Stencil Lab
Stencil & paste control
Laser stencils, step-down, coating, cleaning, and storage routines tied to SMT line release.
- 24 h CAD -> laser
- DOE with aperture swaps
- Paste lot + wipe log
ENABLEMENT
Mirror-site data shows that programs stay predictable when one crew owns every supporting service: stencil and paste control, AVL-backed materials, IC programming, surface protection, rework, flux governance, and cable/harness builds. We package all of it with the same traveler as SMT/box build so coverage and documents stay synchronized.
Dedicated crews own stencil-to-packaging routines so PCBA, test, and logistics never wait for missing support steps.
COVERAGE
Stencil, sourcing, programming, protective coatings, rework, flux governance, and electro-mechanical harness builds share planning data with SMT/box build.
Stencil & print lab
24 h release, DOE, paste control, storage, and wipe audit tied to SMT travelers.
Component governance
AVL-backed kitting, MSD handling, anti-counterfeit inspection, and consigned intake.
Programming & protection
IC programming (SW/HW load), plasma clean, conformal coat, potting, and bake routines.
Mechanical build
Selective solder, BGA reball/repair, cables, harnesses, and pack-out ready for box build.

PLAYBOOK
Standard gates keep each service audit-ready before SMT or box build.
Plan & quote
Intake stencil data, AVL, firmware, coating notes, harness drawings, and logistics requirements.
Stage & qualify
Laser stencils, prep fixtures, bake MSD kits, stage flux/paste lots, and validate harness tooling.
Execute service
Programming, selective solder, BGA reball, coating, cleaning, harness/cable builds per traveler instructions.
Inspect & log
AOI/X-ray, cleanliness, drip charts, torque/continuity logs, photos, and serialization tied to MES.
Handoff
Release kits or sub-assemblies to SMT/box build, ship to customer, or store with bonded inventory.
MODULES
Pick the combinations you need or let us pre-package them for turnkey PCBA/box build programs.
Stencil Lab
Laser stencils, step-down, coating, cleaning, and storage routines tied to SMT line release.
Materials
AVL review, alternates, MSD conditioning, anti-counterfeit screening, and consigned intake before SMT.
Firmware
Load firmware via SWD/JTAG/USB, log revisions, serialize MAC/keys, and provide golden-unit compare.
Protection
Surface prep, masking, spray/dip/robot coat, UV bake, and ionic/ROSE proof for Class 3 builds.
Through-Hole
Lead-free selective solder with nitrogen, drip charts, Ti pallets, plus epoxy/potting and cure logs.
Rework
Micro BGA reball, pad repair, CSAM/X-ray validation, and documented reflow profiles for audits.
Chemistry
Flux selection, solids %, preheat, and audit trail plus fallback wash/plasma when customers require data.
Systems
Cut/strip/crimp coax, power, and signal cables with continuity/hipot data, labeling, and kitting.
Integration
Harness boards, lacing, bundling, labeling, and torque/continuity data ready for box build or shipment.
PROGRAMS
How different industries package support services around SMT and box build.




CAPABILITIES
Specs that wrap around assembly so every lot ships ready for integration.
Every service runs on documented travelers with SPC, cleanliness, torque, or continuity data ready for audits.



QUALITY
Stencil DOE, MSD logs, flash code verification, drip charts, ionic cleanliness, CSAM/X-ray, and continuity/torque data stay inside MES with photos for audits.
Travelers include DOE, program logs, cure recipes, and cleanliness results.
AOI/X-ray/CSAM on rework, ionic & UV inspection on coating, 100% continuity on cables/harness.
Flux lots, firmware revisions, harness serials, and torque/continuity data link to packing lists.
Step stencils, selective solder, conformal, PPAP logs, torque data.
MSD control, firmware security, cleanliness proof, sterilizable harness.
RF cable tuning, flux control, BGA reball with CSAM proof.
Potting, heavy harness, hi-pot, and coated assemblies ready for harsh installs.
Send BOM/AVL, firmware, coating maps, harness drawings, or rework scope. We respond with plan, cost, and readiness checkpoints.
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