4-18 Layer Laminated Structure

Multi-Layer PCB Stackup

Comprehensive stackup configurations for multilayer PCBs, including material specifications, layer constructions, and impedance control guidelines for 4 to 18 layer boards.

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298+Stackup Configurations

4-18Layer Options

±10%Thickness Tolerance

Stackup Reference for 4-18 Layer Rigid PCBs

Stackup for 4, 6, 8, ... 18 layer multi-layer laminated structures combines 298+ validated templates that originated from the static stackup catalog. Each template preserves the layer order, copper weights, and dielectric selections used in production so hardware teams can move from prototyping to volume without requalifying materials.

Customization Flow: If you need a bespoke stackup or tightened impedance control, submit your Gerber/ODB++ package and we will manufacture according to those electrical requirements. After you place an order we confirm the lamination recipe, materials, and impedance calculations with you before releasing the job to the shop floor.

For rigid PCB programs we keep expanding the database (currently 298 structures and counting) to cover more dielectric heights and copper balances. For flexible PCB stackups, request a tailored quote or connect with engineering using the actions below:

Request Flexible Stackup Quote Chat with a Process Engineer

Standard Stackup Filters

Use the same filter logic from the static page to quickly navigate the catalog: select layer count, finished thickness, inner/outer copper weights, and inner-layer residual copper ratio to surface the matching laminate structures.

Layers: 4, 6, 8, 10, 12, 14, 16, and 18 layer constructions.
Thickness (mm): 0.4 / 0.6 / 0.8 / 1.0 / 1.2 / 1.6 / 2.0 / 2.4.
Inner Copper (oz): 0.5-5 oz options including 0.5, 1, 1.5, 2, 3, 4, 5 oz.
Outer Copper (oz): 1-5 oz finished copper.
Inner Layer Residual Copper Ratio: 30%, 50%, 70%, and 90% presets to align with your design's copper balance.

Friendly reminder: these references focus on through-hole stackups. Blind/buried via HDI builds or mixed constructions should be quoted as custom so we can tune the lamination and drill stack specifically for that job.

Fundamentals

Understanding PCB Layer Structure

In the layer structure of a PCB board, there are several important concepts:

PP (Prepreg): Prepreg is a semi-cured sheet impregnated with resin. It bonds multilayer conductive patterns and serves as insulation once cured under heat and pressure. Common prepreg types: 1080 (3.1mil), 3313 (4.2mil), 2116 (5.4mil), 7628 (7.7mil).

Core: Core is a rigid dielectric with copper on both sides. Together with prepreg it defines the lamination stack for multilayer boards.

Key Differences:

Prepreg is semi-solid while core is rigid.
Prepreg acts as adhesive and insulator; core is the structural substrate.
Prepreg can flex slightly; core cannot bend.
Prepreg is non-conductive; core carries copper on each face.

Technical Specifications

Multi-Layer Stackup Configurations

Standard stackup structures for various layer counts with detailed material and thickness specifications.

014-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	1.1 (Core with Cu)
CORE	Core DK:4.6	1.0300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.51mm, tolerance: ±10%

Finished PCB Thickness: 1.61mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

024-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	1.1 (Core with Cu)
CORE	Core DK:4.6	1.0300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

034-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	1.1 (Core with Cu)
CORE	Core DK:4.6	1.0300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

044-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	1.0 (Core with Cu)
CORE	Core DK:4.6	0.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

054-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	1.0 (Core with Cu)
CORE	Core DK:4.6	0.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

064-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	1.0 (Core with Cu)
CORE	Core DK:4.6	0.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

074-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1803
L2-CU	Inner Copper 1.5OZ	0.0525	1.0 (Core with Cu)
CORE	Core DK:4.6	0.8950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.1803
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.47mm, tolerance: ±10%

Finished PCB Thickness: 1.57mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

084-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	2.0 (Core with Cu)
CORE	Core DK:4.6	1.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

094-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	1.94 (Core with Cu)
CORE	Core DK:4.6	1.8700
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

104-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	1.94 (Core with Cu)
CORE	Core DK:4.6	1.8700
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

114-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	1.6 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

124-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	1.6 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.86mm, tolerance: ±10%

Finished PCB Thickness: 1.96mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

134-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	1.5 (Core with Cu)
CORE	Core DK:4.6	1.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.88mm, tolerance: ±10%

Finished PCB Thickness: 1.98mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

144-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	1.6 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

154-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	1.6 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.93mm, tolerance: ±10%

Finished PCB Thickness: 2.03mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

164-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	1.5 (Core with Cu)
CORE	Core DK:4.6	1.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.95mm, tolerance: ±10%

Finished PCB Thickness: 2.05mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

174-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.7 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

184-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.7 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

194-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.7 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.08mm, tolerance: ±10%

Finished PCB Thickness: 1.18mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

204-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.14mm, tolerance: ±10%

Finished PCB Thickness: 1.24mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

214-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.7 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.16mm, tolerance: ±10%

Finished PCB Thickness: 1.26mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

224-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.7 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.15mm, tolerance: ±10%

Finished PCB Thickness: 1.25mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

234-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.91mm, tolerance: ±10%

Finished PCB Thickness: 1.01mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

244-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.89mm, tolerance: ±10%

Finished PCB Thickness: 0.99mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

254-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.88mm, tolerance: ±10%

Finished PCB Thickness: 0.98mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

264-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.89mm, tolerance: ±10%

Finished PCB Thickness: 0.99mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

274-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.93mm, tolerance: ±10%

Finished PCB Thickness: 1.03mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

284-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.92mm, tolerance: ±10%

Finished PCB Thickness: 1.02mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

294-layers PCBRegular

Thickness:0.8MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.71mm, tolerance: ±10%

Finished PCB Thickness: 0.81mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

304-layers PCBRegular

Thickness:0.8MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.69mm, tolerance: ±10%

Finished PCB Thickness: 0.79mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

314-layers PCBRegular

Thickness:0.8MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.68mm, tolerance: ±10%

Finished PCB Thickness: 0.78mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

324-layers PCBRegular

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)

Thickness after lamination: 0.71mm, tolerance: ±10%

Finished PCB Thickness: 0.81mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

334-layers PCBRegular

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)

Thickness after lamination: 0.69mm, tolerance: ±10%

Finished PCB Thickness: 0.79mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

344-layers PCBRegular

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 2OZ)

Thickness after lamination: 0.68mm, tolerance: ±10%

Finished PCB Thickness: 0.78mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

354-layers PCBRegular

Thickness:0.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.52mm, tolerance: ±10%

Finished PCB Thickness: 0.62mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

364-layers PCBRegular

Thickness:0.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.51mm, tolerance: ±10%

Finished PCB Thickness: 0.61mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

374-layers PCBRegular

Thickness:0.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.49mm, tolerance: ±10%

Finished PCB Thickness: 0.59mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

384-layers PCBRegular

Thickness:0.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.53mm, tolerance: ±10%

Finished PCB Thickness: 0.63mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

394-layers PCBRegular

Thickness:0.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.52mm, tolerance: ±10%

Finished PCB Thickness: 0.62mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

404-layers PCBRegular

Thickness:0.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0705
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0705
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.31mm, tolerance: ±10%

Finished PCB Thickness: 0.41mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

414-layers PCBRegular

Thickness:0.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0635
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0635
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.3mm, tolerance: ±10%

Finished PCB Thickness: 0.40mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

424-layers PCBRegular

Thickness:0.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0565
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0565
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.28mm, tolerance: ±10%

Finished PCB Thickness: 0.38mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

434-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0265	0.0265 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	2.0 (Core with Cu)
CORE	Core DK:4.6	1.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L4-CU	Outer Base Copper 1.5OZ	0.0265	0.0265 (Plating to 2OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

444-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.9 (Core with Cu)
CORE	Core DK:4.6	0.7950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.47mm, tolerance: ±10%

Finished PCB Thickness: 1.57mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

454-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2403
PP	7628 RC46% DK:4.74	0.1960	0.2403
L2-CU	Inner Copper 1.5OZ	0.0525	0.9 (Core with Cu)
CORE	Core DK:4.6	0.7950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2403
PP	1080 RC68% DK:4.21	0.0810	0.2403
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

464-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3050
PP	7628 RC46% DK:4.74	0.1960	0.3050
L2-CU	Inner Copper 2OZ	0.0700	0.77 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.3050
PP	2116 RC58% DK:4.45	0.1300	0.3050
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

474-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2910
PP	7628 RC46% DK:4.74	0.1960	0.2910
L2-CU	Inner Copper 2OZ	0.0700	0.77 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2910
PP	2116 RC58% DK:4.45	0.1300	0.2910
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

484-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3430
PP	7628 RC46% DK:4.74	0.1960	0.3430
L2-CU	Inner Copper 2OZ	0.0700	0.77 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.3430
PP	7628 RC46% DK:4.74	0.1960	0.3430
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.56mm, tolerance: ±10%

Finished PCB Thickness: 1.66mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

494-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L2-CU	Inner Copper 3OZ	0.1050	0.8 (Core with Cu)
CORE	Core DK:4.6	0.5900
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.47mm, tolerance: ±10%

Finished PCB Thickness: 1.57mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

504-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3815
PP	7628 RC46% DK:4.74	0.1960	0.3815
L2-CU	Inner Copper 3OZ	0.1050	0.55 (Core with Cu)
CORE	Core DK:4.6	0.3400
L3-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.3815
PP	7628 RC46% DK:4.74	0.1960	0.3815
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

514-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3155
PP	7628 RC46% DK:4.74	0.1960	0.3155
L2-CU	Inner Copper 3OZ	0.1050	0.68 (Core with Cu)
CORE	Core DK:4.6	0.4700
L3-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.3155
PP	2116 RC58% DK:4.45	0.1300	0.3155
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

524-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3780
PP	7628 RC46% DK:4.74	0.1960	0.3780
L2-CU	Inner Copper 4OZ	0.1400	0.51 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.3780
PP	7628 RC46% DK:4.74	0.1960	0.3780
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 1.51mm, tolerance: ±10%

Finished PCB Thickness: 1.61mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

