ENABLEMENT

Support Services - Stencil, Programming, Coating, Harness

Mirror-site data shows that programs stay predictable when one crew owns every supporting service: stencil and paste control, AVL-backed materials, IC programming, surface protection, rework, flux governance, and cable/harness builds. We package all of it with the same traveler as SMT/box build so coverage and documents stay synchronized.

  • 24 h stencil release & print DOE
  • AVL + consigned kits validated before build
  • IC programming + serialization inline
  • Conformal coating, selective solder, harness

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Enablement that removes last-minute risk

Dedicated crews own stencil-to-packaging routines so PCBA, test, and logistics never wait for missing support steps.

COVERAGE

Every support touchpoint under one traveler

Stencil, sourcing, programming, protective coatings, rework, flux governance, and electro-mechanical harness builds share planning data with SMT/box build.

Stencil & print lab

24 h release, DOE, paste control, storage, and wipe audit tied to SMT travelers.

Component governance

AVL-backed kitting, MSD handling, anti-counterfeit inspection, and consigned intake.

Programming & protection

IC programming (SW/HW load), plasma clean, conformal coat, potting, and bake routines.

Mechanical build

Selective solder, BGA reball/repair, cables, harnesses, and pack-out ready for box build.

Support services workflow

ENABLEMENT

Plan -> Stage -> Execute -> Inspect -> Release inside the same traveler.

StencilProgrammingCoatingHarness

PLAYBOOK

Support workflow

Standard gates keep each service audit-ready before SMT or box build.

1

Plan & quote

Intake stencil data, AVL, firmware, coating notes, harness drawings, and logistics requirements.

2

Stage & qualify

Laser stencils, prep fixtures, bake MSD kits, stage flux/paste lots, and validate harness tooling.

3

Execute service

Programming, selective solder, BGA reball, coating, cleaning, harness/cable builds per traveler instructions.

4

Inspect & log

AOI/X-ray, cleanliness, drip charts, torque/continuity logs, photos, and serialization tied to MES.

5

Handoff

Release kits or sub-assemblies to SMT/box build, ship to customer, or store with bonded inventory.

MODULES

Support services catalog

Pick the combinations you need or let us pre-package them for turnkey PCBA/box build programs.

Each module plugs into MES so travelers, documents, and proof points stay aligned.
Steel Stencil

Stencil Lab

Stencil & paste control

Laser stencils, step-down, coating, cleaning, and storage routines tied to SMT line release.

  • 24 h CAD -> laser
  • DOE with aperture swaps
  • Paste lot + wipe log
29" & VG
Formats
80-200 um
Thickness
BOM & AVL

Materials

Components sourcing & kitting

AVL review, alternates, MSD conditioning, anti-counterfeit screening, and consigned intake before SMT.

  • AVL/lifecycle dashboard
  • AS6081 inspection
  • MSD bake + humidity cards
<24 h
BOM feedback
>95%
AVL
View BOM program
Programming

Firmware

IC programming & serialization

Load firmware via SWD/JTAG/USB, log revisions, serialize MAC/keys, and provide golden-unit compare.

  • Dedicated fixtures
  • Inline verification
  • Revision + date code in MES
SWD/JTAG/USB
Interfaces
120 u/hr
Throughput
Coating

Protection

Plasma & conformal coating

Surface prep, masking, spray/dip/robot coat, UV bake, and ionic/ROSE proof for Class 3 builds.

  • Plasma + mask lab
  • UV/IR ovens
  • ROSE <=1.5 ug/cm^2
Acrylic/urethane/silicone
Chemistry
25-75 um
Thk
Selective

Through-Hole

Selective solder & potting

Lead-free selective solder with nitrogen, drip charts, Ti pallets, plus epoxy/potting and cure logs.

  • N2 wave, Ti pallets
  • AOI/X-ray checks
  • Potting cure trace
Dia 3-12 mm
Nozzle
+/-10%
Drip limit
BGA

Rework

BGA reball & repair

Micro BGA reball, pad repair, CSAM/X-ray validation, and documented reflow profiles for audits.

