4-18 Layer Rigid PCB Stackups

Multi-Layer PCB Stackup

A multi-layer PCB stackup is the ordered laminate structure of copper layers, prepreg, core materials and dielectric spacing that controls board thickness, impedance, signal return paths, power distribution and manufacturability. Compare 298 rigid plated-through-hole references for 4 to 18 layers, then identify when a catalog build is suitable and when a project-specific lamination review is required.

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298Standard rigid stackups

4-18Catalog layer counts

0.4-2.4 mmFinished thickness filters

30/50/70/90%Residual copper presets

±10%Finished thickness tolerance

0.5-5 ozInner copper options

1-5 ozOuter copper options

298Standard rigid stackups

4-18Catalog layer counts

0.4-2.4 mmFinished thickness filters

30/50/70/90%Residual copper presets

±10%Finished thickness tolerance

0.5-5 ozInner copper options

1-5 ozOuter copper options

Stackup Reference for 4-18 Layer Rigid PCBs

Use this multilayer PCB stackup catalog when you need a manufacturable starting point for rigid boards from 4 to 18 layers. Each structure preserves the layer order, copper weights, prepreg/core selections, dielectric thickness and residual copper assumptions used for production planning.

How to use the catalog: select the layer count, target finished thickness, inner/outer copper and residual copper ratio, then compare the stackup table against your impedance, power-plane, signal-return and mechanical constraints. Standard structures shorten DFM review, but they should not override the electrical intent in your design files.

Project-specific review: if the design needs controlled impedance, low-loss material, heavy copper, HDI, sequential lamination, rigid-flex, unusual thickness or a defined flatness limit, submit Gerber X2 or ODB++, drill files, impedance targets and layer notes for review before fabrication release.

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Standard Stackup Filters and What They Decide

The filters are engineering shortcuts, not cosmetic categories. Layer count defines routing and plane options; finished thickness controls mechanical fit; copper weight affects current, etch compensation and resin demand; residual copper ratio helps predict lamination balance, resin fill and warp/twist risk.

Layers: 4, 6, 8, 10, 12, 14, 16 and 18 layer rigid constructions.

Finished thickness: 0.4 / 0.6 / 0.8 / 1.0 / 1.2 / 1.6 / 2.0 / 2.4 mm.

Inner copper: 0.5, 1, 1.5, 2, 3, 4 and 5 oz.

Outer copper: 1-5 oz finished copper.

Residual copper ratio: 30%, 50%, 70% and 90% catalog references for copper-balance planning.

Boundary: these references cover rigid plated-through-hole stackups. Blind or buried vias, via-in-pad, HDI, hybrid RF materials and rigid-flex constructions require project-specific engineering review.

Fundamentals

Core, Prepreg and Copper Balance Basics

A stackup is released only when electrical, mechanical and fabrication constraints agree. The key variables are copper thickness, dielectric height, resin content, glass style, reference-plane placement, drill aspect ratio, finished thickness and panel copper balance.

Prepreg (PP) is semi-cured resin/glass material used to bond copper-patterned cores during lamination. Common catalog entries include 1080 (3.1 mil), 3313 (4.2 mil), 2116 (5.4 mil) and 7628 (7.7 mil), but the final compressed thickness depends on resin flow, copper distribution and press cycle.

Core is a cured dielectric laminate with copper on one or both sides. Core thickness is more stable than prepreg during lamination, so it is often used to lock dielectric spacing for impedance-sensitive layers.

Signal-return check: place high-speed signal layers close to continuous reference planes when impedance and EMI matter.

Mechanical-balance check: distribute copper across the stack to reduce warp and twist risk.

Resin-fill check: confirm prepreg selection when inner layers use heavy copper or have large etched-clearance areas.

Process-boundary check: separate standard rigid stackups from HDI, sequential-lamination and mixed-material builds.

Stackup Selection and Release Gate Matrix

Use this matrix to decide whether a catalog stackup can be quoted directly or needs engineering release before fabrication.

Design condition	Stackup risk	Review action	RFQ inputs
Standard 4-6 layer FR-4 board	Lower risk when thickness, copper and drill aspect ratio fit a catalog build.	Confirm the selected structure, finished thickness, copper weights and surface finish.	Gerber X2 or ODB++, drill/rout files, fabrication drawing and target thickness.
8-18 layer high-speed board	Impedance, return-path, plane-split and registration risks increase with layer count.	Review reference-plane placement, dielectric height and the impedance coupon plan.	Layer map, impedance targets and tolerances, signal classes, copper weights and stackup drawing.
Heavy copper or uneven copper distribution	Resin-fill, thickness, etch-compensation and warp/twist risks increase.	Review residual copper, prepreg resin content, stack symmetry and press assumptions.	Copper distribution, high-current layers, thermal requirements and flatness limits.
Low-loss, RF or mixed dielectric	Dk/Df, CTE and lamination compatibility can affect electrical behavior and process yield.	Confirm the material family, thermal compatibility and impedance model before release.	Material callout, frequency band, loss target, impedance requirements and operating environment.
HDI, blind/buried via or rigid-flex	Sequential lamination, via reliability and flex construction fall outside this rigid catalog.	Use a project-specific stackup review instead of forcing a catalog structure.	Via structure, drill table, flex drawing, bend radius, coverlay and required performance class.

Technical Specifications

Multi-Layer PCB Stackup Configurations

Standard rigid PCB stackup structures for 4 to 18 layers with layer order, copper, prepreg/core data, dielectric thickness and residual copper assumptions.

01-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	1.1 (Core with Cu)
CORE	Core DK:4.6	1.0300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.51mm, tolerance: ±10%

Finished PCB Thickness: 1.61mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

02-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	1.1 (Core with Cu)
CORE	Core DK:4.6	1.0300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

03-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	1.1 (Core with Cu)
CORE	Core DK:4.6	1.0300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

04-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	1.0 (Core with Cu)
CORE	Core DK:4.6	0.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

05-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	1.0 (Core with Cu)
CORE	Core DK:4.6	0.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

06-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	1.0 (Core with Cu)
CORE	Core DK:4.6	0.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

07-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1803
L2-CU	Inner Copper 1.5OZ	0.0525	1.0 (Core with Cu)
CORE	Core DK:4.6	0.8950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.1803
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.47mm, tolerance: ±10%

Finished PCB Thickness: 1.57mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

08-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	2.0 (Core with Cu)
CORE	Core DK:4.6	1.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

09-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	1.94 (Core with Cu)
CORE	Core DK:4.6	1.8700
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

10-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	1.94 (Core with Cu)
CORE	Core DK:4.6	1.8700
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

11-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	1.6 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

12-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	1.6 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.86mm, tolerance: ±10%

Finished PCB Thickness: 1.96mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

13-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	1.5 (Core with Cu)
CORE	Core DK:4.6	1.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.88mm, tolerance: ±10%

Finished PCB Thickness: 1.98mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

14-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	1.6 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

15-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	1.6 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.93mm, tolerance: ±10%

Finished PCB Thickness: 2.03mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

16-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	1.5 (Core with Cu)
CORE	Core DK:4.6	1.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.95mm, tolerance: ±10%

Finished PCB Thickness: 2.05mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

17-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.7 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

18-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.7 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

19-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.7 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.08mm, tolerance: ±10%

Finished PCB Thickness: 1.18mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

20-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.14mm, tolerance: ±10%

Finished PCB Thickness: 1.24mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

21-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.7 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.16mm, tolerance: ±10%

Finished PCB Thickness: 1.26mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

22-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.7 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.15mm, tolerance: ±10%

Finished PCB Thickness: 1.25mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

23-Layer PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.91mm, tolerance: ±10%

Finished PCB Thickness: 1.01mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

24-Layer PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.89mm, tolerance: ±10%

Finished PCB Thickness: 0.99mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

25-Layer PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.88mm, tolerance: ±10%

Finished PCB Thickness: 0.98mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

26-Layer PCBRegular

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.89mm, tolerance: ±10%

Finished PCB Thickness: 0.99mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

27-Layer PCBRegular

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.93mm, tolerance: ±10%

Finished PCB Thickness: 1.03mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

28-Layer PCBRegular

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.92mm, tolerance: ±10%

Finished PCB Thickness: 1.02mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

29-Layer PCBRegular

Thickness:0.8MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.71mm, tolerance: ±10%

Finished PCB Thickness: 0.81mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

30-Layer PCBRegular

Thickness:0.8MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.69mm, tolerance: ±10%

Finished PCB Thickness: 0.79mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

31-Layer PCBRegular

Thickness:0.8MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.68mm, tolerance: ±10%

Finished PCB Thickness: 0.78mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

32-Layer PCBRegular

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)

Thickness after lamination: 0.71mm, tolerance: ±10%

Finished PCB Thickness: 0.81mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

33-Layer PCBRegular

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)

Thickness after lamination: 0.69mm, tolerance: ±10%

Finished PCB Thickness: 0.79mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

34-Layer PCBRegular

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)

Thickness after lamination: 0.68mm, tolerance: ±10%

Finished PCB Thickness: 0.78mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

35-Layer PCBRegular

Thickness:0.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.52mm, tolerance: ±10%

Finished PCB Thickness: 0.62mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

36-Layer PCBRegular

Thickness:0.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.51mm, tolerance: ±10%

Finished PCB Thickness: 0.61mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

37-Layer PCBRegular

Thickness:0.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.49mm, tolerance: ±10%

Finished PCB Thickness: 0.59mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

38-Layer PCBRegular

Thickness:0.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.53mm, tolerance: ±10%

Finished PCB Thickness: 0.63mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

39-Layer PCBRegular

Thickness:0.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.52mm, tolerance: ±10%

Finished PCB Thickness: 0.62mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

