APTPCB production floor overview

Unified Manufacturing

PCB Board Manufacturer & Turnkey Assembly Services

Direct PCB board manufacturer delivering comprehensive PCB fabrication and assembly services for multilayer rigid, any-layer HDI, and rigid-flex boards up to 64 layers. Direct manufacturing with ±5% impedance tolerance, 2 mil trace/space, and IPC Class 3 quality inspection.

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6,000+Projects Delivered
99.2%First-Pass Yield
48–72hExpedite Window
20,000㎡Manufacturing Footprint
IATF 16949 · ISO 9001 · ULCertifications
±5% TDRImpedance Control
01005 to 50 mmComponent Coverage
24 hPrototype Lead
<24 hDFM Feedback
Up to 40LLayer Capability
6,000+Projects Delivered
99.2%First-Pass Yield
48–72hExpedite Window
20,000㎡Manufacturing Footprint
IATF 16949 · ISO 9001 · ULCertifications
±5% TDRImpedance Control
01005 to 50 mmComponent Coverage
24 hPrototype Lead
<24 hDFM Feedback
Up to 40LLayer Capability

Precision Engineering

IPC Class 3 standards compliant. Advanced HDI and rigid-flex capabilities for mission-critical applications.

Rapid Scale-Up

Seamless transition from prototype to mass production. Automated assembly lines ensuring consistent quality.

Global Logistics

Optimized supply chain management. Worldwide shipping with real-time tracking and customs support.

What We Specialize In

Engineered for Complexity.

Full-service electronics manufacturing partner integrating precision PCB manufacturing and assembly across multilayer rigid, any-layer HDI, and rigid-flex prototypes through volume production, backed by automated inline AOI, 100% netlist testing, and IPC Class 3 quality inspection.

PCB Manufacturing

High-Precision PCB Fabrication Manufacturer Capabilities

Premium Materials

We partner with industry-leading material suppliers to ensure signal integrity and reliability.

Advanced PCB Manufacturing
2 mil
Min. Trace/Space
0.15 mm
Min. Drill Size
±5%
Impedance Control
One-Stop Assembly

Seamless Turnkey Integration

PCB Design and Fabrication;Component Sourcing;PCB Assembly and Test

Turnkey Assembly

  • • SMT & Through-Hole
  • • BGA / QFN / Fine Pitch
  • • 0201 Component Placement
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Testing & Quality

  • • AOI & X-Ray Inspection
  • • ICT (In-Circuit Test)
  • • Functional Testing (FCT)
View Quality System →

Box Build

  • • Firmware Loading
  • • Cable & Wire Harness
  • • Conformal Coating
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Component Sourcing

  • • BOM Management
  • • Supplier Coordination
  • • Inventory Control
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NPI & Small Batch

  • • Rapid Prototyping
  • • Design Validation
  • • Quick Turnaround
Explore NPI →
Technical Excellence

Engineering Capabilities

Pushing the boundaries of what's possible with cutting-edge manufacturing processes and materials.

Rigid PCB

  • Up to 64 Layers
  • ±5% Impedance Control
  • Blind & Buried Vias
  • Class 3 Reliability
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Rigid & Flex

  • Up to 64 Layers (Rigid)
  • Up to 12 Layers (Flex)
  • Any-Layer HDI
  • Staggered/Stacked Vias
Details →

Flex PCB

  • Dynamic Flex Stackups
  • Adhesiveless Copper
  • Coverlay Registration ≤35µm
  • Bend Qualification
Details →

HDI PCB

  • 1+N+1 to 5+N+5 HDI
  • 0.10mm Microvias
  • Copper-Filled VIPPO
  • Sequential Lamination
Details →

Metal PCB

  • Aluminum / Copper Core
  • >12 W/m·K Thermal Path
  • Heavy Copper (up to 12oz)
  • Embedded Coin
Details →

Ceramic PCB

  • Alumina & AlN Substrates
  • High Thermal Conductivity
  • RF/Microwave Applications
  • Extreme Reliability
Details →

Ready to Scale?

Join the world's leading innovators who trust APTPCB with their most critical electronics.