534-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2190
PP	2116 RC58% DK:4.45	0.1300	0.2190
L2-CU	Inner Copper 4OZ	0.1400	0.80 (Core with Cu)
CORE	Core DK:4.6	0.5200
L3-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2190
PP	3313 RC58% DK:4.45	0.1030	0.2190
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

544-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3120
PP	7628 RC46% DK:4.74	0.1960	0.3120
L2-CU	Inner Copper 4OZ	0.1400	0.60 (Core with Cu)
CORE	Core DK:4.6	0.3200
L3-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.3120
PP	2116 RC58% DK:4.45	0.1300	0.3120
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 1.47mm, tolerance: ±10%

Finished PCB Thickness: 1.57mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

554-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1070	0.2855
PP	7628 RC46% DK:4.74	0.1960	0.2855
L2-CU	Inner Copper 5OZ	0.1750	0.67 (Core with Cu)
CORE	Core DK:4.6	0.3200
L3-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2855
PP	3313 RC58% DK:4.45	0.1070	0.2855
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

564-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1070	0.2265
PP	2116 RC58% DK:4.45	0.1370	0.2265
L2-CU	Inner Copper 5OZ	0.1750	0.80 (Core with Cu)
CORE	Core DK:4.6	0.4500
L3-CU	Inner Copper 5OZ	0.1750
PP	2116 RC58% DK:4.45	0.1370	0.2265
PP	3313 RC58% DK:4.45	0.1070	0.2265
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 1.5mm, tolerance: ±10%

Finished PCB Thickness: 1.60mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

574-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1070	0.2855
PP	7628 RC46% DK:4.74	0.1960	0.2855
L2-CU	Inner Copper 5OZ	0.1750	0.67 (Core with Cu)
CORE	Core DK:4.6	0.3200
L3-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2855
PP	3313 RC58% DK:4.45	0.1070	0.2855
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

584-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2885
PP	7628 RC46% DK:4.74	0.1960	0.2885
L2-CU	Inner Copper 1OZ	0.0350	1.6 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2885
PP	3313 RC58% DK:4.45	0.1030	0.2885
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

594-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3085
PP	7628 RC46% DK:4.74	0.1960	0.3085
L2-CU	Inner Copper 1OZ	0.0350	1.6 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.3085
PP	2116 RC58% DK:4.45	0.1300	0.3085
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

604-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3015
PP	7628 RC46% DK:4.74	0.1960	0.3015
L2-CU	Inner Copper 1OZ	0.0350	1.6 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.3015
PP	2116 RC58% DK:4.45	0.1300	0.3015
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

614-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3763
PP	7628 RC46% DK:4.74	0.1960	0.3763
L2-CU	Inner Copper 1.5OZ	0.0525	1.5 (Core with Cu)
CORE	Core DK:4.6	1.3950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.3763
PP	7628 RC46% DK:4.74	0.1960	0.3763
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.36mm, tolerance: ±10%

Finished PCB Thickness: 2.46mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

624-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3658
PP	7628 RC46% DK:4.74	0.1960	0.3658
L2-CU	Inner Copper 1.5OZ	0.0525	1.5 (Core with Cu)
CORE	Core DK:4.6	1.3950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.3658
PP	7628 RC46% DK:4.74	0.1960	0.3658
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.44mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

634-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2893
PP	7628 RC46% DK:4.74	0.1960	0.2893
L2-CU	Inner Copper 1.5OZ	0.0525	1.64 (Core with Cu)
CORE	Core DK:4.6	1.5350
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2893
PP	2116 RC58% DK:4.45	0.1300	0.2893
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

644-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.3370
PP	1080 RC68% DK:4.21	0.0810
PP	7628 RC46% DK:4.74	0.1960
L2-CU	Inner Copper 2OZ	0.0700	1.54 (Core with Cu)
CORE	Core DK:4.6	1.4000
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.3370
PP	1080 RC68% DK:4.21	0.0810
PP	1080 RC68% DK:4.21	0.0810
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

654-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2640
PP	7628 RC46% DK:4.74	0.1960	0.2640
L2-CU	Inner Copper 2OZ	0.0700	1.67 (Core with Cu)
CORE	Core DK:4.6	1.5300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2640
PP	3313 RC58% DK:4.45	0.1030	0.2640
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

664-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.3090
PP	1080 RC68% DK:4.21	0.0810
PP	7628 RC46% DK:4.74	0.1960
L2-CU	Inner Copper 2OZ	0.0700	1.57 (Core with Cu)
CORE	Core DK:4.6	1.4300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.3090
PP	1080 RC68% DK:4.21	0.0810
PP	1080 RC68% DK:4.21	0.0810
L4-CU	Outer Base Copper 1.5OZ	0.0520	0.0520 (Plating to 2OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

674-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2665
PP	7628 RC46% DK:4.74	0.1960	0.2665
L2-CU	Inner Copper 3OZ	0.1050	1.6 (Core with Cu)
CORE	Core DK:4.6	1.3900
L3-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.2665
PP	1080 RC68% DK:4.21	0.0810	0.2665
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

684-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2005
PP	2116 RC58% DK:4.45	0.1300	0.2005
L2-CU	Inner Copper 3OZ	0.1050	1.73 (Core with Cu)
CORE	Core DK:4.6	1.5200
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2005
PP	1080 RC68% DK:4.21	0.0810	0.2005
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

694-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2850
PP	7628 RC46% DK:4.74	0.1960	0.2850
L2-CU	Inner Copper 4OZ	0.1400	1.5 (Core with Cu)
CORE	Core DK:4.6	1.2200
L3-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2850
PP	3313 RC58% DK:4.45	0.1030	0.2850
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

704-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2630
PP	7628 RC46% DK:4.74	0.1960	0.2630
L2-CU	Inner Copper 4OZ	0.1400	1.54 (Core with Cu)
CORE	Core DK:4.6	1.2600
L3-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2630
PP	1080 RC68% DK:4.21	0.0810	0.2630
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

714-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2595
PP	7628 RC46% DK:4.74	0.1960	0.2595
L2-CU	Inner Copper 5OZ	0.1750	1.54 (Core with Cu)
CORE	Core DK:4.6	1.1900
L3-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2595
PP	1080 RC68% DK:4.21	0.0810	0.2595
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

724-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2595
PP	7628 RC46% DK:4.74	0.1960	0.2595
L2-CU	Inner Copper 5OZ	0.1750	1.54 (Core with Cu)
CORE	Core DK:4.6	1.1900
L3-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2595
PP	1080 RC68% DK:4.21	0.0810	0.2595
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

734-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3763
PP	7628 RC46% DK:4.74	0.1960	0.3763
L2-CU	Inner Copper 1.5OZ	0.0525	1.1 (Core with Cu)
CORE	Core DK:4.6	0.9950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.3763
PP	7628 RC46% DK:4.74	0.1960	0.3763
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.96mm, tolerance: ±10%

Finished PCB Thickness: 2.06mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

744-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3658
PP	7628 RC46% DK:4.74	0.1960	0.3658
L2-CU	Inner Copper 1.5OZ	0.0525	1.1 (Core with Cu)
CORE	Core DK:4.6	0.9950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.3658
PP	7628 RC46% DK:4.74	0.1960	0.3658
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

754-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3553
PP	7628 RC46% DK:4.74	0.1960	0.3553
L2-CU	Inner Copper 1.5OZ	0.0525	1.1 (Core with Cu)
CORE	Core DK:4.6	0.9950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.3553
PP	7628 RC46% DK:4.74	0.1960	0.3553
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.92mm, tolerance: ±10%

Finished PCB Thickness: 2.02mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

764-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3050
PP	7628 RC46% DK:4.74	0.1960	0.3050
L2-CU	Inner Copper 2OZ	0.0700	1.17 (Core with Cu)
CORE	Core DK:4.6	1.0300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.3050
PP	2116 RC58% DK:4.45	0.1300	0.3050
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

774-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2910
PP	7628 RC46% DK:4.74	0.1960	0.2910
L2-CU	Inner Copper 2OZ	0.0700	1.17 (Core with Cu)
CORE	Core DK:4.6	1.0300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2910
PP	2116 RC58% DK:4.45	0.1300	0.2910
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.86mm, tolerance: ±10%

Finished PCB Thickness: 1.96mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

784-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3430
PP	7628 RC46% DK:4.74	0.1960	0.3430
L2-CU	Inner Copper 2OZ	0.0700	1.17 (Core with Cu)
CORE	Core DK:4.6	1.0300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.3430
PP	7628 RC46% DK:4.74	0.1960	0.3430
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.96mm, tolerance: ±10%

Finished PCB Thickness: 2.06mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

794-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2665
PP	7628 RC46% DK:4.74	0.1960	0.2665
L2-CU	Inner Copper 3OZ	0.1050	1.20 (Core with Cu)
CORE	Core DK:4.6	0.9900
L3-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.2665
PP	1080 RC68% DK:4.21	0.0810	0.2665
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.91mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

804-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3155
PP	7628 RC46% DK:4.74	0.1960	0.3155
L2-CU	Inner Copper 3OZ	0.1050	1.07 (Core with Cu)
CORE	Core DK:4.6	0.8600
L3-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.3155
PP	2116 RC58% DK:4.45	0.1300	0.3155
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.88mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

814-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2850
PP	7628 RC46% DK:4.74	0.1960	0.2850
L2-CU	Inner Copper 4OZ	0.1400	1.06 (Core with Cu)
CORE	Core DK:4.6	0.7800
L3-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2850
PP	3313 RC58% DK:4.45	0.1030	0.2850
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 1.88mm, tolerance: ±10%

Finished PCB Thickness: 1.98mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

824-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2190
PP	2116 RC58% DK:4.45	0.1300	0.2190
L2-CU	Inner Copper 4OZ	0.1400	1.2 (Core with Cu)
CORE	Core DK:4.6	0.9200
L3-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2190
PP	3313 RC58% DK:4.45	0.1030	0.2190
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 1.88mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