40-Layer PCBRegular

Thickness:0.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0705
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0705
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.31mm, tolerance: ±10%

Finished PCB Thickness: 0.41mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

41-Layer PCBRegular

Thickness:0.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0635
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0635
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.3mm, tolerance: ±10%

Finished PCB Thickness: 0.40mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

42-Layer PCBRegular

Thickness:0.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0565
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0565
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.28mm, tolerance: ±10%

Finished PCB Thickness: 0.38mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

43-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0265	0.0265 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	2.0 (Core with Cu)
CORE	Core DK:4.6	1.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L4-CU	Outer Base Copper 1.5OZ	0.0265	0.0265 (Plating to 2OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

44-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.9 (Core with Cu)
CORE	Core DK:4.6	0.7950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.47mm, tolerance: ±10%

Finished PCB Thickness: 1.57mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

45-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2403
PP	7628 RC46% DK:4.74	0.1960	0.2403
L2-CU	Inner Copper 1.5OZ	0.0525	0.9 (Core with Cu)
CORE	Core DK:4.6	0.7950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2403
PP	1080 RC68% DK:4.21	0.0810	0.2403
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

46-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3050
PP	7628 RC46% DK:4.74	0.1960	0.3050
L2-CU	Inner Copper 2OZ	0.0700	0.77 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.3050
PP	2116 RC58% DK:4.45	0.1300	0.3050
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

47-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2910
PP	7628 RC46% DK:4.74	0.1960	0.2910
L2-CU	Inner Copper 2OZ	0.0700	0.77 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2910
PP	2116 RC58% DK:4.45	0.1300	0.2910
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

48-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3430
PP	7628 RC46% DK:4.74	0.1960	0.3430
L2-CU	Inner Copper 2OZ	0.0700	0.77 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.3430
PP	7628 RC46% DK:4.74	0.1960	0.3430
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.56mm, tolerance: ±10%

Finished PCB Thickness: 1.66mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

49-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L2-CU	Inner Copper 3OZ	0.1050	0.8 (Core with Cu)
CORE	Core DK:4.6	0.5900
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.47mm, tolerance: ±10%

Finished PCB Thickness: 1.57mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

50-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3815
PP	7628 RC46% DK:4.74	0.1960	0.3815
L2-CU	Inner Copper 3OZ	0.1050	0.55 (Core with Cu)
CORE	Core DK:4.6	0.3400
L3-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.3815
PP	7628 RC46% DK:4.74	0.1960	0.3815
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

51-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3155
PP	7628 RC46% DK:4.74	0.1960	0.3155
L2-CU	Inner Copper 3OZ	0.1050	0.68 (Core with Cu)
CORE	Core DK:4.6	0.4700
L3-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.3155
PP	2116 RC58% DK:4.45	0.1300	0.3155
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

52-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3780
PP	7628 RC46% DK:4.74	0.1960	0.3780
L2-CU	Inner Copper 4OZ	0.1400	0.51 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.3780
PP	7628 RC46% DK:4.74	0.1960	0.3780
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 1.51mm, tolerance: ±10%

Finished PCB Thickness: 1.61mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

53-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2190
PP	2116 RC58% DK:4.45	0.1300	0.2190
L2-CU	Inner Copper 4OZ	0.1400	0.80 (Core with Cu)
CORE	Core DK:4.6	0.5200
L3-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2190
PP	3313 RC58% DK:4.45	0.1030	0.2190
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

54-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3120
PP	7628 RC46% DK:4.74	0.1960	0.3120
L2-CU	Inner Copper 4OZ	0.1400	0.60 (Core with Cu)
CORE	Core DK:4.6	0.3200
L3-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.3120
PP	2116 RC58% DK:4.45	0.1300	0.3120
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 1.47mm, tolerance: ±10%

Finished PCB Thickness: 1.57mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

55-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1070	0.2855
PP	7628 RC46% DK:4.74	0.1960	0.2855
L2-CU	Inner Copper 5OZ	0.1750	0.67 (Core with Cu)
CORE	Core DK:4.6	0.3200
L3-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2855
PP	3313 RC58% DK:4.45	0.1070	0.2855
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

56-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1070	0.2265
PP	2116 RC58% DK:4.45	0.1370	0.2265
L2-CU	Inner Copper 5OZ	0.1750	0.80 (Core with Cu)
CORE	Core DK:4.6	0.4500
L3-CU	Inner Copper 5OZ	0.1750
PP	2116 RC58% DK:4.45	0.1370	0.2265
PP	3313 RC58% DK:4.45	0.1070	0.2265
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 1.5mm, tolerance: ±10%

Finished PCB Thickness: 1.60mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

57-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1070	0.2855
PP	7628 RC46% DK:4.74	0.1960	0.2855
L2-CU	Inner Copper 5OZ	0.1750	0.67 (Core with Cu)
CORE	Core DK:4.6	0.3200
L3-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2855
PP	3313 RC58% DK:4.45	0.1070	0.2855
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

58-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2885
PP	7628 RC46% DK:4.74	0.1960	0.2885
L2-CU	Inner Copper 1OZ	0.0350	1.6 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2885
PP	3313 RC58% DK:4.45	0.1030	0.2885
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

59-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3085
PP	7628 RC46% DK:4.74	0.1960	0.3085
L2-CU	Inner Copper 1OZ	0.0350	1.6 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.3085
PP	2116 RC58% DK:4.45	0.1300	0.3085
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

60-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3015
PP	7628 RC46% DK:4.74	0.1960	0.3015
L2-CU	Inner Copper 1OZ	0.0350	1.6 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.3015
PP	2116 RC58% DK:4.45	0.1300	0.3015
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

61-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3763
PP	7628 RC46% DK:4.74	0.1960	0.3763
L2-CU	Inner Copper 1.5OZ	0.0525	1.5 (Core with Cu)
CORE	Core DK:4.6	1.3950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.3763
PP	7628 RC46% DK:4.74	0.1960	0.3763
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.36mm, tolerance: ±10%

Finished PCB Thickness: 2.46mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

62-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3658
PP	7628 RC46% DK:4.74	0.1960	0.3658
L2-CU	Inner Copper 1.5OZ	0.0525	1.5 (Core with Cu)
CORE	Core DK:4.6	1.3950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.3658
PP	7628 RC46% DK:4.74	0.1960	0.3658
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.44mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

63-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2893
PP	7628 RC46% DK:4.74	0.1960	0.2893
L2-CU	Inner Copper 1.5OZ	0.0525	1.64 (Core with Cu)
CORE	Core DK:4.6	1.5350
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2893
PP	2116 RC58% DK:4.45	0.1300	0.2893
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

64-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.3370
PP	1080 RC68% DK:4.21	0.0810
PP	7628 RC46% DK:4.74	0.1960
L2-CU	Inner Copper 2OZ	0.0700	1.54 (Core with Cu)
CORE	Core DK:4.6	1.4000
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.3370
PP	1080 RC68% DK:4.21	0.0810
PP	1080 RC68% DK:4.21	0.0810
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

65-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2640
PP	7628 RC46% DK:4.74	0.1960	0.2640
L2-CU	Inner Copper 2OZ	0.0700	1.67 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2640
PP	3313 RC58% DK:4.45	0.1030	0.2640
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

66-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.3090
PP	1080 RC68% DK:4.21	0.0810
PP	7628 RC46% DK:4.74	0.1960
L2-CU	Inner Copper 2OZ	0.0700	1.57 (Core with Cu)
CORE	Core DK:4.6	1.4300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.3090
PP	1080 RC68% DK:4.21	0.0810
PP	1080 RC68% DK:4.21	0.0810
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

67-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2665
PP	7628 RC46% DK:4.74	0.1960	0.2665
L2-CU	Inner Copper 3OZ	0.1050	1.6 (Core with Cu)
CORE	Core DK:4.6	1.3900
L3-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.2665
PP	1080 RC68% DK:4.21	0.0810	0.2665
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

68-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2005
PP	2116 RC58% DK:4.45	0.1300	0.2005
L2-CU	Inner Copper 3OZ	0.1050	1.73 (Core with Cu)
CORE	Core DK:4.6	1.5200
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2005
PP	1080 RC68% DK:4.21	0.0810	0.2005
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

69-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2850
PP	7628 RC46% DK:4.74	0.1960	0.2850
L2-CU	Inner Copper 4OZ	0.1400	1.5 (Core with Cu)
CORE	Core DK:4.6	1.2200
L3-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2850
PP	3313 RC58% DK:4.45	0.1030	0.2850
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

70-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2630
PP	7628 RC46% DK:4.74	0.1960	0.2630
L2-CU	Inner Copper 4OZ	0.1400	1.54 (Core with Cu)
CORE	Core DK:4.6	1.2600
L3-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2630
PP	1080 RC68% DK:4.21	0.0810	0.2630
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

71-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2595
PP	7628 RC46% DK:4.74	0.1960	0.2595
L2-CU	Inner Copper 5OZ	0.1750	1.54 (Core with Cu)
CORE	Core DK:4.6	1.1900
L3-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2595
PP	1080 RC68% DK:4.21	0.0810	0.2595
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

72-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2595
PP	7628 RC46% DK:4.74	0.1960	0.2595
L2-CU	Inner Copper 5OZ	0.1750	1.54 (Core with Cu)
CORE	Core DK:4.6	1.1900
L3-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2595
PP	1080 RC68% DK:4.21	0.0810	0.2595
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

73-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3763
PP	7628 RC46% DK:4.74	0.1960	0.3763
L2-CU	Inner Copper 1.5OZ	0.0525	1.1 (Core with Cu)
CORE	Core DK:4.6	0.9950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.3763
PP	7628 RC46% DK:4.74	0.1960	0.3763
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.96mm, tolerance: ±10%

Finished PCB Thickness: 2.06mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

