Contents

• The Context: What Makes How to Request a PCB Quote (RFQ Checklist) Challenging
• The Core Technologies (What Actually Makes It Work)
• Ecosystem View: Related Boards / Interfaces / Manufacturing Steps
• Comparison: Common Options and What You Gain / Lose
• Reliability & Performance Pillars (Signal / Power / Thermal / Process Control)
• The Future: Where This Is Going (Materials, Integration, Ai/automation)
• Request a Quote / DFM Review for How to Request a PCB Quote (RFQ Checklist) (What to Send)
• Conclusion

Highlights

• Data Completeness: Why sending only Gerber files is rarely enough for a production-ready quote.
• Specification Clarity: How to define materials, stackups, and impedance to avoid "standard spec" assumptions that kill yield.
• Volume Strategy: Balancing prototype speed with mass production cost drivers in your initial request.
• The Checklist: A structured list of technical inputs required to prevent engineering holds.

The Context: What Makes How to Request a PCB Quote (RFQ Checklist) Challenging

The primary challenge in requesting a PCB quote lies in the gap between CAD software defaults and factory floor reality. In design software, a "layer" is a logical concept; in a factory, it is a physical sheet of copper and fiberglass that must be pressed, drilled, and plated. When an RFQ lacks specific details—such as the specific IPC class or dielectric brand—manufacturers like APTPCB (APTPCB PCB Factory) must either make assumptions based on "standard" practices or pause the process to ask for clarification.

Assumptions are dangerous in high-performance electronics. If a manufacturer assumes a standard Tg130 material for a board intended for a high-temperature automotive environment, the board will fail. Conversely, if a designer over-specifies a generic consumer board with aerospace-grade tolerances, the cost may triple unnecessarily. The goal of a solid RFQ checklist is to bridge this gap, explicitly stating what is critical (must-have) and what is flexible (nice-to-have), allowing the PCB fabrication process to proceed smoothly.

The Core Technologies (What Actually Makes It Work)

A successful quote request relies on accurately conveying the technical parameters that drive manufacturing complexity. These are the core elements that must be defined.

1. Data Formats and Integrity

The industry standard has moved beyond simple visual drawings.

• Gerber RS-274X / X2: The most common format. It must include all copper layers, solder mask, silkscreen, and a board outline.
• ODB++ / IPC-2581: Intelligent formats that contain the netlist and stackup data, reducing the risk of misinterpretation.
• NC Drill Files: Excellon files are mandatory. Missing drill files are the #1 cause of quote delays.

2. Stackup and Material Science

The physical build of the board dictates performance. You must specify:

• Layer Count: From 1 to 64 layers.
• Copper Weight: 0.5oz to 20oz (heavy copper).
• Dielectric Material: FR4, Rogers, Polyimide, or Aluminum core.
• Impedance Control: If you have high-speed lines, the stackup must be calculated to match 50Ω or 100Ω targets.

3. Manufacturing Capabilities Snapshot

To request a valid quote, your design must fall within the vendor's capabilities. Below is a reference of standard versus advanced capabilities you might request.

Parameter	Standard Capability	Advanced Capability	Notes
Layer Count	2–10 Layers	12–64 Layers	Higher layers require longer press cycles.
Min Trace/Space	4mil / 4mil	2mil / 2mil	<3mil requires LDI (Laser Direct Imaging).
Min Hole Size	0.2mm (Mechanical)	0.075mm (Laser)	Laser vias are for HDI builds.
Copper Weight	1oz (35µm)	up to 20oz	Heavy copper affects min trace width.
Aspect Ratio	8:1	16:1	Affects plating throw in deep vias.
Surface Finish	HASL, ENIG	Hard Gold, ENEPIG	ENIG is preferred for flat pads (BGA).
Impedance	±10%	±5%	Requires TDR testing verification.

Ecosystem View: Related Boards / Interfaces / Manufacturing Steps

The RFQ does not exist in a vacuum; it triggers a chain of events across the supply chain.

Assembly (PCBA) Integration If you are requesting a turnkey quote (Fab + Assembly), the checklist expands significantly. You must provide a Bill of Materials (BOM) and Centroid (Pick & Place) file. The accuracy of the BOM determines whether component sourcing takes two days or two weeks. A vague capacitor description like "10uF 0603" is insufficient; voltage rating, tolerance, and dielectric type (X7R vs Y5V) are critical for pricing and function.

