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Material identity and revision
Record the exact Arlon designation, laminate or prepreg form, supplier datasheet revision, slash sheet, thickness, copper and resin style. A generic “Arlon equivalent” remains a release hold.
Polyimide, low-flow and aramid systems
Arlon PCB Laminate Manufacturing
An Arlon PCB uses a current Arlon EMD polyimide, multifunctional epoxy, low-flow prepreg or aramid-reinforced material selected for thermal stability, controlled resin flow or low in-plane expansion. This page separates the current Arlon EMD portfolio from legacy microwave names and shows the evidence needed to release an RFQ, stackup and production build.
33N / 35N / 85N
Polyimide
37N / 38N / 47N / 49N
Low-flow prepreg
55NT / 85NT
Aramid reinforced
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Scope and material identity
Current Arlon EMD materials, separated from legacy microwave names
Arlon PCB manufacturing begins with the exact resin and reinforcement system, not the brand name alone. The current Arlon EMD catalog covers high-temperature polyimides, multifunctional epoxy, low-flow prepregs and nonwoven-aramid materials for multilayer, rigid-flex bonding, heat-sink attachment and controlled-expansion designs.
Legacy Arlon microwave names such as CLTE, TC and AD now appear in the Rogers advanced-electronics portfolio. Those RF materials belong on the Rogers laminate route; current alternatives can also be compared on the Taconic PCB and PTFE PCB pages. Keeping the portfolios separate prevents obsolete callouts, incorrect processing assumptions and duplicate content across material pages.
Before quotation, identify the product designation, supplier datasheet revision, laminate or prepreg form, copper, thickness, PCB stackup and acceptance evidence. A family name such as “Arlon polyimide” is not enough to release material procurement or lamination.
Material decision matrix
Current Arlon families: design trigger and RFQ evidence
Use this table to choose the family to investigate. Compare the epoxy route with the design limits described for high-Tg PCB; final release still requires the exact supplier datasheet and construction.
| Material family | Supplier positioning | Typical design trigger | RFQ evidence |
|---|---|---|---|
| 33N | 250°C Tg flame-retardant polyimide; Arlon publishes 390°C decomposition temperature | High-temperature multilayer where flame rating and thermal stability are explicit inputs | Datasheet revision, slash sheet, construction, assembly profile and finished-board acceptance |
| 35N | 250°C Tg flame-retardant polyimide with low Z-axis expansion and reduced cure time | Harsh-environment multilayer where PTH stress and manufacturing cycle both matter | Layer count, thickness, hole aspect, thermal requirement and lamination route |
| 85N | 250°C Tg pure polyimide for high-layer-count and long-life high-temperature electronics | Aerospace, space, military or industrial designs that explicitly require pure polyimide | Program specification, stackup, copper, via structure, thermal profile and evidence plan |
| 45N | 175°C Tg multifunctional epoxy for higher-layer-count multilayers | Higher-temperature epoxy construction without a polyimide requirement | Stackup, lead-free profile, CAF or reliability requirements and material availability |
| 37N / 38N | 200°C Tg polyimide low-flow prepregs | Rigid-flex bonding, heat-sink attachment or another joint needing controlled resin flow | Flow target, copper relief, cavity geometry, bond area, pressure and cure requirements |
| 47N / 49N | Epoxy low-flow prepregs; 49N has a published 170°C Tg | Epoxy rigid-flex or heat-sink bonding where resin squeeze-out must be limited | Base laminate compatibility, flow window, bondline, temperature limits and test coupon |
| 55NT | Multifunctional epoxy with nonwoven aramid reinforcement and 6-9 ppm/°C in-plane CTE | Low expansion, dimensional stability or reduced board weight around ceramic packages | Package CTE, board outline, layer registration, assembly profile and mechanical validation |
| 85NT | 250°C Tg pure polyimide with nonwoven aramid reinforcement and 6-9 ppm/°C in-plane CTE | High-temperature design needing both polyimide behavior and low in-plane expansion | Thermal requirement, package interface, construction, drilling plan and qualification evidence |
Availability, thicknesses, copper options and prepreg styles are confirmed per RFQ; this page does not claim standing inventory.