74-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3658
PP	7628 RC46% DK:4.74	0.1960	0.3658
L2-CU	Inner Copper 1.5OZ	0.0525	1.1 (Core with Cu)
CORE	Core DK:4.6	0.9950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.3658
PP	7628 RC46% DK:4.74	0.1960	0.3658
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

75-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3553
PP	7628 RC46% DK:4.74	0.1960	0.3553
L2-CU	Inner Copper 1.5OZ	0.0525	1.1 (Core with Cu)
CORE	Core DK:4.6	0.9950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.3553
PP	7628 RC46% DK:4.74	0.1960	0.3553
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.92mm, tolerance: ±10%

Finished PCB Thickness: 2.02mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

76-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3050
PP	7628 RC46% DK:4.74	0.1960	0.3050
L2-CU	Inner Copper 2OZ	0.0700	1.17 (Core with Cu)
CORE	Core DK:4.6	1.0300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.3050
PP	2116 RC58% DK:4.45	0.1300	0.3050
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

77-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2910
PP	7628 RC46% DK:4.74	0.1960	0.2910
L2-CU	Inner Copper 2OZ	0.0700	1.17 (Core with Cu)
CORE	Core DK:4.6	1.0300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2910
PP	2116 RC58% DK:4.45	0.1300	0.2910
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.86mm, tolerance: ±10%

Finished PCB Thickness: 1.96mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

78-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3430
PP	7628 RC46% DK:4.74	0.1960	0.3430
L2-CU	Inner Copper 2OZ	0.0700	1.17 (Core with Cu)
CORE	Core DK:4.6	1.0300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.3430
PP	7628 RC46% DK:4.74	0.1960	0.3430
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.96mm, tolerance: ±10%

Finished PCB Thickness: 2.06mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

79-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2665
PP	7628 RC46% DK:4.74	0.1960	0.2665
L2-CU	Inner Copper 3OZ	0.1050	1.20 (Core with Cu)
CORE	Core DK:4.6	0.9900
L3-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.2665
PP	1080 RC68% DK:4.21	0.0810	0.2665
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.91mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

80-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3155
PP	7628 RC46% DK:4.74	0.1960	0.3155
L2-CU	Inner Copper 3OZ	0.1050	1.07 (Core with Cu)
CORE	Core DK:4.6	0.8600
L3-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.3155
PP	2116 RC58% DK:4.45	0.1300	0.3155
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.88mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

81-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2850
PP	7628 RC46% DK:4.74	0.1960	0.2850
L2-CU	Inner Copper 4OZ	0.1400	1.06 (Core with Cu)
CORE	Core DK:4.6	0.7800
L3-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2850
PP	3313 RC58% DK:4.45	0.1030	0.2850
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 1.88mm, tolerance: ±10%

Finished PCB Thickness: 1.98mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

82-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2190
PP	2116 RC58% DK:4.45	0.1300	0.2190
L2-CU	Inner Copper 4OZ	0.1400	1.2 (Core with Cu)
CORE	Core DK:4.6	0.9200
L3-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2190
PP	3313 RC58% DK:4.45	0.1030	0.2190
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 1.88mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

83-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2595
PP	7628 RC46% DK:4.74	0.1960	0.2595
L2-CU	Inner Copper 5OZ	0.1750	1.13 (Core with Cu)
CORE	Core DK:4.6	0.7800
L3-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2595
PP	1080 RC68% DK:4.21	0.0810	0.2595
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

84-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3085
PP	7628 RC46% DK:4.74	0.1960	0.3085
L2-CU	Inner Copper 5OZ	0.1750	1.02 (Core with Cu)
CORE	Core DK:4.6	0.6700
L3-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.3085
PP	2116 RC58% DK:4.45	0.1300	0.3085
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 1.88mm, tolerance: ±10%

Finished PCB Thickness: 1.98mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

85-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L2-CU	Inner Copper 1.5OZ	0.0525	0.498 (Core with Cu)
CORE	Core DK:4.6	0.3930
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

86-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.498 (Core with Cu)
CORE	Core DK:4.6	0.3930
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.07mm, tolerance: ±10%

Finished PCB Thickness: 1.17mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

87-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L2-CU	Inner Copper 1.5OZ	0.0525	0.579 (Core with Cu)
CORE	Core DK:4.6	0.4740
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.13mm, tolerance: ±10%

Finished PCB Thickness: 1.23mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

88-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2780
PP	7628 RC46% DK:4.74	0.1960	0.2780
L2-CU	Inner Copper 2OZ	0.0700	0.40 (Core with Cu)
CORE	Core DK:4.6	0.2600
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2780
PP	3313 RC58% DK:4.45	0.1030	0.2780
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.06mm, tolerance: ±10%

Finished PCB Thickness: 1.16mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

89-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2910
PP	7628 RC46% DK:4.74	0.1960	0.2910
L2-CU	Inner Copper 2OZ	0.0700	0.40 (Core with Cu)
CORE	Core DK:4.6	0.2600
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2910
PP	2116 RC58% DK:4.45	0.1300	0.2910
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

90-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2770
PP	7628 RC46% DK:4.74	0.1960	0.2770
L2-CU	Inner Copper 2OZ	0.0700	0.449 (Core with Cu)
CORE	Core DK:4.6	0.3090
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2770
PP	2116 RC58% DK:4.45	0.1300	0.2770
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

91-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L2-CU	Inner Copper 3OZ	0.1050	0.406 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.08mm, tolerance: ±10%

Finished PCB Thickness: 1.18mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

92-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2885
PP	7628 RC46% DK:4.74	0.1960	0.2885
L2-CU	Inner Copper 3OZ	0.1050	0.34 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.2885
PP	3313 RC58% DK:4.45	0.1030	0.2885
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

93-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3155
PP	7628 RC46% DK:4.74	0.1960	0.3155
L2-CU	Inner Copper 3OZ	0.1050	0.291 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.3155
PP	2116 RC58% DK:4.45	0.1300	0.3155
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.1mm, tolerance: ±10%

Finished PCB Thickness: 1.20mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

94-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2850
PP	7628 RC46% DK:4.74	0.1960	0.2850
L2-CU	Inner Copper 4OZ	0.1400	0.361 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2850
PP	3313 RC58% DK:4.45	0.1030	0.2850
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 4OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

95-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 4OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2630
PP	7628 RC46% DK:4.74	0.1960	0.2630
L2-CU	Inner Copper 4OZ	0.1400	0.41 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2630
PP	1080 RC68% DK:4.21	0.0810	0.2630
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 4OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

96-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2190
PP	2116 RC58% DK:4.45	0.1300	0.2190
L2-CU	Inner Copper 4OZ	0.1400	0.476 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2190
PP	3313 RC58% DK:4.45	0.1030	0.2190
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 4OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

97-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1030	0.1885
PP	3313 RC58% DK:4.45	0.1030	0.1885
L2-CU	Inner Copper 5OZ	0.1750	0.546 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.1885
PP	3313 RC58% DK:4.45	0.1030	0.1885
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 5OZ)

Thickness after lamination: 1.1mm, tolerance: ±10%

Finished PCB Thickness: 1.20mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

98-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2155
PP	2116 RC58% DK:4.45	0.1300	0.2155
L2-CU	Inner Copper 5OZ	0.1750	0.48 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 5OZ	0.1750
PP	2116 RC58% DK:4.45	0.1300	0.2155
PP	3313 RC58% DK:4.45	0.1030	0.2155
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 5OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

99-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 5OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2425
PP	2116 RC58% DK:4.45	0.1300	0.2425
L2-CU	Inner Copper 5OZ	0.1750	0.453 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 5OZ	0.1750
PP	2116 RC58% DK:4.45	0.1300	0.2425
PP	2116 RC58% DK:4.45	0.1300	0.2425
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 5OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

100-Layer PCBStandard

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L2-CU	Inner Copper 1.5OZ	0.0525	0.3 (Core with Cu)
CORE	Core DK:4.6	0.1950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.89mm, tolerance: ±10%

Finished PCB Thickness: 1.00mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

101-Layer PCBStandard

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.3 (Core with Cu)
CORE	Core DK:4.6	0.1950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.87mm, tolerance: ±10%

Finished PCB Thickness: 0.97mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

102-Layer PCBStandard

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L2-CU	Inner Copper 1.5OZ	0.0525	0.3 (Core with Cu)
CORE	Core DK:4.6	0.1950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.85mm, tolerance: ±10%

Finished PCB Thickness: 0.95mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

103-Layer PCBStandard

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L2-CU	Inner Copper 2OZ	0.0700	0.27 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.85mm, tolerance: ±10%

Finished PCB Thickness: 0.95mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

104-Layer PCBStandard

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L2-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.89mm, tolerance: ±10%

Finished PCB Thickness: 0.99mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

105-Layer PCBStandard

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L2-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.86mm, tolerance: ±10%

Finished PCB Thickness: 0.96mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

106-Layer PCBStandard

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2173
PP	2116 RC58% DK:4.45	0.1300	0.2173
L2-CU	Inner Copper 1.5OZ	0.0525	0.185 (Core with Cu)
CORE	Core DK:4.6	0.0800
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2173
PP	3313 RC58% DK:4.45	0.1030	0.2173
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.72mm, tolerance: ±10%

Finished PCB Thickness: 0.82mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

107-Layer PCBStandard

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2068
PP	2116 RC58% DK:4.45	0.1300	0.2068
L2-CU	Inner Copper 1.5OZ	0.0525	0.185 (Core with Cu)
CORE	Core DK:4.6	0.0800
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2068
PP	3313 RC58% DK:4.45	0.1030	0.2068
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.7mm, tolerance: ±10%

Finished PCB Thickness: 0.80mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