834-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2595
PP	7628 RC46% DK:4.74	0.1960	0.2595
L2-CU	Inner Copper 5OZ	0.1750	1.13 (Core with Cu)
CORE	Core DK:4.6	0.7800
L3-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2595
PP	1080 RC68% DK:4.21	0.0810	0.2595
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

844-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3085
PP	7628 RC46% DK:4.74	0.1960	0.3085
L2-CU	Inner Copper 5OZ	0.1750	1.02 (Core with Cu)
CORE	Core DK:4.6	0.6700
L3-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.3085
PP	2116 RC58% DK:4.45	0.1300	0.3085
L4-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 1.88mm, tolerance: ±10%

Finished PCB Thickness: 1.98mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

854-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L2-CU	Inner Copper 1.5OZ	0.0525	0.498 (Core with Cu)
CORE	Core DK:4.6	0.3930
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

864-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.498 (Core with Cu)
CORE	Core DK:4.6	0.3930
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.07mm, tolerance: ±10%

Finished PCB Thickness: 1.17mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

874-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L2-CU	Inner Copper 1.5OZ	0.0525	0.579 (Core with Cu)
CORE	Core DK:4.6	0.4740
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.13mm, tolerance: ±10%

Finished PCB Thickness: 1.23mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

884-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2780
PP	7628 RC46% DK:4.74	0.1960	0.2780
L2-CU	Inner Copper 2OZ	0.0700	0.40 (Core with Cu)
CORE	Core DK:4.6	0.2600
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2780
PP	3313 RC58% DK:4.45	0.1030	0.2780
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.06mm, tolerance: ±10%

Finished PCB Thickness: 1.16mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

894-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2910
PP	7628 RC46% DK:4.74	0.1960	0.2910
L2-CU	Inner Copper 2OZ	0.0700	0.40 (Core with Cu)
CORE	Core DK:4.6	0.2600
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2910
PP	2116 RC58% DK:4.45	0.1300	0.2910
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

904-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2770
PP	7628 RC46% DK:4.74	0.1960	0.2770
L2-CU	Inner Copper 2OZ	0.0700	0.449 (Core with Cu)
CORE	Core DK:4.6	0.3090
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2770
PP	2116 RC58% DK:4.45	0.1300	0.2770
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

914-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L2-CU	Inner Copper 3OZ	0.1050	0.406 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.08mm, tolerance: ±10%

Finished PCB Thickness: 1.18mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

924-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2885
PP	7628 RC46% DK:4.74	0.1960	0.2885
L2-CU	Inner Copper 3OZ	0.1050	0.34 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.2885
PP	3313 RC58% DK:4.45	0.1030	0.2885
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

934-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3155
PP	7628 RC46% DK:4.74	0.1960	0.3155
L2-CU	Inner Copper 3OZ	0.1050	0.291 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.3155
PP	2116 RC58% DK:4.45	0.1300	0.3155
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.1mm, tolerance: ±10%

Finished PCB Thickness: 1.20mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

944-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2850
PP	7628 RC46% DK:4.74	0.1960	0.2850
L2-CU	Inner Copper 4OZ	0.1400	0.361 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2850
PP	3313 RC58% DK:4.45	0.1030	0.2850
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 4OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

954-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 4OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2630
PP	7628 RC46% DK:4.74	0.1960	0.2630
L2-CU	Inner Copper 4OZ	0.1400	0.41 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2630
PP	1080 RC68% DK:4.21	0.0810	0.2630
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 4OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

964-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2190
PP	2116 RC58% DK:4.45	0.1300	0.2190
L2-CU	Inner Copper 4OZ	0.1400	0.476 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2190
PP	3313 RC58% DK:4.45	0.1030	0.2190
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 4OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

974-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1030	0.1885
PP	3313 RC58% DK:4.45	0.1030	0.1885
L2-CU	Inner Copper 5OZ	0.1750	0.546 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.1885
PP	3313 RC58% DK:4.45	0.1030	0.1885
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 5OZ)

Thickness after lamination: 1.1mm, tolerance: ±10%

Finished PCB Thickness: 1.20mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

984-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2155
PP	2116 RC58% DK:4.45	0.1300	0.2155
L2-CU	Inner Copper 5OZ	0.1750	0.48 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 5OZ	0.1750
PP	2116 RC58% DK:4.45	0.1300	0.2155
PP	3313 RC58% DK:4.45	0.1030	0.2155
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 5OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

994-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 5OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2425
PP	2116 RC58% DK:4.45	0.1300	0.2425
L2-CU	Inner Copper 5OZ	0.1750	0.453 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 5OZ	0.1750
PP	2116 RC58% DK:4.45	0.1300	0.2425
PP	2116 RC58% DK:4.45	0.1300	0.2425
L4-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 5OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

1004-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L2-CU	Inner Copper 1.5OZ	0.0525	0.3 (Core with Cu)
CORE	Core DK:4.6	0.1950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.89mm, tolerance: ±10%

Finished PCB Thickness: 1.00mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

1014-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.3 (Core with Cu)
CORE	Core DK:4.6	0.1950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.87mm, tolerance: ±10%

Finished PCB Thickness: 0.97mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

1024-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L2-CU	Inner Copper 1.5OZ	0.0525	0.3 (Core with Cu)
CORE	Core DK:4.6	0.1950
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.85mm, tolerance: ±10%

Finished PCB Thickness: 0.95mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

1034-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L2-CU	Inner Copper 2OZ	0.0700	0.27 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.85mm, tolerance: ±10%

Finished PCB Thickness: 0.95mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

1044-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L2-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.89mm, tolerance: ±10%

Finished PCB Thickness: 0.99mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

1054-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L2-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.86mm, tolerance: ±10%

Finished PCB Thickness: 0.96mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

1064-layers PCBRegular

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2173
PP	2116 RC58% DK:4.45	0.1300	0.2173
L2-CU	Inner Copper 1.5OZ	0.0525	0.185 (Core with Cu)
CORE	Core DK:4.6	0.0800
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2173
PP	3313 RC58% DK:4.45	0.1030	0.2173
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.72mm, tolerance: ±10%

Finished PCB Thickness: 0.82mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

1074-layers PCBRegular

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2068
PP	2116 RC58% DK:4.45	0.1300	0.2068
L2-CU	Inner Copper 1.5OZ	0.0525	0.185 (Core with Cu)
CORE	Core DK:4.6	0.0800
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2068
PP	3313 RC58% DK:4.45	0.1030	0.2068
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.7mm, tolerance: ±10%

Finished PCB Thickness: 0.80mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

1084-layers PCBRegular

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.1963
PP	2116 RC58% DK:4.45	0.1300	0.1963
L2-CU	Inner Copper 1.5OZ	0.0525	0.185 (Core with Cu)
CORE	Core DK:4.6	0.0800
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1963
PP	3313 RC58% DK:4.45	0.1030	0.1963
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.68mm, tolerance: ±10%

Finished PCB Thickness: 0.78mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

1094-layers PCBRegular

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L2-CU	Inner Copper 2OZ	0.0700	0.17 (Core with Cu)
CORE	Core DK:4.6	0.0300
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.75mm, tolerance: ±10%

Finished PCB Thickness: 0.85mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

1104-layers PCBRegular

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L2-CU	Inner Copper 2OZ	0.0700	0.17 (Core with Cu)
CORE	Core DK:4.6	0.0300
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.73mm, tolerance: ±10%

Finished PCB Thickness: 0.83mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

1114-layers PCBRegular

Thickness:0.8MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2280
PP	7628 RC46% DK:4.74	0.1960	0.2280
L2-CU	Inner Copper 2OZ	0.0700	0.17 (Core with Cu)
CORE	Core DK:4.6	0.0300
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	1080 RC68% DK:4.21	0.0810	0.2280
L4-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 0.73mm, tolerance: ±10%

Finished PCB Thickness: 0.83mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

1124-layers PCBRegular

Thickness:0.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1375
PP	1080 RC68% DK:4.21	0.0810	0.1375
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1375
PP	1080 RC68% DK:4.21	0.0810	0.1375
L4-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.51mm, tolerance: ±10%

Finished PCB Thickness: 0.61mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

016-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

026-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

036-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

046-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.56mm, tolerance: ±10%

Finished PCB Thickness: 1.66mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

056-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	1.0 (Core with Cu)
CORE	Core DK:4.6	0.9300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L4-CU	Inner Copper 1OZ	0.0350	1.0 (Core with Cu)
CORE	Core DK:4.6	0.9300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

066-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.35mm, tolerance: ±10%

Finished PCB Thickness: 2.45mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

076-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

086-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L4-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

096-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L4-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

106-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.85mm, tolerance: ±10%

Finished PCB Thickness: 1.95mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

116-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L4-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

126-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

136-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.15mm, tolerance: ±10%

Finished PCB Thickness: 1.25mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

146-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.05mm, tolerance: ±10%

Finished PCB Thickness: 1.15mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

156-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.16mm, tolerance: ±10%

Finished PCB Thickness: 1.26mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

166-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.91mm, tolerance: ±10%

Finished PCB Thickness: 1.01mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

176-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.95mm, tolerance: ±10%

Finished PCB Thickness: 1.05mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

186-layers PCBRegular

Thickness:0.8MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.7mm, tolerance: ±10%

Finished PCB Thickness: 0.80mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

196-layers PCBRegular

Thickness:0.8MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.7mm, tolerance: ±10%

Finished PCB Thickness: 0.80mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

206-layers PCBRegular

Thickness:0.8MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.73mm, tolerance: ±10%

Finished PCB Thickness: 0.83mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

216-layers PCBRegular

Thickness:0.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0705
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0705
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.51mm, tolerance: ±10%

Finished PCB Thickness: 0.61mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

226-layers PCBRegular

Thickness:0.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0635
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0460
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0635
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.48mm, tolerance: ±10%

Finished PCB Thickness: 0.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

236-layers PCBRegular

Thickness:0.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0785
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0785
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.52mm, tolerance: ±10%

Finished PCB Thickness: 0.62mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

246-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

256-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.53mm, tolerance: ±10%

Finished PCB Thickness: 1.63mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

266-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L2-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2285
PP	2116 RC58% DK:4.45	0.1300	0.2285
L4-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

