
- Pressure 350–400 psi
- Cool under pressure to 100 °C
Moisture Conditioning
Thermount® and polyimide baked at 125 °C before fabrication to limit moisture and blistering.
- Bake logs attached
- Desiccant storage <35% RH
- Vacuum bagging for shipment
Metal/Polyimide Bonding
Copper coin and aluminum backer interfaces documented with bond films and torque specs.
- HF-50 or 37N low-flow
- Coin height SPC ±0.05 mm
- X-ray verify coverage
Microwave Validation
CLTE/TC builds get TDR, VNA, and, when required, PIM testing.
- ±5% impedance
- VNA up to 40 GHz
- PIM <-155 dBc optional
Application Snapshots
Avionics Backplanes
33N/35N polyimide backplanes with copper coins and press-fit connectors.
- Press-fit hole SPC
- Sequential lam for thick builds
- ESS logs per lot
Radar & Satcom
CLTE-XT/TC350 arrays with low PIM plating and cavity machining.
- Selective ENEPIG
- Lens/cavity ±50 µm
- PIM test summary
Industrial Controls
Thermount® reinforced controllers requiring low moisture and high stability.
- Conformal coat compatibility
- Thermal cycling -55↔125 °C
- Traceability packs
Arlon Stack Selection Prompts
Inputs gathered before we freeze Arlon material decisions.
Environment
Target temperature, PIM, and moisture conditions inform polyimide vs Thermount vs PTFE.
- Operating temp range
- Moisture/chemical exposure
Hybrid Map
Define where Arlon polyimide meets FR-4, PTFE, or metals.
- Bondply/adhesive type
- Coin/backer interface notes
Validation
Plan IST, CAF, TDR/VNA, and ESS deliverables.
- Coupon IDs & placement
- Required test reports
Arlon PCB FAQ
Which Arlon materials do you keep in stock?
We keep 33N/35N polyimide, 45N/47N epoxies, Thermount® reinforcements, and CLTE/TC microwave cores with matching bondply. Specialty thicknesses can be sourced in 1–2 weeks.
Can Arlon materials be hybridized with PTFE or FR-4?
Yes. Polyimide or epoxy support layers can be combined with PTFE microwave sections using HF-50/37N low-flow or PTFE bond films while logging press curves and CTE data.
What testing accompanies Arlon builds?
Standard deliverables include AOI, ET, IST/CAF (when required), TDR for impedance layers, and VNA/PIM for microwave stacks.