Field-solver compensation and coupon sampling keep serial links inside 10–25 Gbps budgets.
PCB Manufacturing
High-Reliability PCB Manufacturing Across FR-4, HDI, RF, and Rigid-Flex
From quick-turn prototypes to large-scale production, APTPCB delivers ±5% TDR-validated impedance, HDI microvias down to 0.075 mm, and controlled stackups for 10–25 Gbps systems.
VIPPO, staggered/stacked build-ups, and resin-filled vias support compact SoC and RF modules.
High-Tg, low-loss, aluminum, and ceramic stackups coordinated with reliability and SI targets.
Automotive, medical, and aerospace-compliant process control with traceable MES reporting.
PCB Portfolio
Manufacturing Paths for Every Performance Envelope
Each product path is engineered with dedicated tooling, material strategy, and quality checkpoints to meet signal integrity, thermal, and reliability targets from prototypes to mass deployment.
FR-4 PCB
Performance CoreHigh-Tg and low-loss options with ±5% impedance control for 10–25 Gbps differential pairs.
- 1–32 layers with sequential lamination
- Copper 0.5–6 oz and hybrid stackups
- Ideal for industrial control, telecom, and compute boards
High‑Speed PCB
SI/PIControlled impedance ±5%, backdrill, and hybrid stackups for 10–25 Gbps systems.
- Field‑solver stackup modeling
- Backdrill & microvia for stub control
- Validated with TDR/VNA
HDI PCB
DensityMicrovia ≤0.075 mm, VIPPO, stacked/blind vias, and resin-filled cavities for compact electronics.
- LDI alignment ±12.5 μm across cycles
- 1+n+1 to 3+n+3 build-up options
- Supports 0.3 mm BGA pitch and high IO count
Microwave PCB
High FrequencyPTFE and hybrid stackups with Dk 2.2–3.8, low Df, and precise backdrill for mmWave/RF systems.
- Hybrid bonding with FR-4 cost optimisation
- VNA/TDR verified impedance structures
- Suitable for 5G, radar, and satellite links
Multilayer PCB
Versatile4–64 layer stackups with fine trace/space and robust registration for complex designs.
- Sequential lamination & copper balance
- Trace/space down to 25 μm
- Signal integrity & reliability tuned
Rigid-Flex PCB
IntegrationBookbinder flex sections and adhesiveless PI for wearables, avionics, and compact enclosures.
- Dynamic bend radius engineering
- Stiffeners, shielding, and via-in-pad support
- IPC-6013 Class 3 compliant fabrication
Flex PCB
LightweightAdhesiveless PI, coverlay windows, and stiffeners for dynamic bending applications.
- Bend radius engineering
- IPC‑6013 Class 3 capable
- Stiffener/Shielding options
Backplane PCB
High LayerHigh-layer backplanes with low-loss cores, backdrill, press-fit optimization, and sub-2 ps/in skew.
- Up to 48 layers with sequential lamination
- Backdrill depth tolerance ±0.10 mm
- 112G PAM4-ready channel budgets
Metal Core PCB
ThermalAluminum and copper core MCPCB with 1–8 W/m·K dielectric and copper-filled thermal vias.
- Vacuum lamination and SPC-controlled dielectric thickness
- 100% Hi-Pot test with 3–6 kV AC capability
- Optimised for LED, EV, and power conversion modules
Ceramic PCB
ExtremeDBC / DPC / LTCC on Al2O3 or AlN with 170–190 W/m·K thermal conductivity and RF stability.
- Wire-bondable soft/hard gold finishes
- ±5% impedance with VNA sample validation
- Fit for power modules and aerospace RF platforms
High-Tg PCB
Thermal StabilityTg ≥170°C laminates for lead-free assembly and high-temperature operating environments.
- Tg 170–180°C standard, Tg 200°C+ available
- Low CTE for reliable BGA and fine-pitch assembly
- Ideal for automotive and industrial applications
Heavy Copper PCB
High Current3–20 oz copper for power distribution, high-current paths, and thermal management.
- Thick copper plating with controlled etching
- Hybrid stackups combining heavy and standard copper
- Power electronics and EV charging applications
Antenna PCB
RF/WirelessPrecision antenna patterns on low-loss substrates for WiFi, 5G, GPS, and IoT applications.
- Tight Dk/Df tolerance for consistent RF performance
- Multi-band and phased array designs
- Integrated matching networks and filters
High-Frequency PCB
RF/MicrowaveRogers, Taconic, and Isola laminates for RF, microwave, and millimeter-wave applications.
- Dk 2.2–10.2 with tight tolerance
- Low Df for minimal signal loss
- Hybrid stackups with FR-4 for cost optimization
High-Thermal PCB
Heat DissipationEnhanced thermal management with metal cores, thermal vias, and high-conductivity materials.
- Thermal conductivity 1–8 W/m·K
- Copper coin and embedded heat sink options
- LED, power module, and automotive applications
Engineering Toolkit
Design & Verification Tools for Faster Builds
Validate stackups, inspect Gerbers, and run quick simulations without leaving the manufacturing workflow.
Gerber Viewer
Inspect layer registration, drill hits, and solder mask alignment before releasing builds.
Inspect Gerbers3D PCB Viewer
Review assembly clearances and component standoffs with interactive 3D renders.
Review in 3DImpedance Calculator
Model microstrip and stripline traces with loss estimates to hit ±5% impedance targets.
Calculate ImpedanceCircuit Simulator
Validate functional blocks and what-if scenarios before committing to prototype spins.
Simulate CircuitManufacturing Assurance
Process windows are matched to target stackups, copper distribution, and reliability requirements. Our MES and SPC systems surface trends before they impact production builds.
SPC & MES Traceability
Critical parameters tracked with Cpk ≥1.33. Panel serialization links supplier lots to TDR, AOI, and X-ray records.
Material Governance
Certified supply chain for FR-4, PTFE, AlN, and low-loss laminates with lot-level Tg/Dk/Df tracking.
Impedance Validation
Coupon design, field solver correlation, and TDR/VNA sampling ensure ±5% tolerance across production runs.
Lamination Expertise
Sequential lamination up to 3+n+3, resin control, and copper balancing to mitigate warpage and resin starvation.
Applications & Case Outcomes
Customer programs span automotive ADAS controllers, industrial automation backplanes, telecom switching, and medical imaging modules. Typical results include <20 PPM field returns and 10–15 day ramp-to-mass-production.
Automotive Domain Controllers
12-layer HDI with blind/buried vias, ±5% impedance, PPAP documentation, <15 PPM over 18 months.
Telecom Fabric Backplanes
48-layer backplane with backdrill, Dk 3.5 hybrid stackups, BER <1e-12 at 25 Gbps post-install.
Need engineering review before release-to-build?
Share stackups, Gerbers, and impedance targets. Our CAM and SI teams respond within 24 hours with a manufacturability plan.
Frequently Asked Questions
Answers to the questions we hear most from hardware teams preparing builds.
How fast can prototypes ship?
Standard FR-4 prototypes ship in 3–5 days; 12-hour express lanes are available for qualified stackups and layer counts.
What documentation is needed for a manufacturing quote?
Provide Gerber or ODB++, intended stackup, target impedance (single-ended / differential), material preferences, quantity roadmap, and any IPC or industry qualification needs.
Can you support hybrid stackups with Rogers or low-loss laminates?
Yes. We routinely bond PTFE or low-Df laminates with FR-4 cores. We supply material datasheets, bond prep guidance, and thermal expansion analysis for each proposal.
Do you offer reliability data or case studies?
Case studies and performance data (PPM, yield, lead time) are available under Resources → Case Studies.