Supplier-published reference
Verified material facts and what they do not prove
These values come from current Arlon EMD product pages. They identify material families; they do not replace a controlled datasheet or finished-board qualification.
| Product | Published fact | IPC-4101 reference | Buyer interpretation |
|---|---|---|---|
| 33N | Tg 250°C; Td 390°C; flame-retardant polyimide | /40 and /41 | Confirm exact construction and required UL listing |
| 35N | Tg 250°C; low Z-axis expansion; shorter cure cycle | /40 and /41 | Confirm PTH geometry and lamination cycle |
| 85N | Tg 250°C; pure polyimide | /40 and /41 | Confirm whether pure polyimide is a program requirement |
| 45N | Tg 175°C by DSC; conventional FR-4 lamination conditions | /26 | Do not treat it as interchangeable with polyimide |
| 37N | Tg 200°C polyimide low-flow prepreg | /42 | Release flow and bondline requirements |
| 38N | Tg 200°C polyimide low-flow prepreg | /42 | Confirm current cure and flow data from the selected revision |
| 47N | Epoxy low-flow prepreg; supplier cites 300°F lamination | /21 | Check temperature limits of adjacent materials and parts |
| 49N | Tg 170°C epoxy low-flow prepreg | /26 | Confirm flow window for the actual geometry |
| 55NT / 85NT | 6-9 ppm/°C X-Y CTE; typically about 25% lighter than glass-reinforced laminates | /55 and /53 | Validate package, assembly and mechanical behavior at system level |
Reference standards: IPC-4101 slash sheets listed above. Finished PCB acceptance, such as IPC-6012 class, must be stated separately by the customer.
Selection tradeoff
Arlon polyimide, 45N epoxy or aramid: choose by failure risk
The correct material is the least complex system that closes the documented thermal, dimensional and processing risks.
| Decision | 33N / 35N / 85N | 45N | 55NT / 85NT | Release question |
|---|---|---|---|---|
| Primary value | High-temperature polyimide behavior | Higher-Tg multifunctional epoxy | Low in-plane expansion and lower weight | Which failure mechanism drives the material choice? |
| Published Tg | 250°C | 175°C by DSC | 55NT epoxy; 85NT polyimide at 250°C | Is Tg actually the controlling requirement? |
| Reinforcement | Glass-reinforced polyimide | Glass-reinforced epoxy | Nonwoven aramid | Does package CTE or dimensional stability control? |
| Processing focus | Cure, moisture handling and hole-wall preparation | FR-4-like lamination route with product-specific controls | Registration, drilling and package interaction | Has the supplier processing guide been translated into the traveler? |
| Best-fit evidence | Thermal requirement, microsection and PTH acceptance | Stackup, reflow and finished-board acceptance | Dimensional, registration and assembly evidence | What record will close the risk on pilot units? |
| Common mistake | Selecting polyimide from temperature reputation alone | Treating 45N as a drop-in FR-4 or polyimide substitute | Assuming low CTE alone guarantees solder-joint life | Which assumptions remain unverified? |
| Commercial release | Confirm exact product, form and availability | Confirm construction and availability | Confirm aramid construction and supply route | No material is released from a family name alone |
Final material selection belongs to the customer design authority; manufacturing review confirms the proposed construction and evidence plan.
Manufacturing release flow
Turn the Arlon designation into a controlled build package
The release starts by locking the exact product and datasheet revision, then mapping laminate, prepreg, copper, thickness and slash-sheet requirements into the stackup and fabrication drawing for the multilayer PCB. Any proposed substitution stays open until the customer approves it in writing.
DFM then checks resin-flow demand, copper distribution, cavities or heat-sink bond areas, hole geometry, registration, finished thickness and the assembly thermal profile. Rigid-flex PCB bonding with low-flow materials needs special attention because insufficient flow can trap air while excessive pressure or relief can move resin outside the intended bond area.
The pilot plan assigns evidence to each risk: incoming material identity, lamination records, coupon or microsection requirements, dimensional checks, electrical test and any customer-defined thermal or assembly validation. Only accepted evidence and frozen revisions release the production route.
Construction archetypes
Arlon stackup routes and their release holds
These are decision patterns, not production-ready stackups. Layer count, thickness, resin content and copper are confirmed from the actual design.
| Route | Material system | Typical use | Dominant risk | Required input |
|---|---|---|---|---|
| All-polyimide multilayer | 33N, 35N or 85N laminate and compatible prepreg | High-temperature multilayer | Cure, moisture, Z-axis stress and PTH geometry | Thermal requirement, stackup, hole data and acceptance plan |
| 45N epoxy multilayer | 45N laminate and prepreg | Higher-layer-count epoxy board | Incorrect substitution or reflow assumption | Assembly profile, stackup and reliability criteria |
| Polyimide rigid-flex bond | 37N or 38N low-flow prepreg | Rigid-flex bonding | Voids, squeeze-out and insufficient encapsulation | Flex construction, coverlay relief, bond area and flow target |
| Epoxy rigid-flex bond | 47N or 49N low-flow prepreg | Epoxy rigid-flex construction | Flow window and adjacent-material temperature limit | Base laminate, flex package, cavity geometry and cure limit |
| Heat-sink attachment | Selected low-flow prepreg | Bonded heat spreader or heat sink | Bondline voids, resin starvation and planarity | Metal type, surface condition, bond area, flatness and thermal requirement |
| Low-CTE epoxy aramid | 55NT | Dimension-sensitive board or ceramic-package interface | Registration and assembly mismatch | Package CTE, outline tolerance, assembly profile and support conditions |
| Low-CTE polyimide aramid | 85NT | High-temperature, dimension-sensitive board | Combined thermal, drilling and registration risk | Temperature profile, package interface, construction and evidence plan |
| Legacy material callout | CLTE, TC, AD or another historical designation | Existing drawing or controlled legacy program | Wrong supplier route or obsolete revision | Exact product, original datasheet, approved equivalent rules and current availability |
Release controls
Six controls that prevent an Arlon material callout from becoming a build defect
Each control closes a specific procurement or fabrication risk before production release.