276-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L4-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.51mm, tolerance: ±10%

Finished PCB Thickness: 1.61mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

286-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L2-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L4-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.47mm, tolerance: ±10%

Finished PCB Thickness: 1.57mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

296-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L2-CU	Inner Copper 2OZ	0.0700	0.346 (Core with Cu)
CORE	Core DK:4.6	0.2060
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2180
PP	2116 RC58% DK:4.45	0.1300	0.2180
L4-CU	Inner Copper 2OZ	0.0700	0.346 (Core with Cu)
CORE	Core DK:4.6	0.2060
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

306-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L2-CU	Inner Copper 2OZ	0.0700	0.346 (Core with Cu)
CORE	Core DK:4.6	0.2060
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2710
PP	1080 RC68% DK:4.21	0.0810
PP	2116 RC58% DK:4.45	0.1300
L4-CU	Inner Copper 2OZ	0.0700	0.346 (Core with Cu)
CORE	Core DK:4.6	0.2060
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

316-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2500
PP	7628 RC46% DK:4.74	0.1960	0.2500
L2-CU	Inner Copper 2OZ	0.0700	0.346 (Core with Cu)
CORE	Core DK:4.6	0.2060
L3-CU	Inner Copper 2OZ	0.0700
PP	3313 RC58% DK:4.45	0.1030	0.2010
PP	7628 RC46% DK:4.74	0.1960	0.2010
L4-CU	Inner Copper 2OZ	0.0700	0.346 (Core with Cu)
CORE	Core DK:4.6	0.2060
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2500
PP	3313 RC58% DK:4.45	0.1030	0.2500
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.5mm, tolerance: ±10%

Finished PCB Thickness: 1.60mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

326-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L2-CU	Inner Copper 3OZ	0.1050	0.313 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L4-CU	Inner Copper 3OZ	0.1050	0.313 (Core with Cu)
CORE	Core DK:4.6	0.1030
L5-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.54mm, tolerance: ±10%

Finished PCB Thickness: 1.64mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

336-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2225
PP	2116 RC58% DK:4.45	0.1300	0.2225
L2-CU	Inner Copper 3OZ	0.1050	0.34 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 3OZ	0.1050
PP	3313 RC58% DK:4.45	0.1030	0.2120
PP	2116 RC58% DK:4.45	0.1300	0.2120
L4-CU	Inner Copper 3OZ	0.1050	0.34 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2225
PP	3313 RC58% DK:4.45	0.1030	0.2225
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.51mm, tolerance: ±10%

Finished PCB Thickness: 1.61mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

346-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.26mm, tolerance: ±10%

Finished PCB Thickness: 2.36mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

356-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.1885
PP	3313 RC58% DK:4.45	0.1030	0.1885
L2-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.1710
PP	3313 RC58% DK:4.45	0.1030	0.1710
L4-CU	Inner Copper 1OZ	0.0350	0.8 (Core with Cu)
CORE	Core DK:4.6	0.7300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.1885
PP	3313 RC58% DK:4.45	0.1030	0.1885
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

366-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Inner Copper 1OZ	0.0350	0.9 (Core with Cu)
CORE	Core DK:4.6	0.8300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

376-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L2-CU	Inner Copper 1.5OZ	0.0525	0.74 (Core with Cu)
CORE	Core DK:4.6	0.6350
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2285
PP	2116 RC58% DK:4.45	0.1300	0.2285
L4-CU	Inner Copper 1.5OZ	0.0525	0.74 (Core with Cu)
CORE	Core DK:4.6	0.6350
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

386-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.74 (Core with Cu)
CORE	Core DK:4.6	0.6350
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L4-CU	Inner Copper 1.5OZ	0.0525	0.74 (Core with Cu)
CORE	Core DK:4.6	0.6350
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.26mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

396-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2623
PP	7628 RC46% DK:4.74	0.1960	0.2623
L2-CU	Inner Copper 1.5OZ	0.0525	0.74 (Core with Cu)
CORE	Core DK:4.6	0.6350
L3-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.2255
PP	7628 RC46% DK:4.74	0.1960	0.2255
L4-CU	Inner Copper 1.5OZ	0.0525	0.74 (Core with Cu)
CORE	Core DK:4.6	0.6350
L5-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2623
PP	3313 RC58% DK:4.45	0.1030	0.2623
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

406-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3050
PP	7628 RC46% DK:4.74	0.1960	0.3050
L2-CU	Inner Copper 2OZ	0.0700	0.67 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2840
PP	7628 RC46% DK:4.74	0.1960	0.2840
L4-CU	Inner Copper 2OZ	0.0700	0.67 (Core with Cu)
CORE	Core DK:4.6	0.5300
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.3050
PP	2116 RC58% DK:4.45	0.1300	0.3050
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.44mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

416-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L2-CU	Inner Copper 2OZ	0.0700	0.77 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L4-CU	Inner Copper 2OZ	0.0700	0.77 (Core with Cu)
CORE	Core DK:4.6	0.6300
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

426-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2500
PP	7628 RC46% DK:4.74	0.1960	0.2500
L2-CU	Inner Copper 2OZ	0.0700	0.77 (Core with Cu)
CORE	Core DK:4.6	0.6300
L3-CU	Inner Copper 2OZ	0.0700
PP	3313 RC58% DK:4.45	0.1030	0.2010
PP	7628 RC46% DK:4.74	0.1960	0.2010
L4-CU	Inner Copper 2OZ	0.0700	0.77 (Core with Cu)
CORE	Core DK:4.6	0.6300
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2500
PP	3313 RC58% DK:4.45	0.1030	0.2500
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.35mm, tolerance: ±10%

Finished PCB Thickness: 2.46mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

436-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1735
PP	3313 RC58% DK:4.45	0.1030	0.1735
L2-CU	Inner Copper 3OZ	0.1050	0.798 (Core with Cu)
CORE	Core DK:4.6	0.5880
L3-CU	Inner Copper 3OZ	0.1050
PP	1080 RC68% DK:4.21	0.0810	0.1630
PP	3313 RC58% DK:4.45	0.1030	0.1630
L4-CU	Inner Copper 3OZ	0.1050	0.798 (Core with Cu)
CORE	Core DK:4.6	0.5880
L5-CU	Inner Copper 3OZ	0.1050
PP	3313 RC58% DK:4.45	0.1030	0.1735
PP	1080 RC68% DK:4.21	0.0810	0.1735
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

446-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L2-CU	Inner Copper 3OZ	0.1050	0.68 (Core with Cu)
CORE	Core DK:4.6	0.4700
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L4-CU	Inner Copper 3OZ	0.1050	0.68 (Core with Cu)
CORE	Core DK:4.6	0.4700
L5-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

456-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3155
PP	7628 RC46% DK:4.74	0.1960	0.3155
L2-CU	Inner Copper 3OZ	0.1050	0.60 (Core with Cu)
CORE	Core DK:4.6	0.3900
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.3050
PP	7628 RC46% DK:4.74	0.1960	0.3050
L4-CU	Inner Copper 3OZ	0.1050	0.60 (Core with Cu)
CORE	Core DK:4.6	0.3900
L5-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.3155
PP	2116 RC58% DK:4.45	0.1300	0.3155
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

466-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L2-CU	Inner Copper 3OZ	0.1050	0.705 (Core with Cu)
CORE	Core DK:4.6	0.4950
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L4-CU	Inner Copper 3OZ	0.1050	0.705 (Core with Cu)
CORE	Core DK:4.6	0.4950
L5-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2495
PP	2116 RC58% DK:4.45	0.1300	0.2495
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

476-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2850
PP	7628 RC46% DK:4.74	0.1960	0.2850
L2-CU	Inner Copper 4OZ	0.1400	0.606 (Core with Cu)
CORE	Core DK:4.6	0.3260
L3-CU	Inner Copper 4OZ	0.1400
PP	3313 RC58% DK:4.45	0.1030	0.2710
PP	7628 RC46% DK:4.74	0.1960	0.2710
L4-CU	Inner Copper 4OZ	0.1400	0.606 (Core with Cu)
CORE	Core DK:4.6	0.3260
L5-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2850
PP	3313 RC58% DK:4.45	0.1030	0.2850
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

486-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2630
PP	7628 RC46% DK:4.74	0.1960	0.2630
L2-CU	Inner Copper 4OZ	0.1400	0.643 (Core with Cu)
CORE	Core DK:4.6	0.3630
L3-CU	Inner Copper 4OZ	0.1400
PP	1080 RC68% DK:4.21	0.0810	0.2490
PP	7628 RC46% DK:4.74	0.1960	0.2490
L4-CU	Inner Copper 4OZ	0.1400	0.643 (Core with Cu)
CORE	Core DK:4.6	0.3630
L5-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2630
PP	1080 RC68% DK:4.21	0.0810	0.2630
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

496-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2850
PP	7628 RC46% DK:4.74	0.1960	0.2850
L2-CU	Inner Copper 4OZ	0.1400	0.62 (Core with Cu)
CORE	Core DK:4.6	0.3400
L3-CU	Inner Copper 4OZ	0.1400
PP	3313 RC58% DK:4.45	0.1030	0.2710
PP	7628 RC46% DK:4.74	0.1960	0.2710
L4-CU	Inner Copper 4OZ	0.1400	0.62 (Core with Cu)
CORE	Core DK:4.6	0.3400
L5-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2850
PP	3313 RC58% DK:4.45	0.1030	0.2850
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

506-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.1920
PP	3313 RC58% DK:4.45	0.1030	0.1920
L2-CU	Inner Copper 4OZ	0.1400	0.753 (Core with Cu)
CORE	Core DK:4.6	0.4730
L3-CU	Inner Copper 4OZ	0.1400
PP	3313 RC58% DK:4.45	0.1030	0.1780
PP	3313 RC58% DK:4.45	0.1030	0.1780
L4-CU	Inner Copper 4OZ	0.1400	0.753 (Core with Cu)
CORE	Core DK:4.6	0.4730
L5-CU	Inner Copper 4OZ	0.1400
PP	3313 RC58% DK:4.45	0.1030	0.1920
PP	3313 RC58% DK:4.45	0.1030	0.1920
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