108-Layer PCBStandard

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.1963
PP	2116 RC58% DK:4.45	0.1300	0.1963
L2-CU	Inner Copper 1.5OZ	0.0525	0.185 (Core with Cu)
CORE	Core DK:4.6	0.0800
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1963
PP	3313 RC58% DK:4.45	0.1030	0.1963
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.68mm, tolerance: ±10%

Finished PCB Thickness: 0.78mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

109-Layer PCBStandard

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L2-CU	Inner Copper 2OZ	0.0700	0.17 (Core with Cu)
CORE	Core DK:4.6	0.0300
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.75mm, tolerance: ±10%

Finished PCB Thickness: 0.85mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

110-Layer PCBStandard

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L2-CU	Inner Copper 2OZ	0.0700	0.17 (Core with Cu)
CORE	Core DK:4.6	0.0300
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.73mm, tolerance: ±10%

Finished PCB Thickness: 0.83mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

111-Layer PCBStandard

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2280
PP	7628 RC46% DK:4.74	0.1960	0.2280
L2-CU	Inner Copper 2OZ	0.0700	0.17 (Core with Cu)
CORE	Core DK:4.6	0.0300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	1080 RC68% DK:4.21	0.0810	0.2280
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.73mm, tolerance: ±10%

Finished PCB Thickness: 0.83mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

112-Layer PCBStandard

Thickness:0.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1375
PP	1080 RC68% DK:4.21	0.0810	0.1375
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1375
PP	1080 RC68% DK:4.21	0.0810	0.1375
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.51mm, tolerance: ±10%

Finished PCB Thickness: 0.61mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

01-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

02-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

03-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

04-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.56mm, tolerance: ±10%

Finished PCB Thickness: 1.66mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

05-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	1.0 (Core with Cu)
CORE	Core DK:4.6	0.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L4-CU	Inner Copper 1OZ	0.0350	1.0 (Core with Cu)
CORE	Core DK:4.6	0.9300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

06-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.35mm, tolerance: ±10%

Finished PCB Thickness: 2.45mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

07-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

08-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L4-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

09-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L4-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

10-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.85mm, tolerance: ±10%

Finished PCB Thickness: 1.95mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

11-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L4-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

12-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

13-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.15mm, tolerance: ±10%

Finished PCB Thickness: 1.25mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

14-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.05mm, tolerance: ±10%

Finished PCB Thickness: 1.15mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

15-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.16mm, tolerance: ±10%

Finished PCB Thickness: 1.26mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

16-Layer PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.91mm, tolerance: ±10%

Finished PCB Thickness: 1.01mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

17-Layer PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.95mm, tolerance: ±10%

Finished PCB Thickness: 1.05mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

18-Layer PCBRegular

Thickness:0.8MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.7mm, tolerance: ±10%

Finished PCB Thickness: 0.80mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

19-Layer PCBRegular

Thickness:0.8MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.7mm, tolerance: ±10%

Finished PCB Thickness: 0.80mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

20-Layer PCBRegular

Thickness:0.8MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.73mm, tolerance: ±10%

Finished PCB Thickness: 0.83mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

21-Layer PCBRegular

Thickness:0.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0705
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0705
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.51mm, tolerance: ±10%

Finished PCB Thickness: 0.61mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

22-Layer PCBRegular

Thickness:0.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0635
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0460
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0635
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.48mm, tolerance: ±10%

Finished PCB Thickness: 0.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

23-Layer PCBRegular

Thickness:0.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0785
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0785
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.52mm, tolerance: ±10%

Finished PCB Thickness: 0.62mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

24-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

25-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.53mm, tolerance: ±10%

Finished PCB Thickness: 1.63mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

26-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L2-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2285
PP	2116 RC58% DK:4.45	0.1300	0.2285
L4-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

27-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L4-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.51mm, tolerance: ±10%

Finished PCB Thickness: 1.61mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

28-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L2-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L4-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.47mm, tolerance: ±10%

Finished PCB Thickness: 1.57mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

29-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L2-CU	Inner Copper 2OZ	0.0700	0.346 (Core with Cu)
CORE	Core DK:4.6	0.2060
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2180
PP	2116 RC58% DK:4.45	0.1300	0.2180
L4-CU	Inner Copper 2OZ	0.0700	0.346 (Core with Cu)
CORE	Core DK:4.6	0.2060
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

30-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L2-CU	Inner Copper 2OZ	0.0700	0.346 (Core with Cu)
CORE	Core DK:4.6	0.2060
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2710
PP	1080 RC68% DK:4.21	0.0810
PP	2116 RC58% DK:4.45	0.1300
L4-CU	Inner Copper 2OZ	0.0700	0.346 (Core with Cu)
CORE	Core DK:4.6	0.2060
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

31-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2500
PP	7628 RC46% DK:4.74	0.1960	0.2500
L2-CU	Inner Copper 2OZ	0.0700	0.346 (Core with Cu)
CORE	Core DK:4.6	0.2060
L3-CU	Inner Copper 2OZ	0.0700
PP	3313 RC58% DK:4.45	0.1030	0.2010
PP	7628 RC46% DK:4.74	0.1960	0.2010
L4-CU	Inner Copper 2OZ	0.0700	0.346 (Core with Cu)
CORE	Core DK:4.6	0.2060
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2500
PP	3313 RC58% DK:4.45	0.1030	0.2500
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.5mm, tolerance: ±10%

Finished PCB Thickness: 1.60mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

32-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L2-CU	Inner Copper 3OZ	0.1050	0.313 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L4-CU	Inner Copper 3OZ	0.1050	0.313 (Core with Cu)
CORE	Core DK:4.6	0.1030
L5-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.54mm, tolerance: ±10%

Finished PCB Thickness: 1.64mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

33-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2225
PP	2116 RC58% DK:4.45	0.1300	0.2225
L2-CU	Inner Copper 3OZ	0.1050	0.34 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 3OZ	0.1050
PP	3313 RC58% DK:4.45	0.1030	0.2120
PP	2116 RC58% DK:4.45	0.1300	0.2120
L4-CU	Inner Copper 3OZ	0.1050	0.34 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2225
PP	3313 RC58% DK:4.45	0.1030	0.2225
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.51mm, tolerance: ±10%

Finished PCB Thickness: 1.61mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

34-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.26mm, tolerance: ±10%

Finished PCB Thickness: 2.36mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

35-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.1885
PP	3313 RC58% DK:4.45	0.1030	0.1885
L2-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.1710
PP	3313 RC58% DK:4.45	0.1030	0.1710
L4-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.1885
PP	3313 RC58% DK:4.45	0.1030	0.1885
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

36-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

37-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L2-CU	Inner Copper 1.5OZ	0.0525	0.74 (Core with Cu)
CORE	Core DK:4.6	0.6350
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2285
PP	2116 RC58% DK:4.45	0.1300	0.2285
L4-CU	Inner Copper 1.5OZ	0.0525	0.74 (Core with Cu)
CORE	Core DK:4.6	0.6350
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

38-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.74 (Core with Cu)
CORE	Core DK:4.6	0.6350
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L4-CU	Inner Copper 1.5OZ	0.0525	0.74 (Core with Cu)
CORE	Core DK:4.6	0.6350
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.26mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

39-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2623
PP	7628 RC46% DK:4.74	0.1960	0.2623
L2-CU	Inner Copper 1.5OZ	0.0525	0.74 (Core with Cu)
CORE	Core DK:4.6	0.6350
L3-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.2255
PP	7628 RC46% DK:4.74	0.1960	0.2255
L4-CU	Inner Copper 1.5OZ	0.0525	0.74 (Core with Cu)
CORE	Core DK:4.6	0.6350
L5-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2623
PP	3313 RC58% DK:4.45	0.1030	0.2623
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

40-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3050
PP	7628 RC46% DK:4.74	0.1960	0.3050
L2-CU	Inner Copper 2OZ	0.0700	0.67 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2840
PP	7628 RC46% DK:4.74	0.1960	0.2840
L4-CU	Inner Copper 2OZ	0.0700	0.67 (Core with Cu)
CORE	Core DK:4.6	0.5300
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.3050
PP	2116 RC58% DK:4.45	0.1300	0.3050
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.44mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

41-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L2-CU	Inner Copper 2OZ	0.0700	0.77 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L4-CU	Inner Copper 2OZ	0.0700	0.77 (Core with Cu)
CORE	Core DK:4.6	0.6300
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

42-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2500
PP	7628 RC46% DK:4.74	0.1960	0.2500
L2-CU	Inner Copper 2OZ	0.0700	0.77 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 2OZ	0.0700
PP	3313 RC58% DK:4.45	0.1030	0.2010
PP	7628 RC46% DK:4.74	0.1960	0.2010
L4-CU	Inner Copper 2OZ	0.0700	0.77 (Core with Cu)
CORE	Core DK:4.6	0.6300
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2500
PP	3313 RC58% DK:4.45	0.1030	0.2500
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.35mm, tolerance: ±10%

Finished PCB Thickness: 2.46mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

43-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1735
PP	3313 RC58% DK:4.45	0.1030	0.1735
L2-CU	Inner Copper 3OZ	0.1050	0.798 (Core with Cu)
CORE	Core DK:4.6	0.5880
L3-CU	Inner Copper 3OZ	0.1050
PP	1080 RC68% DK:4.21	0.0810	0.1630
PP	3313 RC58% DK:4.45	0.1030	0.1630
L4-CU	Inner Copper 3OZ	0.1050	0.798 (Core with Cu)
CORE	Core DK:4.6	0.5880
L5-CU	Inner Copper 3OZ	0.1050
PP	3313 RC58% DK:4.45	0.1030	0.1735
PP	1080 RC68% DK:4.21	0.0810	0.1735
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

