Automotive
Automotive control unit
01005–press-fit with selective solder, hi-pot, and PPAP reporting.
SelectivePPAPHi-pot
SMT • THT • ICT/FCT
SMT & THT Assembly for Mixed-Technology PCBAs
SMT and THT assembly combines surface-mount placement with through-hole connectors, terminals, relays, transformers or press-fit parts on the same PCBA. APTPCB plans the build sequence, stencil, reflow, selective or wave solder, hand-add exceptions, inspection and ICT/FCT coverage before release, so mixed-technology boards do not fail at the solder or test gate.
- SMT + THT mixed-technology build plan
- 01005 to 100×90 mm component window
- Selective or wave solder release gate
- SPI/AOI/AXI plus ICT/FCT evidence
Get an Instant Quote
Mixed-technology assembly release window
The critical choice is not SMT versus THT; it is which process solders each component without damaging the others.
7
SMT lines
High-speed and flexible lines for paste, placement and reflow before THT insertion.
01005–100×90 mm
Component range
Fine-pitch passives through odd-form parts planned in one traveler.
≤30 min
Changeover target
Offline kitting and feeder banks keep mixed lots moving.
COVERAGE
Coverage from paste print to through-hole release
A mixed SMT/THT build needs process order, solder access, thermal mass review and test coverage defined before material reaches the line.
Stencil and placement DFM
Area-ratio, aperture, polarity, centroid and fiducial checks reduce print and placement escapes.
SMT reflow control
Nitrogen reflow, thermal profiling and 100% SPI/AOI stabilize fine-pitch and bottom-terminated parts.
THT solder method choice
Selective solder, wave solder, press-fit or controlled manual soldering are chosen by pin access, thermal mass and keep-out risk.
Release evidence
AXI where hidden joints justify it, plus ICT/FCT, boundary-scan and cleanliness records tied to the MES traveler.
PLAYBOOK
SMT/THT process decision flow
The release plan decides process sequence before production, not after the first board shows defects.
1
DFM and method choice
Review BOM, XY, polarity, tall parts, solder-side keep-outs and decide SMT, selective, wave, press-fit or hand-solder exceptions.
2
Stencil and SMT setup
Lock stencil design, paste, feeders, placement recipe, reflow profile and first-article inspection.
3
SMT reflow release
Run 3D SPI, AOI and targeted AXI checks before through-hole insertion blocks access.
4
THT insertion and solder
Control insertion, pallet/nozzle access, flux, preheat, solder temperature, dwell time and post-solder inspection.
5
Electrical and shipment release
Run flying probe, ICT, FCT or boundary-scan as required, then ship with inspection and test evidence.
PORTFOLIO
Representative SMT/THT programs
Builds spanning automotive control, medical diagnostics, industrial drives, and compute hardware.
Automotive
Medical
Industrial
Compute
CAPABILITIES
SMT/THT assembly capability and release gates
The useful capability is the controlled route from SMT through THT soldering and test, not a standalone placement number.
SMT release
Lines7 high-speed
Placement01005–100×90 mm
Accuracy±25 µm
Reflow10-zone nitrogen
THT solder release
SelectiveDual nozzle, nitrogen
Wave500 mm width
Press-fitControlled insertion
CleaningIonic ≤1.56 µg/cm²
Inspection and test
SPI/AOI100% 3D
AXIRisk-based 3D
ElectricalFlying probe, ICT/FCT
Boundary-scanIEEE 1149.1/.6
Controlled mixed-technology floor
ESD, humidity, nitrogen and MES travelers control materials from kitting through SMT, THT, test and packing.
QUALITY
Quality controls for mixed SMT/THT builds
Release gates cover paste, reflow, THT soldering, cleanliness and electrical test instead of treating mixed assembly as one generic operation.
SMT-first release
SMT reflow is released before THT insertion when later access to BGAs, QFNs or bottom-terminated components will be limited.
THT solder release
Selective, wave, press-fit or manual soldering is chosen by nozzle access, pin count, thermal mass and nearby SMT risk.
RFQ release package
A clean RFQ shortens planning: BOM, AVL, XY, assembly drawing, test intent and solder/cleaning constraints.
Industries & use cases
Automotive electronics
ECU/inverter boards with selective solder, hi-pot, and PPAP-ready QA.
Medical devices
ISO 13485 builds with cleanliness reports and traceable solder recipes.
Industrial & energy
Rugged controllers with press-fit, conformal coat, and vibration test.
Compute & RF
High-layer, high-power boards with thermal interface prep and RF calibration.
QUALITY & COST
Hold CpK without inflating spend
Shared tooling, SPC, and modular fixtures
Quality
SMT-first release
- GateSPI/AOI/AXI
- EvidenceFirst article + profile
Quality
THT solder release
- GateIPC-A-610 / J-STD-001
- EvidenceAOI/X-ray/ICT/FCT
Cost
DFM cost gate
- InputsGerber/ODB++/XY
- DecisionSelective vs wave
Cost
RFQ release package
- SendBOM + drawings
- AddTest + coating notes
Frequently Asked Questions
Everything you need to know about HDI PCB technology
SMT/THT assembly RFQ
Upload your files to receive a process route, solder method choice and inspection/test coverage plan.
- SMT stencil and reflow review
- Selective/wave/press-fit release choice
- ICT/FCT, AXI and cleanliness scope