516-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2815
PP	7628 RC46% DK:4.74	0.1960	0.2815
L2-CU	Inner Copper 5OZ	0.1750	0.627 (Core with Cu)
CORE	Core DK:4.6	0.2770
L3-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.2640
PP	7628 RC46% DK:4.74	0.1960	0.2640
L4-CU	Inner Copper 5OZ	0.1750	0.627 (Core with Cu)
CORE	Core DK:4.6	0.2770
L5-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2815
PP	3313 RC58% DK:4.45	0.1030	0.2815
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

526-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3085
PP	7628 RC46% DK:4.74	0.1960	0.3085
L2-CU	Inner Copper 5OZ	0.1750	0.593 (Core with Cu)
CORE	Core DK:4.6	0.2430
L3-CU	Inner Copper 5OZ	0.1750
PP	2116 RC58% DK:4.45	0.1300	0.2910
PP	7628 RC46% DK:4.74	0.1960	0.2910
L4-CU	Inner Copper 5OZ	0.1750	0.593 (Core with Cu)
CORE	Core DK:4.6	0.2430
L5-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.3085
PP	2116 RC58% DK:4.45	0.1300	0.3085
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.44mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

536-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2815
PP	7628 RC46% DK:4.74	0.1960	0.2815
L2-CU	Inner Copper 5OZ	0.1750	0.61 (Core with Cu)
CORE	Core DK:4.6	0.2600
L3-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.2640
PP	7628 RC46% DK:4.74	0.1960	0.2640
L4-CU	Inner Copper 5OZ	0.1750	0.61 (Core with Cu)
CORE	Core DK:4.6	0.2600
L5-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2815
PP	3313 RC58% DK:4.45	0.1030	0.2815
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

546-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2595
PP	7628 RC46% DK:4.74	0.1960	0.2595
L2-CU	Inner Copper 5OZ	0.1750	0.66 (Core with Cu)
CORE	Core DK:4.6	0.3100
L3-CU	Inner Copper 5OZ	0.1750
PP	1080 RC68% DK:4.21	0.0810	0.2420
PP	7628 RC46% DK:4.74	0.1960	0.2420
L4-CU	Inner Copper 5OZ	0.1750	0.66 (Core with Cu)
CORE	Core DK:4.6	0.3100
L5-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2595
PP	1080 RC68% DK:4.21	0.0810	0.2595
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 5OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

556-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3015
PP	7628 RC46% DK:4.74	0.1960	0.3015
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2770
PP	7628 RC46% DK:4.74	0.1960	0.2770
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.3015
PP	2116 RC58% DK:4.45	0.1300	0.3015
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.92mm, tolerance: ±10%

Finished PCB Thickness: 2.02mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

566-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2085
PP	2116 RC58% DK:4.45	0.1300	0.2085
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.1840
PP	2116 RC58% DK:4.45	0.1300	0.1840
L4-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2085
PP	3313 RC58% DK:4.45	0.1030	0.2085
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.91mm, tolerance: ±10%

Finished PCB Thickness: 2.01mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

576-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L2-CU	Inner Copper 1.5OZ	0.0525	0.535 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2285
PP	2116 RC58% DK:4.45	0.1300	0.2285
L4-CU	Inner Copper 1.5OZ	0.0525	0.535 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

586-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.535 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L4-CU	Inner Copper 1.5OZ	0.0525	0.535 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.85mm, tolerance: ±10%

Finished PCB Thickness: 1.95mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

596-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2623
PP	7628 RC46% DK:4.74	0.1960	0.2623
L2-CU	Inner Copper 1.5OZ	0.0525	0.535 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.2255
PP	7628 RC46% DK:4.74	0.1960	0.2255
L4-CU	Inner Copper 1.5OZ	0.0525	0.535 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2623
PP	3313 RC58% DK:4.45	0.1030	0.2623
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.93mm, tolerance: ±10%

Finished PCB Thickness: 2.03mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

606-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L2-CU	Inner Copper 2OZ	0.0700	0.57 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2180
PP	2116 RC58% DK:4.45	0.1300	0.2180
L4-CU	Inner Copper 2OZ	0.0700	0.57 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

616-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L2-CU	Inner Copper 2OZ	0.0700	0.57 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L4-CU	Inner Copper 2OZ	0.0700	0.57 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

626-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2280
PP	7628 RC46% DK:4.74	0.1960	0.2280
L2-CU	Inner Copper 2OZ	0.0700	0.57 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 2OZ	0.0700
PP	1080 RC68% DK:4.21	0.0810	0.1790
PP	7628 RC46% DK:4.74	0.1960	0.1790
L4-CU	Inner Copper 2OZ	0.0700	0.57 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	1080 RC68% DK:4.21	0.0810	0.2280
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.88mm, tolerance: ±10%

Finished PCB Thickness: 1.98mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

636-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3155
PP	7628 RC46% DK:4.74	0.1960	0.3155
L2-CU	Inner Copper 3OZ	0.1050	0.416 (Core with Cu)
CORE	Core DK:4.6	0.2060
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.3050
PP	7628 RC46% DK:4.74	0.1960	0.3050
L4-CU	Inner Copper 3OZ	0.1050	0.416 (Core with Cu)
CORE	Core DK:4.6	0.2060
L5-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.3155
PP	2116 RC58% DK:4.45	0.1300	0.3155
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

646-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	2116 RC58% DK:4.45	0.1300	0.3155
PP	7628 RC46% DK:4.74	0.1960	0.3155
L2-CU	Inner Copper 3OZ	0.1050	0.372 (Core with Cu)
CORE	Core DK:4.6	0.1620
L3-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.3050
PP	7628 RC46% DK:4.74	0.1960	0.3050
L4-CU	Inner Copper 3OZ	0.1050	0.372 (Core with Cu)
CORE	Core DK:4.6	0.1620
L5-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.3155
PP	2116 RC58% DK:4.45	0.1300	0.3155
L6-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 1.86mm, tolerance: ±10%

Finished PCB Thickness: 1.96mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

656-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2460
PP	2116 RC58% DK:4.45	0.1300	0.2460
L2-CU	Inner Copper 4OZ	0.1400	0.476 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2320
PP	2116 RC58% DK:4.45	0.1300	0.2320
L4-CU	Inner Copper 4OZ	0.1400	0.476 (Core with Cu)
CORE	Core DK:4.6	0.1960
L5-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2460
PP	2116 RC58% DK:4.45	0.1300	0.2460
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 1.92mm, tolerance: ±10%

Finished PCB Thickness: 2.02mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

666-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2850
PP	7628 RC46% DK:4.74	0.1960	0.2850
L2-CU	Inner Copper 4OZ	0.1400	0.41 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 4OZ	0.1400
PP	3313 RC58% DK:4.45	0.1030	0.2710
PP	7628 RC46% DK:4.74	0.1960	0.2710
L4-CU	Inner Copper 4OZ	0.1400	0.41 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2850
PP	3313 RC58% DK:4.45	0.1030	0.2850
L6-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 1.91mm, tolerance: ±10%

Finished PCB Thickness: 2.01mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

676-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1070	0.2855
PP	7628 RC46% DK:4.74	0.1960	0.2855
L2-CU	Inner Copper 5OZ	0.1750	0.383 (Core with Cu)
CORE	Core DK:4.6	0.0330
L3-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1070	0.2680
PP	7628 RC46% DK:4.74	0.1960	0.2680
L4-CU	Inner Copper 5OZ	0.1750	0.383 (Core with Cu)
CORE	Core DK:4.6	0.0330
L5-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2855
PP	3313 RC58% DK:4.45	0.1070	0.2855
L6-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)

Thickness after lamination: 1.92mm, tolerance: ±10%

Finished PCB Thickness: 2.02mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

686-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)
PP	3313 RC58% DK:4.45	0.1070	0.2855
PP	7628 RC46% DK:4.74	0.1960	0.2855
L2-CU	Inner Copper 5OZ	0.1750	0.36 (Core with Cu)
CORE	Core DK:4.6	0.0100
L3-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1070	0.2680
PP	7628 RC46% DK:4.74	0.1960	0.2680
L4-CU	Inner Copper 5OZ	0.1750	0.36 (Core with Cu)
CORE	Core DK:4.6	0.0100
L5-CU	Inner Copper 5OZ	0.1750
PP	7628 RC46% DK:4.74	0.1960	0.2855
PP	3313 RC58% DK:4.45	0.1070	0.2855
L6-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.98mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

696-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.06mm, tolerance: ±10%

Finished PCB Thickness: 1.16mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

706-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.13mm, tolerance: ±10%

Finished PCB Thickness: 1.23mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

716-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2173
PP	2116 RC58% DK:4.45	0.1300	0.2173
L2-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L3-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.2015
PP	2116 RC58% DK:4.45	0.1300	0.2015
L4-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2173
PP	3313 RC58% DK:4.45	0.1030	0.2173
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.12mm, tolerance: ±10%

Finished PCB Thickness: 1.22mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

726-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2068
PP	2116 RC58% DK:4.45	0.1300	0.2068
L2-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L3-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.1805
PP	2116 RC58% DK:4.45	0.1300	0.1805
L4-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2068
PP	3313 RC58% DK:4.45	0.1030	0.2068
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.07mm, tolerance: ±10%

Finished PCB Thickness: 1.17mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

736-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L2-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L4-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L6-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

746-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L6-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.86mm, tolerance: ±10%

Finished PCB Thickness: 0.96mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

018-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

028-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

038-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

048-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

058-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

068-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.6 (Core with Cu)
CORE	Core DK:4.6	0.5300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

078-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

088-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

098-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.96mm, tolerance: ±10%

Finished PCB Thickness: 2.06mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

108-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.91mm, tolerance: ±10%

Finished PCB Thickness: 2.01mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

118-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

128-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.85mm, tolerance: ±10%

Finished PCB Thickness: 1.95mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

138-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

148-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.05mm, tolerance: ±10%

Finished PCB Thickness: 1.15mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

158-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.14mm, tolerance: ±10%

Finished PCB Thickness: 1.24mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