44-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L2-CU	Inner Copper 3OZ	0.1050	0.68 (Core with Cu)
CORE	Core DK:4.6	0.4700
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L4-CU	Inner Copper 3OZ	0.1050	0.68 (Core with Cu)
CORE	Core DK:4.6	0.4700
L5-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

45-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3155
PP	7628 RC46% DK:4.74	0.1960	0.3155
L2-CU	Inner Copper 3OZ	0.1050	0.60 (Core with Cu)
CORE	Core DK:4.6	0.3900
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.3050
PP	7628 RC46% DK:4.74	0.1960	0.3050
L4-CU	Inner Copper 3OZ	0.1050	0.60 (Core with Cu)
CORE	Core DK:4.6	0.3900
L5-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.3155
PP	2116 RC58% DK:4.45	0.1300	0.3155
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

46-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L2-CU	Inner Copper 3OZ	0.1050	0.705 (Core with Cu)
CORE	Core DK:4.6	0.4950
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L4-CU	Inner Copper 3OZ	0.1050	0.705 (Core with Cu)
CORE	Core DK:4.6	0.4950
L5-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

47-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2850
PP	7628 RC46% DK:4.74	0.1960	0.2850
L2-CU	Inner Copper 4OZ	0.1400	0.606 (Core with Cu)
CORE	Core DK:4.6	0.3260
L3-CU	Inner Copper 4OZ	0.1400
PP	3313 RC58% DK:4.45	0.1030	0.2710
PP	7628 RC46% DK:4.74	0.1960	0.2710
L4-CU	Inner Copper 4OZ	0.1400	0.606 (Core with Cu)
CORE	Core DK:4.6	0.3260
L5-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2850
PP	3313 RC58% DK:4.45	0.1030	0.2850
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

48-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2630
PP	7628 RC46% DK:4.74	0.1960	0.2630
L2-CU	Inner Copper 4OZ	0.1400	0.643 (Core with Cu)
CORE	Core DK:4.6	0.3630
L3-CU	Inner Copper 4OZ	0.1400
PP	1080 RC68% DK:4.21	0.0810	0.2490
PP	7628 RC46% DK:4.74	0.1960	0.2490
L4-CU	Inner Copper 4OZ	0.1400	0.643 (Core with Cu)
CORE	Core DK:4.6	0.3630
L5-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2630
PP	1080 RC68% DK:4.21	0.0810	0.2630
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

49-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2850
PP	7628 RC46% DK:4.74	0.1960	0.2850
L2-CU	Inner Copper 4OZ	0.1400	0.62 (Core with Cu)
CORE	Core DK:4.6	0.3400
L3-CU	Inner Copper 4OZ	0.1400
PP	3313 RC58% DK:4.45	0.1030	0.2710
PP	7628 RC46% DK:4.74	0.1960	0.2710
L4-CU	Inner Copper 4OZ	0.1400	0.62 (Core with Cu)
CORE	Core DK:4.6	0.3400
L5-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2850
PP	3313 RC58% DK:4.45	0.1030	0.2850
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

50-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.1920
PP	3313 RC58% DK:4.45	0.1030	0.1920
L2-CU	Inner Copper 4OZ	0.1400	0.753 (Core with Cu)
CORE	Core DK:4.6	0.4730
L3-CU	Inner Copper 4OZ	0.1400
PP	3313 RC58% DK:4.45	0.1030	0.1780
PP	3313 RC58% DK:4.45	0.1030	0.1780
L4-CU	Inner Copper 4OZ	0.1400	0.753 (Core with Cu)
CORE	Core DK:4.6	0.4730
L5-CU	Inner Copper 4OZ	0.1400
PP	3313 RC58% DK:4.45	0.1030	0.1920
PP	3313 RC58% DK:4.45	0.1030	0.1920
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

51-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2815
PP	7628 RC46% DK:4.74	0.1960	0.2815
L2-CU	Inner Copper 5OZ	0.1750	0.627 (Core with Cu)
CORE	Core DK:4.6	0.2770
L3-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.2640
PP	7628 RC46% DK:4.74	0.1960	0.2640
L4-CU	Inner Copper 5OZ	0.1750	0.627 (Core with Cu)
CORE	Core DK:4.6	0.2770
L5-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2815
PP	3313 RC58% DK:4.45	0.1030	0.2815
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

52-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3085
PP	7628 RC46% DK:4.74	0.1960	0.3085
L2-CU	Inner Copper 5OZ	0.1750	0.593 (Core with Cu)
CORE	Core DK:4.6	0.2430
L3-CU	Inner Copper 5OZ	0.1750
PP	2116 RC58% DK:4.45	0.1300	0.2910
PP	7628 RC46% DK:4.74	0.1960	0.2910
L4-CU	Inner Copper 5OZ	0.1750	0.593 (Core with Cu)
CORE	Core DK:4.6	0.2430
L5-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.3085
PP	2116 RC58% DK:4.45	0.1300	0.3085
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.44mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

53-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2815
PP	7628 RC46% DK:4.74	0.1960	0.2815
L2-CU	Inner Copper 5OZ	0.1750	0.61 (Core with Cu)
CORE	Core DK:4.6	0.2600
L3-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.2640
PP	7628 RC46% DK:4.74	0.1960	0.2640
L4-CU	Inner Copper 5OZ	0.1750	0.61 (Core with Cu)
CORE	Core DK:4.6	0.2600
L5-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2815
PP	3313 RC58% DK:4.45	0.1030	0.2815
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

54-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2595
PP	7628 RC46% DK:4.74	0.1960	0.2595
L2-CU	Inner Copper 5OZ	0.1750	0.66 (Core with Cu)
CORE	Core DK:4.6	0.3100
L3-CU	Inner Copper 5OZ	0.1750
PP	1080 RC68% DK:4.21	0.0810	0.2420
PP	7628 RC46% DK:4.74	0.1960	0.2420
L4-CU	Inner Copper 5OZ	0.1750	0.66 (Core with Cu)
CORE	Core DK:4.6	0.3100
L5-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2595
PP	1080 RC68% DK:4.21	0.0810	0.2595
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

55-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3015
PP	7628 RC46% DK:4.74	0.1960	0.3015
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2770
PP	7628 RC46% DK:4.74	0.1960	0.2770
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.3015
PP	2116 RC58% DK:4.45	0.1300	0.3015
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.92mm, tolerance: ±10%

Finished PCB Thickness: 2.02mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

56-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2085
PP	2116 RC58% DK:4.45	0.1300	0.2085
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.1840
PP	2116 RC58% DK:4.45	0.1300	0.1840
L4-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2085
PP	3313 RC58% DK:4.45	0.1030	0.2085
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.91mm, tolerance: ±10%

Finished PCB Thickness: 2.01mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

57-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L2-CU	Inner Copper 1.5OZ	0.0525	0.535 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2285
PP	2116 RC58% DK:4.45	0.1300	0.2285
L4-CU	Inner Copper 1.5OZ	0.0525	0.535 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

58-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.535 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L4-CU	Inner Copper 1.5OZ	0.0525	0.535 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.85mm, tolerance: ±10%

Finished PCB Thickness: 1.95mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

59-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2623
PP	7628 RC46% DK:4.74	0.1960	0.2623
L2-CU	Inner Copper 1.5OZ	0.0525	0.535 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.2255
PP	7628 RC46% DK:4.74	0.1960	0.2255
L4-CU	Inner Copper 1.5OZ	0.0525	0.535 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2623
PP	3313 RC58% DK:4.45	0.1030	0.2623
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.93mm, tolerance: ±10%

Finished PCB Thickness: 2.03mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

60-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L2-CU	Inner Copper 2OZ	0.0700	0.57 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2180
PP	2116 RC58% DK:4.45	0.1300	0.2180
L4-CU	Inner Copper 2OZ	0.0700	0.57 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

61-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L2-CU	Inner Copper 2OZ	0.0700	0.57 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L4-CU	Inner Copper 2OZ	0.0700	0.57 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

62-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2280
PP	7628 RC46% DK:4.74	0.1960	0.2280
L2-CU	Inner Copper 2OZ	0.0700	0.57 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 2OZ	0.0700
PP	1080 RC68% DK:4.21	0.0810	0.1790
PP	7628 RC46% DK:4.74	0.1960	0.1790
L4-CU	Inner Copper 2OZ	0.0700	0.57 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	1080 RC68% DK:4.21	0.0810	0.2280
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.88mm, tolerance: ±10%

Finished PCB Thickness: 1.98mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

63-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3155
PP	7628 RC46% DK:4.74	0.1960	0.3155
L2-CU	Inner Copper 3OZ	0.1050	0.416 (Core with Cu)
CORE	Core DK:4.6	0.2060
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.3050
PP	7628 RC46% DK:4.74	0.1960	0.3050
L4-CU	Inner Copper 3OZ	0.1050	0.416 (Core with Cu)
CORE	Core DK:4.6	0.2060
L5-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.3155
PP	2116 RC58% DK:4.45	0.1300	0.3155
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

64-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3155
PP	7628 RC46% DK:4.74	0.1960	0.3155
L2-CU	Inner Copper 3OZ	0.1050	0.372 (Core with Cu)
CORE	Core DK:4.6	0.1620
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.3050
PP	7628 RC46% DK:4.74	0.1960	0.3050
L4-CU	Inner Copper 3OZ	0.1050	0.372 (Core with Cu)
CORE	Core DK:4.6	0.1620
L5-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.3155
PP	2116 RC58% DK:4.45	0.1300	0.3155
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.86mm, tolerance: ±10%

Finished PCB Thickness: 1.96mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