  • 0.3 mm pitch
  • Vacuum pick
  • CSAM/X-ray proof
Class 3
Lots
Profiles + images
Data
No-clean

Chemistry

No-clean flux governance

Flux selection, solids %, preheat, and audit trail plus fallback wash/plasma when customers require data.

  • Flux library with MSDS
  • SPC on solderability
  • Back-up clean recipe
2-11%
Solids
<=1.5 ug/cm^2
ROSE
Cable

Systems

Cable assembly

Cut/strip/crimp coax, power, and signal cables with continuity/hipot data, labeling, and kitting.

  • AWG 10-30
  • VNA/hipot logs
  • Label + heat shrink
100%
Continuity
<=5 m
Length
Harness

Integration

Wire harness build

Harness boards, lacing, bundling, labeling, and torque/continuity data ready for box build or shipment.

  • Cut/strip/crimp automation
  • Barcodes + photos
  • Torque + continuity log
AWG 8-28
Gauge
75+ active
Kits
Box build workflow

PROGRAMS

Representative support bundles

How different industries package support services around SMT and box build.

Automotive support
Automotive

EV traction inverter

Laser-cut step stencils, Ti solder pallets, selective solder, conformal coat with UV cure, torque logs.

Step stencilSelective solderUV coat
Medical support
Medical

Medical imaging

AVL + MSD control, SW/FW programming, Humi-guarded conformal coat, cleanliness <=1.5 ug/cm^2.

MSDCleanlinessProgramming
Telecom support
Telecom

Telecom/5G radio

Stencil DOE, micro BGA reball, flux governance, RF cable build with VNA data, vacuum pack-out.

BGAFluxRF cable
Industrial support
Industrial

Industrial drive

Plasma cleaning, silicone potting, selective solder backplanes, heavy harness continuity logs.

PlasmaPottingHarness

CAPABILITIES

Support capability matrix

Specs that wrap around assembly so every lot ships ready for integration.

Stencil & print

FormatsVectorGuard, framed 29"
Step profileUp to 200 um
Paste controlLog viscosity/temp, QR traceability
DOEA/B print, aperture swap within 24 h

Programming & protection

InterfacesSWD, JTAG, USB, custom pogo
DataSerialization + firmware revision logged
CoatingAcrylic, urethane, silicon, parylene hand-off
CleaningPlasma, DI wash, ionic test

Mechanical

Selective solderLead-free, Ti pallets, nitrogen
BGA reball0.3 mm pitch, X-ray/CSAM
Cables/harnessAWG 28-8, UL/CSA, continuity
PackagingVacuum, desiccant, custom foam

Closed-loop enablement

Every service runs on documented travelers with SPC, cleanliness, torque, or continuity data ready for audits.

Stencil lab

STENCIL

DOE + release

A/B print data before SMT.

Selective solder

SELECTIVE

Nitrogen solder pallets with drip charts.

Harness build

HARNESS

Cut/strip/crimp with continuity logs.

QUALITY

Quality hooks for every service

Stencil DOE, MSD logs, flash code verification, drip charts, ionic cleanliness, CSAM/X-ray, and continuity/torque data stay inside MES with photos for audits.

Documentation

Travelers include DOE, program logs, cure recipes, and cleanliness results.

Inspection

AOI/X-ray/CSAM on rework, ionic & UV inspection on coating, 100% continuity on cables/harness.

Traceability

Flux lots, firmware revisions, harness serials, and torque/continuity data link to packing lists.

Industries & use cases

Automotive & EV

Step stencils, selective solder, conformal, PPAP logs, torque data.

Medical

MSD control, firmware security, cleanliness proof, sterilizable harness.

Telecom / RF

RF cable tuning, flux control, BGA reball with CSAM proof.

Industrial & energy

Potting, heavy harness, hi-pot, and coated assemblies ready for harsh installs.

Bundle support services with your PCBA build

Send BOM/AVL, firmware, coating maps, harness drawings, or rework scope. We respond with plan, cost, and readiness checkpoints.

Frequently Asked Questions

Everything you need to know about HDI PCB technology