168-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0705
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0705
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.9mm, tolerance: ±10%

Finished PCB Thickness: 1.00mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

178-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0635
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0635
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.9mm, tolerance: ±10%

Finished PCB Thickness: 1.00mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

188-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0785
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0785
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.9mm, tolerance: ±10%

Finished PCB Thickness: 1.00mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

198-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2500
PP	3313 RC58% DK:4.45	0.1030	0.2500
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.2500
PP	7628 RC46% DK:4.74	0.1960	0.2500
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

208-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2770
PP	7628 RC46% DK:4.74	0.1960	0.2770
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2770
PP	2116 RC58% DK:4.45	0.1300	0.2770
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.47mm, tolerance: ±10%

Finished PCB Thickness: 1.57mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

218-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2173
PP	2116 RC58% DK:4.45	0.1300	0.2173
L2-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L3-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.2015
PP	2116 RC58% DK:4.45	0.1300	0.2015
L4-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2015
PP	3313 RC58% DK:4.45	0.1030	0.2015
L6-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2173
PP	3313 RC58% DK:4.45	0.1030	0.2173
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.5mm, tolerance: ±10%

Finished PCB Thickness: 1.60mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

228-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L4-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L6-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

238-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L2-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L4-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L6-CU	Inner Copper 1.5OZ	0.0525	0.187 (Core with Cu)
CORE	Core DK:4.6	0.0820
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

248-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L2-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 2OZ	0.0700
PP	1080 RC68% DK:4.21	0.0810	0.1690
PP	2116 RC58% DK:4.45	0.1300	0.1690
L4-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1690
PP	1080 RC68% DK:4.21	0.0810	0.1690
L6-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	1080 RC68% DK:4.21	0.0810	0.1900
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

258-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.1980
PP	2116 RC58% DK:4.45	0.1300	0.1980
L2-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 2OZ	0.0700
PP	3313 RC58% DK:4.45	0.1030	0.1630
PP	2116 RC58% DK:4.45	0.1300	0.1630
L4-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1630
PP	3313 RC58% DK:4.45	0.1030	0.1630
L6-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1980
PP	3313 RC58% DK:4.45	0.1030	0.1980
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

268-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L2-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1620
PP	2116 RC58% DK:4.45	0.1300	0.1620
L4-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1620
PP	2116 RC58% DK:4.45	0.1300	0.1620
L6-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.51mm, tolerance: ±10%

Finished PCB Thickness: 1.61mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

278-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	1080 RC68% DK:4.21	0.0810	0.2280
L4-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.2280
PP	7628 RC46% DK:4.74	0.1960	0.2280
L6-CU	Inner Copper 1OZ	0.0350	0.5 (Core with Cu)
CORE	Core DK:4.6	0.4300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

288-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2525
PP	7628 RC46% DK:4.74	0.1960	0.2525
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.2280
PP	7628 RC46% DK:4.74	0.1960	0.2280
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	1080 RC68% DK:4.21	0.0810	0.2280
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2525
PP	1080 RC68% DK:4.21	0.0810	0.2525
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

298-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2833
PP	7628 RC46% DK:4.74	0.1960	0.2833
L2-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L3-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.2675
PP	7628 RC46% DK:4.74	0.1960	0.2675
L4-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L5-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2675
PP	3313 RC58% DK:4.45	0.1030	0.2675
L6-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L7-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2833
PP	3313 RC58% DK:4.45	0.1030	0.2833
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

308-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2893
PP	7628 RC46% DK:4.74	0.1960	0.2893
L2-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2525
PP	7628 RC46% DK:4.74	0.1960	0.2525
L4-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L5-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2525
PP	2116 RC58% DK:4.45	0.1300	0.2525
L6-CU	Inner Copper 1.5OZ	0.0525	0.366 (Core with Cu)
CORE	Core DK:4.6	0.2610
L7-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2893
PP	2116 RC58% DK:4.45	0.1300	0.2893
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

318-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.44 (Core with Cu)
CORE	Core DK:4.6	0.3350
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L4-CU	Inner Copper 1.5OZ	0.0525	0.44 (Core with Cu)
CORE	Core DK:4.6	0.3350
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L6-CU	Inner Copper 1.5OZ	0.0525	0.44 (Core with Cu)
CORE	Core DK:4.6	0.3350
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

328-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L2-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2180
PP	2116 RC58% DK:4.45	0.1300	0.2180
L4-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2180
PP	2116 RC58% DK:4.45	0.1300	0.2180
L6-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2390
PP	2116 RC58% DK:4.45	0.1300	0.2390
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

338-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2640
PP	7628 RC46% DK:4.74	0.1960	0.2640
L2-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L3-CU	Inner Copper 2OZ	0.0700
PP	3313 RC58% DK:4.45	0.1030	0.2290
PP	7628 RC46% DK:4.74	0.1960	0.2290
L4-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2290
PP	3313 RC58% DK:4.45	0.1030	0.2290
L6-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L7-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2640
PP	3313 RC58% DK:4.45	0.1030	0.2640
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.44mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

348-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2500
PP	7628 RC46% DK:4.74	0.1960	0.2500
L2-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L3-CU	Inner Copper 2OZ	0.0700
PP	3313 RC58% DK:4.45	0.1030	0.2010
PP	7628 RC46% DK:4.74	0.1960	0.2010
L4-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2010
PP	3313 RC58% DK:4.45	0.1030	0.2010
L6-CU	Inner Copper 2OZ	0.0700	0.417 (Core with Cu)
CORE	Core DK:4.6	0.2770
L7-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2500
PP	3313 RC58% DK:4.45	0.1030	0.2500
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.26mm, tolerance: ±10%

Finished PCB Thickness: 2.36mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

358-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2885
PP	7628 RC46% DK:4.74	0.1960	0.2885
L2-CU	Inner Copper 3OZ	0.1050	0.313 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 3OZ	0.1050
PP	3313 RC58% DK:4.45	0.1030	0.2780
PP	7628 RC46% DK:4.74	0.1960	0.2780
L4-CU	Inner Copper 3OZ	0.1050	0.313 (Core with Cu)
CORE	Core DK:4.6	0.1030
L5-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.2780
PP	3313 RC58% DK:4.45	0.1030	0.2780
L6-CU	Inner Copper 3OZ	0.1050	0.313 (Core with Cu)
CORE	Core DK:4.6	0.1030
L7-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.2885
PP	3313 RC58% DK:4.45	0.1030	0.2885
L8-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

368-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2885
PP	7628 RC46% DK:4.74	0.1960	0.2885
L2-CU	Inner Copper 3OZ	0.1050	0.34 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 3OZ	0.1050
PP	3313 RC58% DK:4.45	0.1030	0.2780
PP	7628 RC46% DK:4.74	0.1960	0.2780
L4-CU	Inner Copper 3OZ	0.1050	0.34 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.2780
PP	3313 RC58% DK:4.45	0.1030	0.2780
L6-CU	Inner Copper 3OZ	0.1050	0.34 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 3OZ	0.1050
PP	7628 RC46% DK:4.74	0.1960	0.2885
PP	3313 RC58% DK:4.45	0.1030	0.2885
L8-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

378-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:3OZ

Inner Copper:3OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2225
PP	2116 RC58% DK:4.45	0.1300	0.2225
L2-CU	Inner Copper 3OZ	0.1050	0.416 (Core with Cu)
CORE	Core DK:4.6	0.2060
L3-CU	Inner Copper 3OZ	0.1050
PP	3313 RC58% DK:4.45	0.1030	0.2120
PP	2116 RC58% DK:4.45	0.1300	0.2120
L4-CU	Inner Copper 3OZ	0.1050	0.416 (Core with Cu)
CORE	Core DK:4.6	0.2060
L5-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2120
PP	3313 RC58% DK:4.45	0.1030	0.2120
L6-CU	Inner Copper 3OZ	0.1050	0.416 (Core with Cu)
CORE	Core DK:4.6	0.2060
L7-CU	Inner Copper 3OZ	0.1050
PP	2116 RC58% DK:4.45	0.1300	0.2225
PP	3313 RC58% DK:4.45	0.1030	0.2225
L8-CU	Outer Base Copper 2.5OZ	0.0875	0.0875 (Plating to 3OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

388-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2190
PP	2116 RC58% DK:4.45	0.1300	0.2190
L2-CU	Inner Copper 4OZ	0.1400	0.383 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2320
PP	2116 RC58% DK:4.45	0.1300	0.2320
L4-CU	Inner Copper 4OZ	0.1400	0.383 (Core with Cu)
CORE	Core DK:4.6	0.1030
L5-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2320
PP	2116 RC58% DK:4.45	0.1300	0.2320
L6-CU	Inner Copper 4OZ	0.1400	0.383 (Core with Cu)
CORE	Core DK:4.6	0.1030
L7-CU	Inner Copper 4OZ	0.1400
PP	2116 RC58% DK:4.45	0.1300	0.2190
PP	3313 RC58% DK:4.45	0.1030	0.2190
L8-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

398-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:4OZ

Inner Copper:4OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2630
PP	7628 RC46% DK:4.74	0.1960	0.2630
L2-CU	Inner Copper 4OZ	0.1400	0.36 (Core with Cu)
CORE	Core DK:4.6	0.0800
L3-CU	Inner Copper 4OZ	0.1400
PP	1080 RC68% DK:4.21	0.0810	0.2490
PP	7628 RC46% DK:4.74	0.1960	0.2490
L4-CU	Inner Copper 4OZ	0.1400	0.36 (Core with Cu)
CORE	Core DK:4.6	0.0800
L5-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2490
PP	1080 RC68% DK:4.21	0.0810	0.2490
L6-CU	Inner Copper 4OZ	0.1400	0.36 (Core with Cu)
CORE	Core DK:4.6	0.0800
L7-CU	Inner Copper 4OZ	0.1400
PP	7628 RC46% DK:4.74	0.1960	0.2630
PP	1080 RC68% DK:4.21	0.0810	0.2630
L8-CU	Outer Base Copper 3.5OZ	0.1225	0.1225 (Plating to 4OZ)