65-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2460
PP	2116 RC58% DK:4.45	0.1300	0.2460
L2-CU	Inner Copper 4OZ	0.1400	0.476 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2320
PP	2116 RC58% DK:4.45	0.1300	0.2320
L4-CU	Inner Copper 4OZ	0.1400	0.476 (Core with Cu)
CORE	Core DK:4.6	0.1960
L5-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2460
PP	2116 RC58% DK:4.45	0.1300	0.2460
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 1.92mm, tolerance: ±10%

Finished PCB Thickness: 2.02mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

66-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2850
PP	7628 RC46% DK:4.74	0.1960	0.2850
L2-CU	Inner Copper 4OZ	0.1400	0.41 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 4OZ	0.1400
PP	3313 RC58% DK:4.45	0.1030	0.2710
PP	7628 RC46% DK:4.74	0.1960	0.2710
L4-CU	Inner Copper 4OZ	0.1400	0.41 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2850
PP	3313 RC58% DK:4.45	0.1030	0.2850
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 1.91mm, tolerance: ±10%

Finished PCB Thickness: 2.01mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

67-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1070	0.2855
PP	7628 RC46% DK:4.74	0.1960	0.2855
L2-CU	Inner Copper 5OZ	0.1750	0.383 (Core with Cu)
CORE	Core DK:4.6	0.0330
L3-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1070	0.2680
PP	7628 RC46% DK:4.74	0.1960	0.2680
L4-CU	Inner Copper 5OZ	0.1750	0.383 (Core with Cu)
CORE	Core DK:4.6	0.0330
L5-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2855
PP	3313 RC58% DK:4.45	0.1070	0.2855
L6-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)

Thickness after lamination: 1.92mm, tolerance: ±10%

Finished PCB Thickness: 2.02mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

68-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1070	0.2855
PP	7628 RC46% DK:4.74	0.1960	0.2855
L2-CU	Inner Copper 5OZ	0.1750	0.36 (Core with Cu)
CORE	Core DK:4.6	0.0100
L3-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1070	0.2680
PP	7628 RC46% DK:4.74	0.1960	0.2680
L4-CU	Inner Copper 5OZ	0.1750	0.36 (Core with Cu)
CORE	Core DK:4.6	0.0100
L5-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2855
PP	3313 RC58% DK:4.45	0.1070	0.2855
L6-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.98mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

69-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.06mm, tolerance: ±10%

Finished PCB Thickness: 1.16mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

70-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.13mm, tolerance: ±10%

Finished PCB Thickness: 1.23mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

71-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2173
PP	2116 RC58% DK:4.45	0.1300	0.2173
L2-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L3-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.2015
PP	2116 RC58% DK:4.45	0.1300	0.2015
L4-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2173
PP	3313 RC58% DK:4.45	0.1030	0.2173
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.12mm, tolerance: ±10%

Finished PCB Thickness: 1.22mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

72-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2068
PP	2116 RC58% DK:4.45	0.1300	0.2068
L2-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L3-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.1805
PP	2116 RC58% DK:4.45	0.1300	0.1805
L4-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2068
PP	3313 RC58% DK:4.45	0.1030	0.2068
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.07mm, tolerance: ±10%

Finished PCB Thickness: 1.17mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

73-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L2-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L4-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

74-Layer PCBStandard

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.86mm, tolerance: ±10%

Finished PCB Thickness: 0.96mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

01-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

02-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

03-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

04-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

05-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

06-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

07-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

08-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

09-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.96mm, tolerance: ±10%

Finished PCB Thickness: 2.06mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

10-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.91mm, tolerance: ±10%

Finished PCB Thickness: 2.01mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

11-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

12-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.85mm, tolerance: ±10%

Finished PCB Thickness: 1.95mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

13-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

14-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.05mm, tolerance: ±10%

Finished PCB Thickness: 1.15mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

15-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.14mm, tolerance: ±10%

Finished PCB Thickness: 1.24mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

16-Layer PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0705
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0705
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.9mm, tolerance: ±10%

Finished PCB Thickness: 1.00mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

17-Layer PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0635
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0635
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.9mm, tolerance: ±10%

Finished PCB Thickness: 1.00mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

18-Layer PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0785
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0785
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.9mm, tolerance: ±10%

Finished PCB Thickness: 1.00mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

19-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2500
PP	3313 RC58% DK:4.45	0.1030	0.2500
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.2500
PP	7628 RC46% DK:4.74	0.1960	0.2500
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

20-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2770
PP	7628 RC46% DK:4.74	0.1960	0.2770
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2770
PP	2116 RC58% DK:4.45	0.1300	0.2770
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.47mm, tolerance: ±10%

Finished PCB Thickness: 1.57mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

21-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2173
PP	2116 RC58% DK:4.45	0.1300	0.2173
L2-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L3-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.2015
PP	2116 RC58% DK:4.45	0.1300	0.2015
L4-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2015
PP	3313 RC58% DK:4.45	0.1030	0.2015
L6-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2173
PP	3313 RC58% DK:4.45	0.1030	0.2173
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.5mm, tolerance: ±10%

Finished PCB Thickness: 1.60mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

22-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L4-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L6-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

23-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L2-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L4-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L6-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

24-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L2-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 2OZ	0.0700
PP	1080 RC68% DK:4.21	0.0810	0.1690
PP	2116 RC58% DK:4.45	0.1300	0.1690
L4-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1690
PP	1080 RC68% DK:4.21	0.0810	0.1690
L6-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	1080 RC68% DK:4.21	0.0810	0.1900
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

25-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.1980
PP	2116 RC58% DK:4.45	0.1300	0.1980
L2-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 2OZ	0.0700
PP	3313 RC58% DK:4.45	0.1030	0.1630
PP	2116 RC58% DK:4.45	0.1300	0.1630
L4-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1630
PP	3313 RC58% DK:4.45	0.1030	0.1630
L6-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1980
PP	3313 RC58% DK:4.45	0.1030	0.1980
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

26-Layer PCBStandard

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L2-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1620
PP	2116 RC58% DK:4.45	0.1300	0.1620
L4-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1620
PP	2116 RC58% DK:4.45	0.1300	0.1620
L6-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.51mm, tolerance: ±10%

Finished PCB Thickness: 1.61mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

27-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	1080 RC68% DK:4.21	0.0810	0.2280
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.2280
PP	7628 RC46% DK:4.74	0.1960	0.2280
L6-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

28-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2525
PP	7628 RC46% DK:4.74	0.1960	0.2525
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.2280
PP	7628 RC46% DK:4.74	0.1960	0.2280
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	1080 RC68% DK:4.21	0.0810	0.2280
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2525
PP	1080 RC68% DK:4.21	0.0810	0.2525
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

29-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2833
PP	7628 RC46% DK:4.74	0.1960	0.2833
L2-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L3-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.2675
PP	7628 RC46% DK:4.74	0.1960	0.2675
L4-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L5-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2675
PP	3313 RC58% DK:4.45	0.1030	0.2675
L6-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L7-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2833
PP	3313 RC58% DK:4.45	0.1030	0.2833
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

30-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2893
PP	7628 RC46% DK:4.74	0.1960	0.2893
L2-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2525
PP	7628 RC46% DK:4.74	0.1960	0.2525
L4-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L5-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2525
PP	2116 RC58% DK:4.45	0.1300	0.2525
L6-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L7-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2893
PP	2116 RC58% DK:4.45	0.1300	0.2893
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

31-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.44 (Core with Cu)
CORE	Core DK:4.6	0.3350
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L4-CU	Inner Copper 1.5OZ	0.0525	0.44 (Core with Cu)
CORE	Core DK:4.6	0.3350
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L6-CU	Inner Copper 1.5OZ	0.0525	0.44 (Core with Cu)
CORE	Core DK:4.6	0.3350
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

32-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L2-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2180
PP	2116 RC58% DK:4.45	0.1300	0.2180
L4-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2180
PP	2116 RC58% DK:4.45	0.1300	0.2180
L6-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

33-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2640
PP	7628 RC46% DK:4.74	0.1960	0.2640
L2-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L3-CU	Inner Copper 2OZ	0.0700
PP	3313 RC58% DK:4.45	0.1030	0.2290
PP	7628 RC46% DK:4.74	0.1960	0.2290
L4-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2290
PP	3313 RC58% DK:4.45	0.1030	0.2290
L6-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L7-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2640
PP	3313 RC58% DK:4.45	0.1030	0.2640
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.44mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

34-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2500
PP	7628 RC46% DK:4.74	0.1960	0.2500
L2-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L3-CU	Inner Copper 2OZ	0.0700
PP	3313 RC58% DK:4.45	0.1030	0.2010
PP	7628 RC46% DK:4.74	0.1960	0.2010
L4-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2010
PP	3313 RC58% DK:4.45	0.1030	0.2010
L6-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L7-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2500
PP	3313 RC58% DK:4.45	0.1030	0.2500
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.26mm, tolerance: ±10%

Finished PCB Thickness: 2.36mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

35-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2885
PP	7628 RC46% DK:4.74	0.1960	0.2885
L2-CU	Inner Copper 3OZ	0.1050	0.313 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 3OZ	0.1050
PP	3313 RC58% DK:4.45	0.1030	0.2780
PP	7628 RC46% DK:4.74	0.1960	0.2780
L4-CU	Inner Copper 3OZ	0.1050	0.313 (Core with Cu)
CORE	Core DK:4.6	0.1030
L5-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.2780
PP	3313 RC58% DK:4.45	0.1030	0.2780
L6-CU	Inner Copper 3OZ	0.1050	0.313 (Core with Cu)
CORE	Core DK:4.6	0.1030
L7-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.2885
PP	3313 RC58% DK:4.45	0.1030	0.2885
L8-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

