prototype pcb lead time checklist is easier to get right when you start from clear ranges, verification methods, and known failure modes. This guide gives practical rules, recommended specs, and troubleshooting steps you can apply immediately.
Key Takeaways
- If you prioritize Speed (24h), choose Standard Materials.
- If you prioritize Signal Integrity (High Frequency), choose Stocked RF Materials.
- If you prioritize Density (HDI), choose Expedited Standard (3–5 days).
- If you prioritize Cost, choose Standard Lead Time.
- Boundary Exception:
- Product goal: prototype vs pilot vs mass production (expected volumes).
- Data package: Gerbers/ODB++, NC drill, IPC-2581 (and how you name versions).
Decision Matrix
| Priority | Best Choice | Why |
|---|---|---|
| Speed (Time-to-Market) | Quick Turn (24h) | Minimizes idle engineering time; gets boards to bench fast. |
| Cost Optimization | Standard (7 Days) | Avoids expedite fees; allows for batching efficiency. |
| Complex Technology (HDI) | Expedited Standard (3–4 Days) | Allows time for sequential lamination while still prioritizing the job. |
| Reliability / Class 3 | Standard (with QC hold) | Ensures time for cross-sectioning and rigorous IPC Class 3 inspection. |
How to Choose: Decision Rules
If you prioritize Speed (24h), choose Standard Materials.
- Rule: Only specify FR4 Tg150/170 and ENIG/HASL.
- Trade-off: You cannot use custom dielectrics or exotic finishes.
If you prioritize Signal Integrity (High Frequency), choose Stocked RF Materials.
- Rule: Confirm the vendor has Rogers/Taconic in stock before ordering.
- Trade-off: If not in stock, lead time jumps to 10+ days regardless of expedite fees.
If you prioritize Density (HDI), choose Expedited Standard (3–5 days).
- Rule: Do not attempt 24-hour turns for blind/buried vias. The physics of sequential lamination and plating requires cure time.
- Trade-off: It will never be as fast as a through-hole board.
If you prioritize Cost, choose Standard Lead Time.
- Rule: Plan your NPI schedule to allow 5–7 days for fab.
- Trade-off: You lose a week of testing time, but save significantly on unit price.
Boundary Exception:
- Hybrid Stackups: If mixing FR4 and Rogers, this is a complex lamination. Treat as "Advanced" lead time (5+ days), never 24 hours.
- Rigid-Flex: Even prototypes require coverlay curing and laser cutting. Minimum 4–7 days.
Capability + Ordering: Prototype PCB Lead Time Checklist
Capability Snapshot
Use this reference to ensure your design fits within standard "Quick Turn" capabilities. Exceeding these often forces the order into "Advanced" production, increasing lead time.
| Parameter | Standard (Quick Turn Friendly) | Advanced (Adds Lead Time) | Notes |
|---|---|---|---|
| Layer Count | 1–8 Layers | 10–40+ Layers | >8 layers requires longer pressing cycles. |
| Min Trace/Space | 4mil / 4mil | 2.5mil / 2.5mil | Tighter traces require slower etching/LDI. |
| Min Drill | 0.2mm (8mil) | 0.1mm (4mil) | Mechanical vs. Laser drilling. |
| Max Board Size | 500mm x 600mm | Larger custom sizes | Fits standard panels. |
| Copper Weight | 1oz / 2oz | >3oz (Heavy Copper) | Heavy copper requires long plating/etching. |
| Surface Finish | HASL, ENIG | ENEPIG, Hard Gold | ENIG is the safest bet for NPI. |
| Solder Mask | Green | Blue, Red, Black, White | Green cures fastest and is most reliable. |
| Silkscreen | White | Black, Yellow | White is standard. |
| Impedance | +/- 10% | +/- 5% | Tighter tolerance requires more QC. |
| Via Tech | Through-hole | Blind/Buried, Filled | Sequential lamination adds days. |
Lead Time & Moq Table
| Order Type | Typical Lead Time | MOQ | Key Drivers |
|---|---|---|---|
| Prototype (Quick Turn) | 24 – 48 Hours | 1 pcs | Speed, Standard Materials, Digital Data. |
| Prototype (Standard) | 5 – 7 Days | 5 pcs | Cost efficiency, Batching. |
| Small Batch (NPI) | 8 – 12 Days | 50 pcs | E-test fixture, Assembly prep. |
| Mass Production | 15 – 20 Days | 500+ pcs | Material procurement, production slotting. |
FAQ (Cost, Lead Time, DFM Files, Materials, Testing)
Q: How much does a 24-hour expedite typically increase the cost? A: Expect a premium of 50% to 100% over the standard price.