Thickness after lamination: 2.35mm, tolerance: ±10%

Finished PCB Thickness: 2.45mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

408-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1665
PP	3313 RC58% DK:4.45	0.1030	0.1665
L2-CU	Inner Copper 5OZ	0.1750	0.453 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 5OZ	0.1750
PP	1080 RC68% DK:4.21	0.0810	0.1490
PP	3313 RC58% DK:4.45	0.1030	0.1490
L4-CU	Inner Copper 5OZ	0.1750	0.453 (Core with Cu)
CORE	Core DK:4.6	0.1030
L5-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.1490
PP	1080 RC68% DK:4.21	0.0810	0.1490
L6-CU	Inner Copper 5OZ	0.1750	0.453 (Core with Cu)
CORE	Core DK:4.6	0.1030
L7-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.1665
PP	1080 RC68% DK:4.21	0.0810	0.1665
L8-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

418-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:5OZ

Inner Copper:5OZ

Inner layer Residual copper ratio:90%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1665
PP	3313 RC58% DK:4.45	0.1030	0.1665
L2-CU	Inner Copper 5OZ	0.1750	0.431 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.1710
PP	3313 RC58% DK:4.45	0.1030	0.1710
L4-CU	Inner Copper 5OZ	0.1750	0.431 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.1710
PP	3313 RC58% DK:4.45	0.1030	0.1710
L6-CU	Inner Copper 5OZ	0.1750	0.431 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 5OZ	0.1750
PP	3313 RC58% DK:4.45	0.1030	0.1665
PP	1080 RC68% DK:4.21	0.0810	0.1665
L8-CU	Outer Base Copper 4.5OZ	0.1575	0.1575 (Plating to 5OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

Inner Copper thickness ≥ 3oz, it is suitable to choose a lamination structure with 90% inner layer Residual copper ratio.

428-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2525
PP	7628 RC46% DK:4.74	0.1960	0.2525
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.2280
PP	7628 RC46% DK:4.74	0.1960	0.2280
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	1080 RC68% DK:4.21	0.0810	0.2280
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2525
PP	1080 RC68% DK:4.21	0.0810	0.2525
L8-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

438-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.2770
PP	2116 RC58% DK:4.45	0.1300	0.2770
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2770
PP	7628 RC46% DK:4.74	0.1960	0.2770
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

448-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L2-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2285
PP	2116 RC58% DK:4.45	0.1300	0.2285
L4-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2285
PP	2116 RC58% DK:4.45	0.1300	0.2285
L6-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2443
PP	2116 RC58% DK:4.45	0.1300	0.2443
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.96mm, tolerance: ±10%

Finished PCB Thickness: 2.06mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

458-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L2-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L4-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2075
PP	2116 RC58% DK:4.45	0.1300	0.2075
L6-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2338
PP	2116 RC58% DK:4.45	0.1300	0.2338
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

468-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2403
PP	7628 RC46% DK:4.74	0.1960	0.2403
L2-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L3-CU	Inner Copper 1.5OZ	0.0525
PP	1080 RC68% DK:4.21	0.0810	0.2035
PP	7628 RC46% DK:4.74	0.1960	0.2035
L4-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L5-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2035
PP	1080 RC68% DK:4.21	0.0810	0.2035
L6-CU	Inner Copper 1.5OZ	0.0525	0.302 (Core with Cu)
CORE	Core DK:4.6	0.1970
L7-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2403
PP	1080 RC68% DK:4.21	0.0810	0.2403
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

478-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2120
PP	2116 RC58% DK:4.45	0.1300	0.2120
L2-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 2OZ	0.0700
PP	3313 RC58% DK:4.45	0.1030	0.1910
PP	2116 RC58% DK:4.45	0.1300	0.1910
L4-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1910
PP	3313 RC58% DK:4.45	0.1030	0.1910
L6-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2120
PP	3313 RC58% DK:4.45	0.1030	0.2120
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.92mm, tolerance: ±10%

Finished PCB Thickness: 2.02mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

488-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L2-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L4-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L6-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2250
PP	2116 RC58% DK:4.45	0.1300	0.2250
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

498-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	1080 RC68% DK:4.21	0.0810	0.2280
PP	7628 RC46% DK:4.74	0.1960	0.2280
L2-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L3-CU	Inner Copper 2OZ	0.0700
PP	1080 RC68% DK:4.21	0.0810	0.1790
PP	7628 RC46% DK:4.74	0.1960	0.1790
L4-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.1790
PP	1080 RC68% DK:4.21	0.0810	0.1790
L6-CU	Inner Copper 2OZ	0.0700	0.336 (Core with Cu)
CORE	Core DK:4.6	0.1960
L7-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	1080 RC68% DK:4.21	0.0810	0.2280
L8-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.93mm, tolerance: ±10%

Finished PCB Thickness: 2.03mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

0110-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

0210-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

0310-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

0410-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

0510-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

0610-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L8-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

0710-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

0810-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L8-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.36mm, tolerance: ±10%

Finished PCB Thickness: 2.46mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

0910-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0785
L2-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L4-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L6-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L8-CU	Inner Copper 1OZ	0.0350	0.4 (Core with Cu)
CORE	Core DK:4.6	0.3300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0785
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

1010-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0705
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0705
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

1110-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

1210-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

1310-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.92mm, tolerance: ±10%

Finished PCB Thickness: 2.02mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

1410-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

1510-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1715
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1715
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

1610-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

1710-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.09mm, tolerance: ±10%

Finished PCB Thickness: 1.19mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

1810-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:0.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0758
L2-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L3-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0705
L4-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L5-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0705
L6-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L7-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0705
L8-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L9-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0758
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.92mm, tolerance: ±10%

Finished PCB Thickness: 1.02mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

1910-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:0.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0723
L2-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L3-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0635
L4-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L5-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0635
L6-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L7-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0635
L8-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L9-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0723
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.89mm, tolerance: ±10%

Finished PCB Thickness: 0.99mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

2010-layers PCBRegular

Thickness:1.0MM

Finished Outer Copper:1OZ

Inner Copper:0.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0688
L2-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L3-CU	Inner Copper 0.5OZ	0.0175
PP	3313 RC58% DK:4.45	0.1030	0.0785
L4-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L5-CU	Inner Copper 0.5OZ	0.0175
PP	3313 RC58% DK:4.45	0.1030	0.0785
L6-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L7-CU	Inner Copper 0.5OZ	0.0175
PP	3313 RC58% DK:4.45	0.1030	0.0785
L8-CU	Inner Copper 0.5OZ	0.0175	0.13 (Core with Cu)
CORE	Core DK:4.6	0.0950
L9-CU	Inner Copper 0.5OZ	0.0175
PP	1080 RC68% DK:4.21	0.0810	0.0688
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 0.93mm, tolerance: ±10%

Finished PCB Thickness: 1.03mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

2110-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.2613
PP	1080 RC68% DK:4.21	0.0810	0.2613
L2-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2455
PP	1080 RC68% DK:4.21	0.0810	0.2455
L4-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2455
PP	1080 RC68% DK:4.21	0.0810	0.2455
L6-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2455
PP	1080 RC68% DK:4.21	0.0810	0.2455
L8-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2613
PP	1080 RC68% DK:4.21	0.0810	0.2613
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2210-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.2728
PP	3313 RC58% DK:4.45	0.1030	0.2728
L2-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2465
PP	3313 RC58% DK:4.45	0.1030	0.2465
L4-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2465
PP	3313 RC58% DK:4.45	0.1030	0.2465
L6-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2465
PP	3313 RC58% DK:4.45	0.1030	0.2465
L8-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.2728
PP	3313 RC58% DK:4.45	0.1030	0.2728
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

2310-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.3553
PP	7628 RC46% DK:4.74	0.1960	0.3553
L2-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L4-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L6-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L8-CU	Inner Copper 1.5OZ	0.0525	0.235 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1.5OZ	0.0525
PP	7628 RC46% DK:4.74	0.1960	0.3553
PP	7628 RC46% DK:4.74	0.1960	0.3553
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

2410-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.2560
PP	1080 RC68% DK:4.21	0.0810	0.2560
L2-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2350
PP	1080 RC68% DK:4.21	0.0810	0.2350
L4-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2350
PP	1080 RC68% DK:4.21	0.0810	0.2350
L6-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L7-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2350
PP	1080 RC68% DK:4.21	0.0810	0.2350
L8-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L9-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2560
PP	1080 RC68% DK:4.21	0.0810	0.2560
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2510-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.2640
PP	3313 RC58% DK:4.45	0.1030	0.2640
L2-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2290
PP	3313 RC58% DK:4.45	0.1030	0.2290
L4-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2290
PP	3313 RC58% DK:4.45	0.1030	0.2290
L6-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L7-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2290
PP	3313 RC58% DK:4.45	0.1030	0.2290
L8-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L9-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2640
PP	3313 RC58% DK:4.45	0.1030	0.2640
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

2610-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	7628 RC46% DK:4.74	0.1960	0.2770
PP	2116 RC58% DK:4.45	0.1300	0.2770
L2-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L3-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	2116 RC58% DK:4.45	0.1300	0.2280
L4-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L5-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	2116 RC58% DK:4.45	0.1300	0.2280
L6-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L7-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2280
PP	2116 RC58% DK:4.45	0.1300	0.2280
L8-CU	Inner Copper 2OZ	0.0700	0.243 (Core with Cu)
CORE	Core DK:4.6	0.1030
L9-CU	Inner Copper 2OZ	0.0700
PP	7628 RC46% DK:4.74	0.1960	0.2770
PP	2116 RC58% DK:4.45	0.1300	0.2770
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

2710-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.1903
PP	3313 RC58% DK:4.45	0.1030	0.1903
L2-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L3-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.1745
PP	3313 RC58% DK:4.45	0.1030	0.1745
L4-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L5-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.1745
PP	3313 RC58% DK:4.45	0.1030	0.1745
L6-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L7-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.1745
PP	3313 RC58% DK:4.45	0.1030	0.1745
L8-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L9-CU	Inner Copper 1.5OZ	0.0525
PP	3313 RC58% DK:4.45	0.1030	0.1903
PP	3313 RC58% DK:4.45	0.1030	0.1903
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.85mm, tolerance: ±10%