02
Storage and moisture plan
Translate supplier storage, conditioning and bake guidance into the material traveler and assembly handoff. The required treatment depends on the selected resin system and elapsed exposure, not a universal bake claim.
03
Low-flow geometry review
For 37N, 38N, 47N or 49N, review copper relief, cavity edges, bond area, resin containment and void escape. Flow approval must use the actual artwork and construction.
04
Lamination cycle release
Define temperature, pressure, vacuum, dwell, cool-down and book construction from the supplier guide and internal process review. Record approved deviations before the pilot build.
05
Drill and hole-wall route
Match drilling, desmear or etchback and plating preparation to the resin and reinforcement. Hole geometry, smear risk and positive-etchback requirements determine the route.
06
Evidence and change control
Assign material identity, lamination records, microsection, dimensional, electrical and customer-specific evidence to the relevant risk. Freeze material and document revisions after pilot acceptance.
Buyer evidence
Specify the evidence package instead of assuming a certification bundle
Arlon's IPC-4101 slash-sheet statements describe the laminate or prepreg system. They do not automatically define the finished-board acceptance class, test coverage or program compliance. The RFQ and PCB quality plan must separately state the applicable drawing, IPC-6012 class or customer specification and any flow-down requirements.
A practical evidence plan can request material identity or certificate records, lamination traveler data, finished thickness, electrical test, impedance coupon results when controlled impedance is specified, and microsections or dimensional records for the risks identified in DFM. Availability of each deliverable is confirmed during quotation.
Environmental, assembly, package-reliability and end-equipment compliance remain customer qualification activities unless a specific test scope, fixture, method and acceptance limit are contracted. APTPCB manufacturing evidence supports that qualification but does not replace it.
Application-driven selection
Where current Arlon EMD material families can fit
The application identifies the dominant risk; it does not select the material by itself.
Aerospace and defense
High-temperature avionics
33N, 35N or 85N may be evaluated where thermal stability and PTH reliability are explicit program inputs. Final selection follows the controlled specification and qualification plan.
Energy and industrial
Downhole and harsh-environment controls
Polyimide systems may suit electronics exposed to elevated temperature, vibration and long service requirements when the actual mission profile and acceptance tests are defined.
Semiconductor test
Burn-in and test hardware
High-temperature polyimide can be considered for repeated thermal exposure, but connector wear, planarity, copper, assembly and fixture conditions remain separate design inputs.
Multilayer electronics
Higher-layer-count epoxy boards
45N offers a 175°C Tg multifunctional epoxy option when an epoxy process is appropriate and pure polyimide is not a design requirement.
Rigid-flex and thermal hardware
Controlled-flow bonding
37N, 38N, 47N or 49N can address rigid-flex bonding or heat-sink attachment when the resin-flow window and bond geometry are released together.
Dimension-sensitive assemblies
Ceramic-package interfaces
55NT or 85NT may reduce in-plane expansion and board weight, while solder-joint life and package interaction still require assembly-level validation.
Selection and RFQ guide
Choose the Arlon family from the controlling constraint
Start with the failure mode, then release material and manufacturing evidence together.
High-temperature polyimide — 33N, 35N or 85N
Use the program temperature profile, PTH geometry, flame requirement, layer count and supplier product positioning to compare the three 250°C Tg systems. Do not select one from Tg alone.
Higher-temperature epoxy — 45N
Consider 45N when a 175°C Tg multifunctional epoxy and conventional FR-4 lamination route match the design. Compare its role with current Isola material options, then confirm assembly profile and finished-board acceptance before treating it as the lower-complexity choice.
Polyimide low-flow — 37N or 38N
Use these for polyimide rigid-flex bonding or heat-sink attachment when minimal, uniform resin flow is required. Release flow target, vacuum, bond area and cavity geometry with the stackup.
