Automotive
Automotive control unit
01005–press-fit with selective solder, hi-pot, and PPAP reporting.
SelectivePPAPHi-pot
01005 • SELECTIVE SOLDER • ICT/FCT
SMT & THT Assembly — Changeover-Ready Production
Seven SMT lines, nitrogen reflow, and selective/wave solder cells run side by side with inline SPI/AOI/AXI and ICT/FCT planning so prototypes, pilots, and steady-state lots share the same traveler and guardrails.
- 7 SMT lines / 24×7
- 01005–100×90 mm component window
- Selective + wave solder under nitrogen
- ICT/FCT + flying probe coverage planning
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Placement and solder control for any mix
Tooling, feeders, and SPC keep CpK ≥1.33 even when ECOs land mid-shift.
7
SMT lines
Dedicated expedite + high-speed lanes with mirrored tooling.
01005–100×90 mm
Component range
Vacuum pickup, warpage support, and selective solder for odd-form.
≤30 min
Changeover
Offline kitting + feeder banks keep mix flexible without downtime.
COVERAGE
Coverage from stencil to finished assemblies
We own stencil, placement, reflow, selective solder, inspection, and ICT/FCT so every gate rolls into the next without waiting on another supplier.
Stencil & paste engineering
Area-ratio checks, step/nano coatings, and paste qualification lock print windows.
SMT placement
Seven SMT lines place 01005–100×90 mm with ±25 µm accuracy and CpK ≥1.33.
Selective & wave solder
Nitrogen selective solder, wave with titanium fingers, and custom fixtures protect wetting.
Inspection & test
3D SPI/AOI, sample AXI, ionic reports, flying probe, ICT/FCT, and boundary-scan.
PLAYBOOK
SMT & THT workflow
Clear gates pair engineering data with production execution so every revision ships with proof.
1
DFX & tooling
Review stencils, panels, fixtures, and selective solder pallets.
2
Line setup
Offline kitting, feeder prep, and recipe lock before boards arrive.
3
SMT execution
Dual-lane SMT lines run 100% SPI/AOI with CpK monitoring.
4
Selective & wave
Nitrogen selective/wave solder with thermal profiling and AOI checks.
5
Inspection & ICT/FCT
AXI, ionic, flying probe, ICT/FCT, and boundary-scan log into MES.
PORTFOLIO
Representative SMT/THT programs
Builds spanning automotive control, medical diagnostics, industrial drives, and compute hardware.
Automotive
Medical
Industrial
Compute
CAPABILITIES
Assembly capabilities
Placement, solder, inspection, and test infrastructure sized for complex builds.
SMT
Lines7 high-speed
Placement01005–100×90 mm
Accuracy±25 µm
Reflow10-zone nitrogen
THT & solder
SelectiveDual nozzle, nitrogen
Wave500 mm width
Press-fitControlled insertion
CleaningIonic ≤1.56 µg/cm²
Test & inspection
SPI/AOI100% 3D
AXIRisk-based 3D
ElectricalFlying probe, ICT/FCT
Boundary-scanIEEE 1149.1/.6
Controlled floor
ESD, humidity, and nitrogen-controlled zones with MES travelers guiding material flow.
QUALITY
Quality controls
Inline inspection, solder control, and test coverage keep FPY at 98–99%.
Process SPC
SPI, placement, reflow, and selective solder SPC with CpK alerts.
Inspection discipline
100% SPI/AOI plus sample AXI and post-wave AOI tied to MES.
Electrical coverage
Flying probe, ICT/FCT, and boundary-scan lock in coverage before ramp.
Industries & use cases
Automotive electronics
ECU/inverter boards with selective solder, hi-pot, and PPAP-ready QA.
Medical devices
ISO 13485 builds with cleanliness reports and traceable solder recipes.
Industrial & energy
Rugged controllers with press-fit, conformal coat, and vibration test.
Compute & RF
High-layer, high-power boards with thermal interface prep and RF calibration.
SMT & THT engagement
Upload your files to receive a build, changeover, and coverage plan.
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