- This covers the disruption to the production schedule and dedicated CAM engineering.
- The premium is usually a flat fee or percentage of the lot charge.
Q: Does "Lead Time" include shipping? A: No, lead time refers to "Ex-Works" (manufacturing time only).
- Day 0 is usually the day data is approved (EQ resolved).
- Shipping adds 2–4 days depending on the courier and customs.
Q: Can I get impedance control on a 24-hour quick turn? A: Yes, but you must use the vendor's standard stackup.
- If you specify a custom stackup that requires ordering specific prepreg, the 24-hour target is impossible.
- Always download the vendor's stackup file before routing.
Q: What is the best file format to prevent delays? A: ODB++ or IPC-2581 are superior to Gerbers.
- They contain intelligent data (stackup, netlist, drill definitions) in a single file.
- This reduces the risk of CAM engineers misinterpreting separate Gerber layers.
Q: Do you perform electrical testing on quick turn prototypes? A: Yes, 100% flying probe test is standard.
- It verifies continuity and isolation against the IPC netlist.
- Skipping this to save time is highly risky and not recommended.
Q: What happens if my design fails DFM checks? A: The order goes on "EQ Hold."
- The clock stops until you answer the engineering questions.
- To avoid this, run a DFM check using DFM Guidelines before submission.
Request a Quote / DFM Review for Prototype PCB Lead Time Checklist (What to Send)
To ensure your prototype PCB quoting checklist results in an accurate and fast quote, include the following items in your RFQ package. Missing items are the primary cause of delays.
Design Data:
- Gerber Files (RS-274X) or ODB++ (Preferred).
- NC Drill File (Excellon format) with a text-based drill chart.
- IPC-356 Netlist (Crucial for electrical test verification).
Fabrication Notes (PDF or ReadMe):
- Quantity: (e.g., 5, 10, 50 pieces).
- Lead Time Requirement: (e.g., 24h, 3-day, Standard).
- Material: (e.g., FR4 Tg170, Rogers 4350B).
- Thickness: (e.g., 1.6mm standard).
- Copper Weight: (e.g., 1oz finished).
- Surface Finish: (e.g., ENIG).
- Solder Mask/Silkscreen Color: (e.g., Green/White).
- Impedance Requirements: (List specific traces/layers if applicable).
- Class: (IPC Class 2 or 3).
Assembly Inputs (If requesting Turnkey):
- BOM (Bill of Materials): Excel format with MPN and Designators.
- Centroid (Pick & Place) File: XY coordinates.
Specifications to Define Upfront (Before You Commit)
| Parameter | Recommended value / option | Why it matters | How to verify |
|---|---|---|---|
| Layer count | 4–8 (typical), higher as needed | Drives cost, yield, and routing margin | Stackup + DFM report |
| Min trace/space | 4/4 mil (typical) | Impacts yield and lead time | DRC + fab capability |
| Via strategy | Through vias vs VIPPO vs microvias | Affects assembly reliability | Microsection + IPC criteria |
| Surface finish | ENIG/OSP/HASL | Impacts solderability and flatness | COC + solderability tests |
| Solder mask | Matte green (default) | AOI readability and bridging risk | AOI trial + mask registration |
| Test | Flying probe / ICT / FCT | Coverage vs cost trade-off | Coverage report + fixture plan |
| Acceptance class | IPC Class 2 / 3 | Defines defect limits | Drawing notes + inspection report |
| Lead time | Standard vs expedited | Schedule risk | Quote + capacity confirmation |
Define these inputs early so your DFM review and quote are accurate and repeatable.