Epoxy low-flow — 47N or 49N
Use the required lamination temperature, Tg, base-laminate compatibility and flow window to choose between the epoxy systems. The finished joint, not the prepreg name, is the acceptance object.
Low in-plane expansion — 55NT or 85NT
Choose the epoxy or polyimide aramid system from the thermal requirement, then validate registration, package CTE, assembly profile, support and mechanical constraints at board and system level.
RFQ release checklist
Send ODB++ or Gerber data, drill files, fabrication drawing, exact material and datasheet revision, stackup, copper and thickness, impedance table, low-flow geometry where used, assembly profile, quantities, revision status and required material, coupon, microsection or dimensional evidence.
FAQ
Arlon PCB manufacturing FAQ
Which current Arlon material families are covered on this page?
The current Arlon EMD families covered here are 33N, 35N and 85N polyimides; 45N multifunctional epoxy; 37N and 38N polyimide low-flow prepregs; 47N and 49N epoxy low-flow prepregs; and 55NT and 85NT nonwoven-aramid systems. The exact product, form, thickness, copper and prepreg construction must be confirmed for each RFQ.
How do Arlon 33N, 35N and 85N differ?
Arlon lists all three as 250°C Tg polyimide systems. 33N is a flame-retardant system with a published 390°C decomposition temperature; 35N targets low Z-axis expansion and shorter cure cycles for harsh environments; 85N is a pure polyimide positioned for high-layer-count, long-life, high-temperature electronics. Selection still depends on the supplier datasheet revision and finished-board requirements.
When is Arlon 45N a better fit than polyimide?
Arlon describes 45N as a tough 175°C Tg multifunctional epoxy for higher-layer-count multilayers that can use conventional FR-4 lamination conditions. It may be the better fit when the design needs a higher-temperature epoxy platform but does not require the thermal profile, resin system or cost of polyimide.
What are Arlon 37N, 38N, 47N and 49N used for?
They are low-flow prepregs used where resin movement must be controlled, such as rigid-flex bonding, heat-sink attachment or selected dielectric-insulator constructions. 37N and 38N are polyimide systems; 47N and 49N are epoxy systems. The flow window, copper relief, cavity geometry and lamination cycle must be reviewed together.
When should 55NT or 85NT aramid-reinforced material be considered?
Arlon publishes 6-9 ppm/°C in-plane expansion for both nonwoven-aramid systems and states that the polymeric reinforcement typically produces boards about 25% lighter than glass-reinforced laminates. 55NT uses multifunctional epoxy, while 85NT uses a 250°C Tg pure polyimide. Package expansion, assembly profile and mechanical design still require system-level validation.
Are CLTE, TC and AD microwave laminates current Arlon EMD products?
The current Arlon EMD product catalog focuses on polyimide, epoxy, low-flow and aramid-reinforced systems. CLTE, TC and AD microwave families are currently presented in the Rogers advanced-electronics portfolio. If a drawing uses a legacy Arlon designation, provide the exact product and datasheet revision so availability and the current supply route can be confirmed rather than assumed.
What should an Arlon PCB RFQ include?
Provide the exact Arlon designation, supplier datasheet revision, laminate and prepreg form, thickness and copper requirements, stackup, controlled-impedance table, drill and via data, finished-board acceptance criteria, assembly profile, quantities, revision status and required evidence such as material certificates, coupons or microsections.
When are Arlon material availability, capability and lead time confirmed?
They are confirmed after review of the exact material designation, construction, thickness, copper, prepreg form, board geometry, lamination route, test evidence, quantity and revision. Material substitutions, fixed lead times or finished-board capability should not be assumed from a family name alone.
Material selector
Compare current Arlon EMD products by release need
Use supplier-published facts to shortlist a family, then confirm the exact datasheet and construction in the RFQ.
Choose an Arlon product
Select a product to view verified release facts.
RFQ coordination
Release the same Arlon material definition across global teams
For international sourcing, keep the product designation, datasheet revision, drawing, evidence and change-control language identical across design, procurement and manufacturing.
Design authority
Material and risk owner
Defines the approved product, thermal or dimensional requirement, allowed substitutions and system-level qualification.
Procurement
Supply and revision control
Confirms the current product form, availability, approved source, lot documentation and commercial assumptions before release.
PCB engineering
Stackup and process route
Maps the selected material into stackup, resin-flow, lamination, drilling, inspection and finished-board acceptance inputs.
Assembly and system test
Downstream validation
Owns assembly profile, package interaction, environmental validation and end-equipment compliance using the agreed board evidence.
Request an Arlon PCB manufacturing review
Send the exact Arlon product and datasheet revision, stackup, drill data, low-flow geometry where applicable, assembly profile and required evidence. Capability, availability and quote are confirmed after technical review.