DFM/DFA Guidelines
Design for Manufacturing and Assembly best practices to optimize yield and quality.
- •Fabrication limits
- •Assembly rules
- •File submission
- •Quality standards
Resources
Resources & Knowledge Center
Everything linked in the Resources menu—knowledge packs, download centers, tools, and case studies—organized in one place.
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Resource Categories
Find the information you need, organized by topic for quick access to documentation and guides.
Downloads & Templates
Material datasheets, process notes, and stackup PDFs mirrored from the resources menu.
- •Materials library
- •Vendor datasheets
- •Stackup references
Online Tools & Calculators
Inspect files, validate BOMs, calculate impedance, and review designs in-browser.
- •Viewers
- •Calculators
- •BOM tools
PCB Terminology Glossary
A quick reference to common PCB manufacturing and assembly terms and abbreviations.
- •A–Z terms
- •Common abbreviations
- •Manufacturing & assembly
Blog & Engineering Notes
Technical articles, best practices, and practical engineering insights.
- •Design guides
- •Manufacturing notes
- •Assembly tips
Frequently Asked Questions
Quick answers to common questions about files, lead times, testing, and processes.
- •File formats
- •Lead time
- •Testing & QA
DFM/DFA Guidelines
Design for Manufacturing and Assembly guidelines to improve yield, reduce costs, and accelerate production.
PCB Fabrication Guidelines
- Minimum trace width: 3mil (standard), 2mil (advanced)
- Minimum trace spacing: 3mil (standard), 2mil (advanced)
- Minimum drill size: 0.15mm (6mil) mechanical, 0.1mm laser
- Annular ring: ≥4mil for vias, ≥6mil for PTH
- Solder mask dam: ≥4mil between pads
- Silkscreen line width: ≥5mil for readability
- Board edge clearance: ≥10mil for routing
PCB Assembly Guidelines
- Component spacing: ≥0.5mm for rework access
- BGA pitch support: 0.3mm minimum
- Smallest component: 01005 (0402 imperial)
- Fiducial marks: 3 global + local for fine-pitch
- Panel rails: ≥5mm for handling
- Clear polarity markings for diodes, ICs, electrolytics
- Test points: ≥1mm diameter with ≥2mm spacing
File Submission Requirements
- Gerber files: RS-274X format (preferred)
- Drill files: Excellon format with tool list
- Pick-and-place: CSV with X,Y, rotation, side
- BOM: Excel/CSV with MPN, quantity, designators
- Assembly drawing: PDF with notes and polarity
- Stackup specification for multilayer boards
- Impedance requirements (if controlled)
Quality & Compliance
- IPC-A-610 Class 2 (standard) / Class 3 (high-rel)
- J-STD-001 soldering requirements
- RoHS / REACH compliance available
- UL recognition for applicable designs
- ISO 9001:2015 quality management
- IATF 16949 for automotive projects
- Full traceability documentation available
Online Tools & Calculators
FREE
Gerber Viewer
Inspect copper, drills, soldermask, and layers directly in the browser.
- •Layer visibility
- •Drill review
- •Shareable links
FREE
PCB Viewer
Review PCB files in a clean, browser-based viewer for fast collaboration.
- •Fast inspection
- •Layout review
- •Collaboration
FREE
Impedance Calculator
Microstrip, stripline, and differential pair solver tied to the stackup lab.
- •Single-ended
- •Differential
- •Loss estimates
FREE
BOM & Component Tools
Validate BOM metadata, alternates, and AVL notes before sourcing.
- •Interactive BOM
- •Cost notes
- •AVL alignment
FREE
Circuit Simulator
Quick browser-based circuit simulation for early validation and education.
- •Fast iteration
- •Shareable
- •No install
NEW
3D PCB Viewer
Open a 3D preview of your PCB for quick mechanical checks and review.
- •3D preview
- •Fast review
- •Shareable links
PCB Terminology Glossary
Search common PCB manufacturing, assembly, and signal integrity terms.
Showing - of results.
AC Coupling
Method of connecting circuits that blocks DC components while passing AC signals. Uses capacitors to isolate DC bias levels between stages.
Activator
Chemical compound in flux that removes oxides from metal surfaces to promote solder wetting during the soldering process.
Additive Process
PCB fabrication method where copper is selectively deposited onto a bare substrate, as opposed to subtractive etching.
Adhesion
Bond strength between copper and laminate substrate or between different PCB layers. Critical for reliability.
Analog Circuit
Circuit processing continuous signals, as opposed to digital circuits. Requires careful layout for noise immunity.
Annular Ring
Copper area remaining around a drilled hole after fabrication. Measured from hole edge to pad edge. Minimum typically 4-6 mil.
Anodizing
Electrochemical process creating protective oxide layer on aluminum for heat sinks and chassis components.
AOI
AOIAutomated Optical Inspection. Machine vision system inspecting PCB assemblies for placement, polarity, solder quality, and missing parts.
Aperture
Opening in solder paste stencil through which paste is deposited onto PCB pads. Size and shape critical for print quality.
Array
Multiple PCBs arranged in a panel format for efficient manufacturing. Also called panelization or step-and-repeat.