36-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2885
PP	7628 RC46% DK:4.74	0.1960	0.2885
L2-CU	Inner Copper 3OZ	0.1050	0.34 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 3OZ	0.1050
PP	3313 RC58% DK:4.45	0.1030	0.2780
PP	7628 RC46% DK:4.74	0.1960	0.2780
L4-CU	Inner Copper 3OZ	0.1050	0.34 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.2780
PP	3313 RC58% DK:4.45	0.1030	0.2780
L6-CU	Inner Copper 3OZ	0.1050	0.34 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.2885
PP	3313 RC58% DK:4.45	0.1030	0.2885
L8-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

37-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2225
PP	2116 RC58% DK:4.45	0.1300	0.2225
L2-CU	Inner Copper 3OZ	0.1050	0.416 (Core with Cu)
CORE	Core DK:4.6	0.2060
L3-CU	Inner Copper 3OZ	0.1050
PP	3313 RC58% DK:4.45	0.1030	0.2120
PP	2116 RC58% DK:4.45	0.1300	0.2120
L4-CU	Inner Copper 3OZ	0.1050	0.416 (Core with Cu)
CORE	Core DK:4.6	0.2060
L5-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2120
PP	3313 RC58% DK:4.45	0.1030	0.2120
L6-CU	Inner Copper 3OZ	0.1050	0.416 (Core with Cu)
CORE	Core DK:4.6	0.2060
L7-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2225
PP	3313 RC58% DK:4.45	0.1030	0.2225
L8-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

38-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2190
PP	2116 RC58% DK:4.45	0.1300	0.2190
L2-CU	Inner Copper 4OZ	0.1400	0.383 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2320
PP	2116 RC58% DK:4.45	0.1300	0.2320
L4-CU	Inner Copper 4OZ	0.1400	0.383 (Core with Cu)
CORE	Core DK:4.6	0.1030
L5-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2320
PP	2116 RC58% DK:4.45	0.1300	0.2320
L6-CU	Inner Copper 4OZ	0.1400	0.383 (Core with Cu)
CORE	Core DK:4.6	0.1030
L7-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2190
PP	3313 RC58% DK:4.45	0.1030	0.2190
L8-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

39-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2630
PP	7628 RC46% DK:4.74	0.1960	0.2630
L2-CU	Inner Copper 4OZ	0.1400	0.36 (Core with Cu)
CORE	Core DK:4.6	0.0800
L3-CU	Inner Copper 4OZ	0.1400
PP	1080 RC68% DK:4.21	0.0810	0.2490
PP	7628 RC46% DK:4.74	0.1960	0.2490
L4-CU	Inner Copper 4OZ	0.1400	0.36 (Core with Cu)
CORE	Core DK:4.6	0.0800
L5-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2490
PP	1080 RC68% DK:4.21	0.0810	0.2490
L6-CU	Inner Copper 4OZ	0.1400	0.36 (Core with Cu)
CORE	Core DK:4.6	0.0800
L7-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2630
PP	1080 RC68% DK:4.21	0.0810	0.2630
L8-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.35mm, tolerance: ±10%

Finished PCB Thickness: 2.45mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

40-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1665
PP	3313 RC58% DK:4.45	0.1030	0.1665
L2-CU	Inner Copper 5OZ	0.1750	0.453 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 5OZ	0.1750
PP	1080 RC68% DK:4.21	0.0810	0.1490
PP	3313 RC58% DK:4.45	0.1030	0.1490
L4-CU	Inner Copper 5OZ	0.1750	0.453 (Core with Cu)
CORE	Core DK:4.6	0.1030
L5-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.1490
PP	1080 RC68% DK:4.21	0.0810	0.1490
L6-CU	Inner Copper 5OZ	0.1750	0.453 (Core with Cu)
CORE	Core DK:4.6	0.1030
L7-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.1665
PP	1080 RC68% DK:4.21	0.0810	0.1665
L8-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

41-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner-layer copper remaining:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1665
PP	3313 RC58% DK:4.45	0.1030	0.1665
L2-CU	Inner Copper 5OZ	0.1750	0.431 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.1710
PP	3313 RC58% DK:4.45	0.1030	0.1710
L4-CU	Inner Copper 5OZ	0.1750	0.431 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.1710
PP	3313 RC58% DK:4.45	0.1030	0.1710
L6-CU	Inner Copper 5OZ	0.1750	0.431 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.1665
PP	1080 RC68% DK:4.21	0.0810	0.1665
L8-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

42-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2525
PP	7628 RC46% DK:4.74	0.1960	0.2525
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.2280
PP	7628 RC46% DK:4.74	0.1960	0.2280
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	1080 RC68% DK:4.21	0.0810	0.2280
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2525
PP	1080 RC68% DK:4.21	0.0810	0.2525
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

43-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2770
PP	2116 RC58% DK:4.45	0.1300	0.2770
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2770
PP	7628 RC46% DK:4.74	0.1960	0.2770
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

44-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L2-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2285
PP	2116 RC58% DK:4.45	0.1300	0.2285
L4-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2285
PP	2116 RC58% DK:4.45	0.1300	0.2285
L6-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.96mm, tolerance: ±10%

Finished PCB Thickness: 2.06mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

45-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L4-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L6-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

46-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2403
PP	7628 RC46% DK:4.74	0.1960	0.2403
L2-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L3-CU	Inner Copper 1.5OZ	0.0525
PP	1080 RC68% DK:4.21	0.0810	0.2035
PP	7628 RC46% DK:4.74	0.1960	0.2035
L4-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L5-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2035
PP	1080 RC68% DK:4.21	0.0810	0.2035
L6-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L7-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2403
PP	1080 RC68% DK:4.21	0.0810	0.2403
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

47-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2120
PP	2116 RC58% DK:4.45	0.1300	0.2120
L2-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 2OZ	0.0700
PP	3313 RC58% DK:4.45	0.1030	0.1910
PP	2116 RC58% DK:4.45	0.1300	0.1910
L4-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1910
PP	3313 RC58% DK:4.45	0.1030	0.1910
L6-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2120
PP	3313 RC58% DK:4.45	0.1030	0.2120
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.92mm, tolerance: ±10%

Finished PCB Thickness: 2.02mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

48-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L2-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L4-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L6-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

49-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2280
PP	7628 RC46% DK:4.74	0.1960	0.2280
L2-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 2OZ	0.0700
PP	1080 RC68% DK:4.21	0.0810	0.1790
PP	7628 RC46% DK:4.74	0.1960	0.1790
L4-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.1790
PP	1080 RC68% DK:4.21	0.0810	0.1790
L6-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L7-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	1080 RC68% DK:4.21	0.0810	0.2280
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.93mm, tolerance: ±10%

Finished PCB Thickness: 2.03mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

01-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

02-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

03-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

04-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

05-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

06-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L8-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

07-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

08-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L8-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.36mm, tolerance: ±10%

Finished PCB Thickness: 2.46mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

09-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0785
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L8-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0785
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

10-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0705
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0705
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

11-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

12-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

13-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.92mm, tolerance: ±10%

Finished PCB Thickness: 2.02mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

14-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

15-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

16-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

17-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

18-Layer PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:0.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0758
L2-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L3-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0705
L4-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L5-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0705
L6-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L7-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0705
L8-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L9-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0758
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.92mm, tolerance: ±10%

Finished PCB Thickness: 1.02mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

19-Layer PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:0.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0723
L2-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L3-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0635
L4-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L5-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0635
L6-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L7-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0635
L8-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L9-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0723
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.89mm, tolerance: ±10%

Finished PCB Thickness: 0.99mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

20-Layer PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:0.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0688
L2-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L3-CU	Inner Copper 0.5OZ	0.0175
PP	3313 RC58% DK:4.45	0.1030	0.0785
L4-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L5-CU	Inner Copper 0.5OZ	0.0175
PP	3313 RC58% DK:4.45	0.1030	0.0785
L6-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L7-CU	Inner Copper 0.5OZ	0.0175
PP	3313 RC58% DK:4.45	0.1030	0.0785
L8-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L9-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0688
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.93mm, tolerance: ±10%

Finished PCB Thickness: 1.03mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

21-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.2613
PP	1080 RC68% DK:4.21	0.0810	0.2613
L2-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2455
PP	1080 RC68% DK:4.21	0.0810	0.2455
L4-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2455
PP	1080 RC68% DK:4.21	0.0810	0.2455
L6-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2455
PP	1080 RC68% DK:4.21	0.0810	0.2455
L8-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2613
PP	1080 RC68% DK:4.21	0.0810	0.2613
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

22-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.2728
PP	3313 RC58% DK:4.45	0.1030	0.2728
L2-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2465
PP	3313 RC58% DK:4.45	0.1030	0.2465
L4-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2465
PP	3313 RC58% DK:4.45	0.1030	0.2465
L6-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2465
PP	3313 RC58% DK:4.45	0.1030	0.2465
L8-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2728
PP	3313 RC58% DK:4.45	0.1030	0.2728
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

23-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3553
PP	7628 RC46% DK:4.74	0.1960	0.3553
L2-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L4-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L6-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L8-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.3553
PP	7628 RC46% DK:4.74	0.1960	0.3553
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

24-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.2560
PP	1080 RC68% DK:4.21	0.0810	0.2560
L2-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2350
PP	1080 RC68% DK:4.21	0.0810	0.2350
L4-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2350
PP	1080 RC68% DK:4.21	0.0810	0.2350
L6-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L7-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2350
PP	1080 RC68% DK:4.21	0.0810	0.2350
L8-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L9-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2560
PP	1080 RC68% DK:4.21	0.0810	0.2560
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

25-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.2640
PP	3313 RC58% DK:4.45	0.1030	0.2640
L2-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2290
PP	3313 RC58% DK:4.45	0.1030	0.2290
L4-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2290
PP	3313 RC58% DK:4.45	0.1030	0.2290
L6-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L7-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2290
PP	3313 RC58% DK:4.45	0.1030	0.2290
L8-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L9-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2640
PP	3313 RC58% DK:4.45	0.1030	0.2640
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