Finished PCB Thickness: 1.95mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2810-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2068
PP	3313 RC58% DK:4.45	0.1030	0.2068
L2-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1805
PP	3313 RC58% DK:4.45	0.1030	0.1805
L4-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1805
PP	3313 RC58% DK:4.45	0.1030	0.1805
L6-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1805
PP	3313 RC58% DK:4.45	0.1030	0.1805
L8-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L9-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2068
PP	3313 RC58% DK:4.45	0.1030	0.2068
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

2910-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:1.5OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L2-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L3-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L4-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L5-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L6-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L7-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.1865
PP	2116 RC58% DK:4.45	0.1300	0.1865
L8-CU	Inner Copper 1.5OZ	0.0525	0.209 (Core with Cu)
CORE	Core DK:4.6	0.1040
L9-CU	Inner Copper 1.5OZ	0.0525
PP	2116 RC58% DK:4.45	0.1300	0.2233
PP	2116 RC58% DK:4.45	0.1300	0.2233
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.95mm, tolerance: ±10%

Finished PCB Thickness: 2.05mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

3010-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	1080 RC68% DK:4.21	0.0810	0.1900
L2-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1690
PP	1080 RC68% DK:4.21	0.0810	0.1690
L4-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1690
PP	1080 RC68% DK:4.21	0.0810	0.1690
L6-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1690
PP	1080 RC68% DK:4.21	0.0810	0.1690
L8-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L9-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	1080 RC68% DK:4.21	0.0810	0.1900
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.88mm, tolerance: ±10%

Finished PCB Thickness: 1.98mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

3110-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	3313 RC58% DK:4.45	0.1030	0.1710
PP	3313 RC58% DK:4.45	0.1030	0.1710
L2-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L4-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L6-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1900
PP	2116 RC58% DK:4.45	0.1300	0.1900
L8-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L9-CU	Inner Copper 2OZ	0.0700
PP	3313 RC58% DK:4.45	0.1030	0.1710
PP	3313 RC58% DK:4.45	0.1030	0.1710
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3210-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:2OZ

Inner Copper:2OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L2-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1620
PP	2116 RC58% DK:4.45	0.1300	0.1620
L4-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1620
PP	2116 RC58% DK:4.45	0.1300	0.1620
L6-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.1620
PP	2116 RC58% DK:4.45	0.1300	0.1620
L8-CU	Inner Copper 2OZ	0.0700	0.221 (Core with Cu)
CORE	Core DK:4.6	0.0810
L9-CU	Inner Copper 2OZ	0.0700
PP	2116 RC58% DK:4.45	0.1300	0.2110
PP	2116 RC58% DK:4.45	0.1300	0.2110
L10-CU	Outer Base Copper 1.5OZ	0.0525	0.0525 (Plating to 2OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

3310-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L10-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.13mm, tolerance: ±10%

Finished PCB Thickness: 1.23mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

0112-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

0212-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0855
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0855
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

0312-layers PCBRegular

Thickness:1.6MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0785
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0785
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

0412-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1855
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L11-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1855
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.44mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

0512-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	7628 RC46% DK:4.74	0.1960	0.1785
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L10-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L11-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1785
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

0612-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L4-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L6-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L8-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1470
L10-CU	Inner Copper 1OZ	0.0350	0.3 (Core with Cu)
CORE	Core DK:4.6	0.2300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

0712-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1750
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.92mm, tolerance: ±10%

Finished PCB Thickness: 2.02mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

0812-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	7628 RC46% DK:4.74	0.1960	0.1610
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.9mm, tolerance: ±10%

Finished PCB Thickness: 2.00mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

0912-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0600
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.14mm, tolerance: ±10%

Finished PCB Thickness: 1.24mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

1012-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.0635
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0680
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.0635
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.11mm, tolerance: ±10%

Finished PCB Thickness: 1.21mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

1112-layers PCBRegular

Thickness:1.2MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0785
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0540
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0785
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.08mm, tolerance: ±10%

Finished PCB Thickness: 1.18mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

1212-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0785
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.1840
PP	2116 RC58% DK:4.45	0.1300	0.1840
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.1840
PP	2116 RC58% DK:4.45	0.1300	0.1840
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1840
PP	3313 RC58% DK:4.45	0.1030	0.1840
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1840
PP	3313 RC58% DK:4.45	0.1030	0.1840
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0785
L12-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.93mm, tolerance: ±10%

Finished PCB Thickness: 2.03mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

0114-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L12-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.26mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

0214-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1935
PP	2116 RC58% DK:4.45	0.1300	0.1935
L2-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L10-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L12-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1935
PP	1080 RC68% DK:4.21	0.0810	0.1935
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

0314-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.2085
PP	2116 RC58% DK:4.45	0.1300	0.2085
L2-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L4-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L6-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L8-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L10-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L12-CU	Inner Copper 1OZ	0.0350	0.24 (Core with Cu)
CORE	Core DK:4.6	0.1700
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.2085
PP	3313 RC58% DK:4.45	0.1030	0.2085
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

0414-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.97mm, tolerance: ±10%

Finished PCB Thickness: 2.07mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

0514-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

0614-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L14-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.85mm, tolerance: ±10%

Finished PCB Thickness: 1.95mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

0116-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L14-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L16-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

0216-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1760
PP	1080 RC68% DK:4.21	0.0810	0.1760
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1760
PP	2116 RC58% DK:4.45	0.1300	0.1760
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L14-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L16-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.39mm, tolerance: ±10%

Finished PCB Thickness: 2.49mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

0316-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L4-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L6-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L7-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L8-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L9-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L10-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L11-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L12-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L13-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L14-CU	Inner Copper 1OZ	0.0350	0.2 (Core with Cu)
CORE	Core DK:4.6	0.1300
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L16-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

0416-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L12-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L14-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L16-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

0516-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1125
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1760
PP	1080 RC68% DK:4.21	0.0810	0.1760
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1760
PP	2116 RC58% DK:4.45	0.1300	0.1760
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L12-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L14-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1125
L16-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

0616-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1375
PP	1080 RC68% DK:4.21	0.0810	0.1375
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L12-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L13-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L14-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L15-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1375
PP	1080 RC68% DK:4.21	0.0810	0.1375
L16-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.93mm, tolerance: ±10%

Finished PCB Thickness: 2.03mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

0118-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1195
L2-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L4-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L6-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L8-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L10-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L12-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L14-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1090
L16-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L17-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1195
L18-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

0218-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1935
PP	2116 RC58% DK:4.45	0.1300	0.1935
L2-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L4-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L6-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L8-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L10-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L12-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L14-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0950
L16-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L17-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1935
PP	1080 RC68% DK:4.21	0.0810	0.1935
L18-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

0318-layers PCBRegular

Thickness:2.4MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	1080 RC68% DK:4.21	0.0810	0.1375
PP	1080 RC68% DK:4.21	0.0810	0.1375
L2-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L3-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L4-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L5-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L6-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L7-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L8-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L9-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L10-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L11-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L12-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L13-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L14-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L15-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1130
PP	1080 RC68% DK:4.21	0.0810	0.1130
L16-CU	Inner Copper 1OZ	0.0350	0.151 (Core with Cu)
CORE	Core DK:4.6	0.0810
L17-CU	Inner Copper 1OZ	0.0350
PP	1080 RC68% DK:4.21	0.0810	0.1375
PP	1080 RC68% DK:4.21	0.0810	0.1375
L18-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

0418-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:70%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	3313 RC58% DK:4.45	0.1030	0.0925
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L12-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L13-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L14-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L15-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0820
L16-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L17-CU	Inner Copper 1OZ	0.0350
PP	3313 RC58% DK:4.45	0.1030	0.0925
L18-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

0518-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:0.5OZ

Inner layer Residual copper ratio:50%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1213
L2-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1125
L4-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1125
L6-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1125
L8-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1125
L10-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1125
L12-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L13-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1125
L14-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L15-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1125
L16-CU	Inner Copper 0.5OZ	0.0175	0.1 (Core with Cu)
CORE	Core DK:4.6	0.0650
L17-CU	Inner Copper 0.5OZ	0.0175
PP	2116 RC58% DK:4.45	0.1300	0.1213
L18-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

0618-layers PCBRegular

Thickness:2.0MM

Finished Outer Copper:1OZ

Inner Copper:1OZ

Inner layer Residual copper ratio:30%

Layer	Material	Thickness (mm)	Thickness after lamination (mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)
PP	2116 RC58% DK:4.45	0.1300	0.1055
L2-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L3-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L4-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L5-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L6-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L7-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L8-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L9-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L10-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L11-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L12-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L13-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L14-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L15-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.0810
L16-CU	Inner Copper 1OZ	0.0350	0.135 (Core with Cu)
CORE	Core DK:4.6	0.0650
L17-CU	Inner Copper 1OZ	0.0350
PP	2116 RC58% DK:4.45	0.1300	0.1055
L18-CU	Outer Base Copper 0.5OZ	0.0175	0.0175 (Plating to 1OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

Friendly Reminder

These tables are based on through-hole stackups. HDI builds that require blind/buried vias, via-in-pad, or sequential lamination follow separate recipes. Submit the Gerber, drill, impedance targets, and layer count so our CAM team can validate manufacturability before production.

All templates assume IPC Class 2/3 copper balances and ±10% finished thickness tolerance. Inner layer residual copper ratio recommendations are included to keep warp/twist under control when routing dense planes or heavy copper pours.

When to Engage the Engineering Team

If you select "Customized Services and Advanced Options" for impedance control or mixed-material builds, our engineers run a stackup simulation, calculate dielectric heights, and confirm with you before locking tooling.

After placing an order we verify that the requested stackup, material availability, and impedance profile meet your requirements. Any deviations are documented and approved with your hardware team before lamination begins.

Need flexible or rigid-flex stackups? Reference the dedicated FPC stackup guide or submit your flex/rigid-flex drawing so we can mirror bend radii, PI thickness, and coverlay details.

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