Testing and Validation The quote request dictates the quality control level. For simple prototypes, a Flying Probe Test is standard. For mass production, you might request a Bed of Nails (ICT) fixture. If your board has high-frequency signals, you must explicitly request impedance control reports. Omitting these requirements in the RFQ often leads to "surprise" costs later when you realize the boards were not tested to your required standard.

Comparison: Common Options and What You Gain / Lose

When compiling your checklist, you will face choices between generic specifications and highly detailed custom requirements.

Generic requests ("Standard FR4, 1.6mm, Green/White") are fast and cheap but risky for complex designs. Detailed requests ("Isola 370HR, Class 3, ENIG, Tented Vias") ensure reliability but may increase lead time.

Reliability & Performance Pillars (Signal / Power / Thermal / Process Control)

A robust RFQ checklist acts as a firewall against reliability failures.

Thermal Management If your board handles high power, your RFQ must specify copper weight clearly. Simply asking for "2oz copper" is ambiguous—do you mean 2oz finished or 2oz base? For metal core PCBs, specifying the thermal conductivity of the dielectric (e.g., 2W/mK vs 1W/mK) is the difference between an LED overheating or running cool.

Signal Integrity For high-speed digital designs, the stackup in the quote is a contract. If you request "Control Impedance," the manufacturer will adjust trace widths to meet the target based on their material stock. You must specify the target impedance (e.g., 90Ω USB, 100Ω PCIe) and the tolerance (usually ±10%). Without this data in the RFQ, the CAM engineers cannot run the necessary simulations.

Acceptance Criteria Define what "pass" means.

• Visual: IPC-A-600 Class 2 or 3.
• Electrical: 100% Netlist test (Open/Short).
• Dimensional: Tolerance on outline (typically ±0.2mm).

The Future: Where This Is Going (Materials, Integration, Ai/automation)

The quoting process is evolving from manual email chains to automated, data-driven platforms.

Request a Quote / DFM Review for How to Request a PCB Quote (RFQ Checklist) (What to Send)

To ensure your project moves from quote to production without delay, use this comprehensive checklist. Sending a complete package allows APTPCB to provide an accurate price and perform a valid DFM review.

The Ultimate RFQ Checklist

1. Design Data: Gerber RS-274X (or X2) / ODB++ files. Ensure all layers are present.
2. Drill Files: Excellon format, with a drill map and tool list.
3. Fabrication Drawing: A PDF specifying dimensions, tolerances, and special notes.
4. Quantity & Lead Time: Specify prototype quantity (e.g., 5-10 pcs) and estimated production volume (e.g., 5k/year).
5. Material Specifications: Type (FR4, Rogers, etc.), Tg (130/150/170), and finished thickness (e.g., 1.6mm).
6. Stackup Requirements: Copper weight (inner/outer) and layer buildup preference.
7. Surface Finish: ENIG, HASL Lead-Free, OSP, or Immersion Silver.
8. Solder Mask & Silkscreen: Colors (e.g., Green/White, Black/White).
9. Testing: Netlist test (100% required), Impedance control (specify nets/layers).
10. Assembly (if applicable): BOM (Excel) with MPNs and Centroid file (XY coordinates).

Typical Lead Times & Moqs

Understanding the relationship between order type and timing helps in planning your project schedule.

Order Type	Typical Lead Time	MOQ	Key Drivers
Prototype	24–72 Hours	1–5 pcs	Speed is prioritized; standard materials used.
Small Batch (NPI)	5–7 Days	50–100 pcs	Balance of speed and process validation (AOI/X-Ray).
Mass Production	10–15 Days	500+ pcs	Optimized for panel utilization and material cost efficiency.

Conclusion

Mastering how to request a pcb quote (rfq checklist) is a critical skill for any hardware engineer or buyer. It transforms the procurement process from a guessing game into a strategic operation. By providing clear, complete data—including accurate Gerbers, defined material specs, and precise acceptance criteria—you eliminate engineering holds and ensure the final product performs exactly as designed.

Whether you are building a rapid prototype or scaling for mass production, the quality of your RFQ determines the quality of your results. Start with a complete checklist, verify your data formats, and partner with a manufacturer like APTPCB that can guide you through the technical nuances of modern PCB fabrication.

Related links

• PCB fabrication process
• component sourcing
• impedance control
• metal core PCBs
• DFM review