26-Layer PCBStandard

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.2770
PP	2116 RC58% DK:4.45	0.1300	0.2770
L2-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	2116 RC58% DK:4.45	0.1300	0.2280
L4-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	2116 RC58% DK:4.45	0.1300	0.2280
L6-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L7-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	2116 RC58% DK:4.45	0.1300	0.2280
L8-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L9-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2770
PP	2116 RC58% DK:4.45	0.1300	0.2770
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

27-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.1903
PP	3313 RC58% DK:4.45	0.1030	0.1903
L2-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L3-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.1745
PP	3313 RC58% DK:4.45	0.1030	0.1745
L4-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L5-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.1745
PP	3313 RC58% DK:4.45	0.1030	0.1745
L6-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L7-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.1745
PP	3313 RC58% DK:4.45	0.1030	0.1745
L8-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L9-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.1903
PP	3313 RC58% DK:4.45	0.1030	0.1903
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.85mm, tolerance: ±10%

Finished PCB Thickness: 1.95mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

28-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2068
PP	3313 RC58% DK:4.45	0.1030	0.2068
L2-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1805
PP	3313 RC58% DK:4.45	0.1030	0.1805
L4-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1805
PP	3313 RC58% DK:4.45	0.1030	0.1805
L6-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1805
PP	3313 RC58% DK:4.45	0.1030	0.1805
L8-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L9-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2068
PP	3313 RC58% DK:4.45	0.1030	0.2068
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

29-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L2-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L4-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L6-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L8-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L9-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.95mm, tolerance: ±10%

Finished PCB Thickness: 2.05mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

30-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	1080 RC68% DK:4.21	0.0810	0.1900
L2-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1690
PP	1080 RC68% DK:4.21	0.0810	0.1690
L4-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1690
PP	1080 RC68% DK:4.21	0.0810	0.1690
L6-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1690
PP	1080 RC68% DK:4.21	0.0810	0.1690
L8-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L9-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	1080 RC68% DK:4.21	0.0810	0.1900
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.88mm, tolerance: ±10%

Finished PCB Thickness: 1.98mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

31-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.1710
PP	3313 RC58% DK:4.45	0.1030	0.1710
L2-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L4-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L6-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L8-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L9-CU	Inner Copper 2OZ	0.0700
PP	3313 RC58% DK:4.45	0.1030	0.1710
PP	3313 RC58% DK:4.45	0.1030	0.1710
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

32-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L2-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1620
PP	2116 RC58% DK:4.45	0.1300	0.1620
L4-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1620
PP	2116 RC58% DK:4.45	0.1300	0.1620
L6-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1620
PP	2116 RC58% DK:4.45	0.1300	0.1620
L8-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L9-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

33-Layer PCBStandard

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.13mm, tolerance: ±10%

Finished PCB Thickness: 1.23mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

01-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

02-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

03-Layer PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0785
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0785
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

04-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L11-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.44mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

05-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L10-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L11-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

06-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L10-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

07-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.92mm, tolerance: ±10%

Finished PCB Thickness: 2.02mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

08-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

09-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.14mm, tolerance: ±10%

Finished PCB Thickness: 1.24mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

10-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0635
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0635
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

11-Layer PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0785
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0785
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.08mm, tolerance: ±10%

Finished PCB Thickness: 1.18mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

12-Layer PCBStandard

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0785
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.1840
PP	2116 RC58% DK:4.45	0.1300	0.1840
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.1840
PP	2116 RC58% DK:4.45	0.1300	0.1840
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1840
PP	3313 RC58% DK:4.45	0.1030	0.1840
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1840
PP	3313 RC58% DK:4.45	0.1030	0.1840
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0785
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.93mm, tolerance: ±10%

Finished PCB Thickness: 2.03mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

01-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L12-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.26mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

02-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1935
PP	2116 RC58% DK:4.45	0.1300	0.1935
L2-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L10-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L12-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1935
PP	1080 RC68% DK:4.21	0.0810	0.1935
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

03-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2085
PP	2116 RC58% DK:4.45	0.1300	0.2085
L2-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L4-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L6-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L8-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L10-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L12-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2085
PP	3313 RC58% DK:4.45	0.1030	0.2085
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

04-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.97mm, tolerance: ±10%

Finished PCB Thickness: 2.07mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

05-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

06-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.85mm, tolerance: ±10%

Finished PCB Thickness: 1.95mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

01-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L14-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L16-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

02-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1760
PP	1080 RC68% DK:4.21	0.0810	0.1760
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1760
PP	2116 RC58% DK:4.45	0.1300	0.1760
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L14-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L16-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.39mm, tolerance: ±10%

Finished PCB Thickness: 2.49mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

03-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L14-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L16-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

04-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L12-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L14-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L16-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

05-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1760
PP	1080 RC68% DK:4.21	0.0810	0.1760
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1760
PP	2116 RC58% DK:4.45	0.1300	0.1760
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L12-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L14-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L16-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

06-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1375
PP	1080 RC68% DK:4.21	0.0810	0.1375
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L12-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L13-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L14-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L15-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1375
PP	1080 RC68% DK:4.21	0.0810	0.1375
L16-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.93mm, tolerance: ±10%

Finished PCB Thickness: 2.03mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

01-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L12-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L14-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L16-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L17-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L18-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

02-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1935
PP	2116 RC58% DK:4.45	0.1300	0.1935
L2-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L10-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L12-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L14-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L16-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L17-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1935
PP	1080 RC68% DK:4.21	0.0810	0.1935
L18-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

03-Layer PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1375
PP	1080 RC68% DK:4.21	0.0810	0.1375
L2-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L4-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L6-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L8-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L9-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L10-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L11-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L12-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L13-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L14-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L15-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L16-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L17-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1375
PP	1080 RC68% DK:4.21	0.0810	0.1375
L18-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

04-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L12-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L13-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L14-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L15-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L16-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L17-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L18-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

05-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:0.5OZ

Inner-layer copper remaining:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1213
L2-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1125
L4-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1125
L6-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1125
L8-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1125
L10-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1125
L12-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L13-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1125
L14-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L15-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1125
L16-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L17-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1213
L18-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

06-Layer PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner-layer copper remaining:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L12-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L14-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L16-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L17-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L18-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

Catalog Boundaries and Engineering Review

These tables are production references for rigid through-hole multilayer stackups. HDI builds with blind/buried vias, via-in-pad, stacked microvias or sequential lamination need separate recipes because drill structure, copper plating and press cycles change the reliability model.

Each catalog entry states a ±10% finished-thickness tolerance. IPC-2221 provides generic printed-board design guidance, while IPC-6012 defines qualification and performance requirements for rigid printed boards; the required performance class and any deviations must be stated in the procurement documentation.

For controlled impedance, the governing inputs are the approved stackup drawing, single-ended and differential targets, allowed tolerance, reference layers, trace geometry, material data and coupon or report requirements. Final values remain subject to project-specific engineering confirmation before lamination.

RFQ Checklist for Custom Stackup Release

Send Gerber X2 or ODB++, drill/rout files, fabrication drawing, layer order, target finished thickness, copper weight by layer, surface finish, material requirements, impedance targets, BGA pitch, controlled-depth or backdrill needs, and any flatness or reliability limits.

For impedance-control jobs, include target single-ended/differential values, reference layers, trace geometry assumptions, allowed tolerance, coupon requirement and test-report expectation. APTPCB confirms the material and dielectric stack before production release.

For flex or rigid-flex stackups, use the dedicated flex/rigid-flex workflow instead of this rigid catalog. Bend radius, PI thickness, adhesive, coverlay and stiffener details must be reviewed separately.

Frequently Asked Questions

Answers to the questions we hear most from hardware teams.

What is a multilayer PCB stackup?

A multilayer PCB stackup is the ordered structure of copper layers, prepreg, core materials and dielectric spacing that defines board thickness, impedance behavior, reference planes, power distribution and manufacturability.

When can I use a standard catalog stackup?

Use a catalog stackup when the layer count, finished thickness, copper weights, drill requirements and impedance needs fit the listed structure without special materials, blind/buried vias or unusual flatness limits.

What files are needed for stackup review?

Send Gerber or ODB++, drill files, layer order, target thickness, copper weights, impedance targets, material requirements, BGA pitch, via structure and any flatness, thermal or reliability constraints.

How are core and prepreg different?

Core is a cured laminate with copper and relatively stable thickness. Prepreg is semi-cured resin/glass material that bonds cores together and compresses during lamination depending on resin flow and copper distribution.

Do you support impedance-controlled stackups?

Yes. Provide impedance values, reference layers, trace geometry assumptions and coupon requirements. APTPCB reviews dielectric height, copper thickness and material selection before releasing the lamination recipe.

Are HDI or rigid-flex stackups covered by this catalog?

No. HDI, blind/buried via, sequential lamination, via-in-pad and rigid-flex stackups need custom engineering review because the via structure, press cycle and reliability rules differ from standard rigid through-hole stackups.

Multi-Layer PCB Stackup

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Stackup Reference for 4-18 Layer Rigid PCBs

Standard Stackup Filters and What They Decide

Core, Prepreg and Copper Balance Basics

Stackup Selection and Release Gate Matrix

Multi-Layer PCB Stackup Configurations

4 Layer PCB Stackup

6 Layer PCB Stackup

8 Layer PCB Stackup

10 Layer PCB Stackup

12 Layer PCB Stackup

14 Layer PCB Stackup

16 Layer PCB Stackup

18 Layer PCB Stackup

Catalog Boundaries and Engineering Review

RFQ Checklist for Custom Stackup Release

Frequently Asked Questions

Multi-Layer PCB Stackup

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