- Product goal: prototype vs pilot vs mass production (expected volumes).
- Data package: Gerbers/ODB++, NC drill, IPC-2581 (and how you name versions).
- Stackup: layer count, finished thickness, copper weights, controlled impedance targets (if any).
- Material: base laminate family (FR-4/high-Tg/halogen-free), special needs (low-Dk/low-Df).
- Surface finish: ENIG/OSP/HASL/Immersion Silver (and why).
- Solder mask & legend: color, matte/gloss, AOI readability constraints.
- Minimum feature limits: trace/space, drill, annular ring, via types (microvia/via-in-pad).
- Reliability targets: thermal cycling, vibration, humidity, operating temperature range.
- Test/inspection: E-test/netlist, microsection, X-ray, AOI, IPC class requirements.
- Delivery: lead time, panelization preference, packaging, and shipping constraints.
Use this checklist as the starting point for prototype pcb lead time checklist so the supplier can confirm feasibility and risks up front.
Related resources
Supplier Qualification Checklist
Use this checklist to avoid late surprises in yield, reliability, and lead time.
- Can the supplier meet your minimum trace/space and drill limits with margin (not just “can do once”)?
- Do they provide a DFM report that flags risks with recommended fixes (not only pass/fail)?
- Do they support your required IPC class and provide evidence (COC, test reports)?
- What is their electrical test method (fixture/flying probe) and netlist coverage?
- How do they control critical processes (lamination, plating, etch compensation, solder mask registration)?
- Do they have capability for controlled impedance (coupon strategy, measurement method, tolerance)?
- What are typical defect modes for this product type and how are they prevented (and measured)?
- How is traceability handled (lot control, material tracking, rework logs)?
- Can they support assembly/test needs (panelization, fiducials, tooling holes, test points)?
- What are their turnaround times for engineering questions (EQ) and issue containment?
If prototype pcb lead time checklist is safety-critical or high-volume, require sample-level validation data before full release.
Related resources
Glossary (Key Terms)
| Term | Meaning | Why it matters in practice |
|---|---|---|
| DFM | Design for Manufacturability: layout rules that reduce defects. | Prevents rework, delays, and hidden cost. |
| AOI | Automated Optical Inspection used to find solder/assembly defects. | Improves coverage and catches early escapes. |
| ICT | In-Circuit Test that probes nets to verify opens/shorts/values. | Fast structural test for volume builds. |
| FCT | Functional Circuit Test that powers the board and checks behavior. | Validates real function under load. |
| Flying Probe | Fixtureless electrical test using moving probes on pads. | Good for prototypes and low/medium volume. |
| Netlist | Connectivity definition used to compare design vs manufactured PCB. | Catches opens/shorts before assembly. |
| Stackup | Layer build with cores/prepreg, copper weights, and thickness. | Drives impedance, warpage, and reliability. |
| Impedance | Controlled trace behavior for high-speed/RF signals (e.g., 50Ω). | Avoids reflections and signal integrity failures. |
| ENIG | Electroless Nickel Immersion Gold surface finish. | Balances solderability and flatness; watch nickel thickness. |
| OSP | Organic Solderability Preservative surface finish. | Low cost; sensitive to handling and multiple reflows. |
Conclusion (Next Steps)
Mastering the prototype PCB lead time checklist is about managing variables. By standardizing materials, validating data integrity before submission, and understanding the trade-offs between speed and complexity, you can reliably hit aggressive NPI milestones.
For your next project, prioritize a clean data package and clear communication of specs. If you need immediate support for a time-critical design, review our Quick Turn PCB Services or consult our NPI Small Batch Manufacturing capabilities to ensure your board is built right, fast.