Artwork
Master pattern or digital files (Gerber) defining PCB layers including copper, solder mask, and silkscreen.
Aspect Ratio
Ratio of PCB thickness to drilled hole diameter. Higher ratios (>10:1) require advanced plating processes.
Assembly Drawing
Technical document showing component placement, orientation, polarity markings, and special assembly instructions.
ASSY
ASSYAssembly. Process of mounting and soldering electronic components onto a bare PCB to create a functional circuit board.
ATE
ATEAutomatic Test Equipment. Computerized testing systems for verifying PCB assembly functionality and performance.
Attenuation
Signal loss in a transmission line, measured in dB per unit length. Increases with frequency and trace length.
AVL
AVLApproved Vendor List. Pre-approved component manufacturers and distributors meeting quality requirements.
AWG
AWGAmerican Wire Gauge. Standard for wire diameter measurement. Lower numbers indicate larger diameter.
AXI
AXIAutomated X-Ray Inspection. Non-destructive inspection using X-rays to examine hidden solder joints under BGAs and QFNs.
Azeotrope
Solvent mixture maintaining constant composition during evaporation. Used in some cleaning processes.
Blog & Engineering Notes
Technical articles, best practices, and industry insights from our engineering team.
Game Controller PCB Design: Wireless Connectivity, Low Latency Input, and Battery Optimization
Jan 29, 2026 · Technology
Engineering game controller PCBs for stable 2.4GHz/Bluetooth wireless, low-latency inputs, precise analog sensing, haptics driving, and efficient battery management.
Tablet PCB Design | Ultra-Thin Stackup, Battery Management, Touch & Display Interfaces
Jan 20, 2026 · Technology
Tablet PCB design guide covering ultra-thin 6–8 layer stackups, BMS integration, low-noise touch routing, and MIPI DSI/eDP display interfaces.
RF PCB Assembly Service | Professional Radio Frequency PCBA Solutions
Jan 10, 2026 · Assembly
Comprehensive guide to RF PCB assembly covering precision component placement, specialized soldering processes, moisture sensitivity management, RF testing requirements, and quality systems for wireless, radar, and communication applications.
RF PCB Fabrication | Radio Frequency Circuit Board Manufacturing Process
Jan 10, 2026 · Manufacturing
Comprehensive guide to RF PCB fabrication covering specialized material processing, impedance control techniques, drilling and plating requirements, surface finish selection, and quality validation for radio frequency applications.
RF High Frequency PCB | Radio Frequency Circuit Board Solutions
Jan 09, 2026 · Manufacturing
Professional RF high frequency PCB manufacturing with PTFE substrates, controlled impedance, low-loss materials, and precision fabrication for wireless communications, radar systems, 5G infrastructure, and satellite applications requiring exceptional signal integrity from L-band through Ka-band frequencies.
RF Microwave PCB | Radio Frequency Circuit Board Solutions
Jan 09, 2026 · Manufacturing
Professional RF microwave PCB manufacturing with PTFE and hydrocarbon substrates, precision transmission lines, hybrid constructions, and comprehensive testing for wireless communications, defense radar, satellite systems, and test equipment requiring reliable performance from MHz through millimeter-wave frequencies.
Frequently Asked Questions
Quick answers to common questions about our services and processes.
What file formats do you accept for PCB fabrication?
We accept Gerber files (RS-274X format preferred), ODB++, and Excellon drill files. For assembly, we need pick-and-place files (CSV/XLS), BOM, and assembly drawings (PDF). We also accept native CAD files from Altium, KiCad, Eagle, and OrCAD for conversion if needed.
What is your standard lead time for prototypes?
Standard prototype lead time is 5-7 business days for PCB fabrication and an additional 3-5 days for assembly after component receipt. We offer expedited services with 24-48 hour quick-turn options for urgent requirements.
What is your minimum order quantity?
We have no minimum order quantity. We support everything from single prototype boards to high-volume production runs of millions of units. Our pricing scales based on quantity with volume discounts available.
Do you provide DFM review before production?
Yes, we provide free DFM (Design for Manufacturing) review for all quoted projects. Our engineering team will identify potential issues, suggest improvements, and ensure your design is optimized for reliable production before manufacturing begins.
What testing options are available?
We offer multiple testing options including AOI (Automated Optical Inspection), X-ray inspection for BGA/hidden joints, ICT (In-Circuit Test), Flying Probe, and FCT (Functional Test) using customer-provided test procedures. 100% electrical testing is standard for bare boards.
Can you source components for turnkey assembly?
Yes, we offer full turnkey component sourcing. We procure from authorized distributors, flag lifecycle risks, propose alternates with approval, and manage kitting. We also support partial turnkey (you supply key parts) and consigned assembly (you supply all components).
What certifications do you hold?
We are ISO 9001:2015 certified for quality management, build to IPC-A-610 Class 2/3 and J-STD-001 workmanship standards, and are RoHS/REACH compliant. IATF 16949 certification is available for automotive projects. UL recognition is available for applicable designs.
Need More Information?
Our engineering team is ready to help with your specific questions about PCB design, manufacturing, or assembly requirements.