KB-6167F sits at the top of Kingboard's conventional FR-4 hierarchy. Built on a multi-functional phenolic-cured resin system reinforced with inorganic fillers, it delivers a typical Tg of 175°C (DSC), decomposition temperature of 349°C, and T-288 exceeding 35 minutes—far surpassing IPC-4101E/126 minimum requirements. When automotive ECUs, enterprise servers, or complex multilayer boards demand a substrate that will not become the reliability bottleneck, KB-6167F is the material of choice.
This material has been qualified by major OEMs across automotive, telecom, and computing sectors. Its combination of excellent thermal endurance, low Z-axis expansion, anti-CAF capability, and standard FR-4 processability makes it one of the most trusted high-Tg laminates available globally.
In This Guide
- Material Technology and Resin System
- Complete Datasheet Specifications
- Thermal Performance Analysis
- Electrical Characteristics
- KB-6067F Prepreg System
- Manufacturing and Processing Guidelines
- Application Domains
- Industry Cross-Reference and Alternatives
- Quality and Certification
KB-6167F Material Technology: Phenolic-Cured Filled Resin for Maximum Thermal Performance
KB-6167F uses a multi-functional phenolic-cured epoxy resin system—fundamentally different from the DICY (dicyandiamide) curing agents used in standard FR-4 like KB-6160. The phenolic cure mechanism produces a more thermally stable cross-linked network that does not release moisture or nitrogen gas at elevated temperatures, which is why KB-6167F can sustain 288°C for over 35 minutes without delamination.
Inorganic fillers are incorporated into the resin to reduce Z-axis thermal expansion, improve dimensional stability during lamination, and control resin flow in complex multilayer constructions. These fillers contribute to the material's lower CTE values while increasing drill bit wear—a trade-off that is well managed with appropriate tooling parameters.
The resin system is also formulated for anti-CAF (Conductive Anodic Filament) resistance. CAF is an electrochemical failure mechanism where conductive copper filaments grow along glass fiber/resin interfaces under voltage bias and humidity stress. KB-6167F demonstrates CAF resistance exceeding 1000 hours at 85°C/85%RH under 50V DC bias, making it suitable for fine-pitch designs in humid environments.
KB-6167F carries UL recognition under file number E123995 and meets the requirements of IPC-4101E, Slash Sheet /126.
KB-6167F Verified Datasheet Specifications from Official Kingboard PDF
The following data is sourced from Kingboard's official product datasheet. Specimen thickness for typical values is 1.6 mm (8×7628 construction).
Thermal Properties
| Test Item | Test Method (IPC-TM-650) | Condition | Specification (IPC-4101E/126) | Typical Value |
|---|---|---|---|---|
| Thermal Stress | 2.4.13.1 | Float 288°C, Unetched | ≥10 sec | ≥240 sec |
| Glass Transition Temp (Tg) | 2.4.25 | E-2/105, DSC | ≥170°C | 175°C |
| Z-axis CTE (Alpha 1, below Tg) | 2.4.24 | TMA | ≤60 ppm/°C | 40 ppm/°C |
| Z-axis CTE (Alpha 2, above Tg) | 2.4.24 | TMA | ≤300 ppm/°C | 230 ppm/°C |
| Z-axis Expansion (50–260°C) | 2.4.24 | TMA | ≤3.0% | 2.6% |
| X/Y CTE | 2.4.24 | 40–125°C | — | 12/15 ppm/°C |
| T-260 | 2.4.24.1 | TMA | ≥30 min | >60 min |
| T-288 | 2.4.24.1 | TMA | ≥15 min | >35 min |
| Td (5% weight loss) | 2.4.24.6 | TGA | >340°C | 349°C |
| Flammability | UL94 | E-24/23 | V-0 | V-0 |
Electrical Properties
| Test Item | Test Method | Condition | Specification | Typical Value |
|---|---|---|---|---|
| Surface Resistivity | 2.5.17.1 | C-96/35/90 | ≥10⁴ MΩ | 2×10⁸ MΩ |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | ≥10⁶ MΩ·cm | 6.5×10⁹ MΩ·cm |
| Dielectric Breakdown | 2.5.6 | D-48/50+D0.5/23 | ≥40 kV | ≥45 kV |
| Dielectric Constant (Dk) @ 1 MHz | 2.5.5.2 | Etched, R/C 50% | ≤5.4 | 4.8 |
| Dielectric Constant (Dk) @ 1 GHz | 2.5.5.2 | Etched, R/C 50% | — | 4.6 |
| Dissipation Factor (Df) @ 1 MHz | 2.5.5.2 | Etched, R/C 50% | ≤0.035 | 0.015 |
| Dissipation Factor (Df) @ 1 GHz | 2.5.5.2 | Etched, R/C 50% | — | 0.016 |
| CTI (Comparative Tracking Index) | IEC 60112 | — | — | >175V |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | ≥60 sec | 129 sec |
Mechanical Properties
| Test Item | Test Method | Condition | Specification | Typical Value |
|---|---|---|---|---|
| Peel Strength (1 oz) | 2.4.8 | 125°C | ≥0.70 N/mm | 1.2 N/mm |
| Peel Strength (1 oz) | 2.4.8 | Float 288°C/10 sec | ≥1.05 N/mm | 1.3 N/mm |
| Peel Strength (1 oz) | 2.4.8 | After Process Solution | ≥0.80 N/mm | 1.1 N/mm |
| Flexural Strength (Length Direction) | 2.4.4 | — | ≥415 N/mm² | 540 N/mm² |
| Flexural Strength (Cross Direction) | 2.4.4 | — | ≥345 N/mm² | 480 N/mm² |
| Moisture Absorption | 2.6.2.1 | D-24/23 | ≤0.5% | 0.09% |
Thermal Performance Analysis: T-260 >60 min and Z-CTE 2.6% Verified
KB-6167F's thermal data reveals significant margins above IPC-4101E/126 minimums. The T-288 typical value of >35 minutes is more than double the ≥15 minute specification requirement—providing enormous headroom for complex assembly processes with multiple reflow passes, selective soldering, and rework operations.
The Z-axis expansion of 2.6% measured from 50°C to 260°C deserves attention: this total expansion includes the material passing through its Tg at 175°C, where CTE jumps from Alpha 1 (40 ppm/°C) to Alpha 2 (230 ppm/°C). On a 1.6 mm board, 2.6% translates to approximately 42 µm of total Z-axis movement during reflow—a critical parameter for calculating via barrel stress.
For comparison with mid-Tg alternatives: KB-6165 (unfilled, Tg 153°C) shows 3.1% Z-expansion over the same range, meaning KB-6167F reduces via stress by approximately 16%. For a 16-layer board with 2.0 mm total thickness, this translates to 10 µm less Z-axis movement per reflow cycle—cumulative savings that determine whether vias crack at 500 thermal cycles or survive 2,000+.
The X/Y CTE values of 12/15 ppm/°C (40–125°C) match closely with copper foil (17 ppm/°C), minimizing in-plane stress between copper and laminate during thermal cycling. This close match reduces the risk of inner-layer copper cracking and pad cratering in fine-pitch BGA designs.
Electrical Characteristics: Dk 4.6 and Df 0.016 at 1 GHz
KB-6167F's dielectric properties are consistent with standard high-performance FR-4. The Dk of 4.6 at 1 GHz and Df of 0.016 at 1 GHz are adequate for controlled impedance designs operating below approximately 3 GHz. For practical impedance calculation, the actual Dk depends on the resin content of the specific glass style used:
For signal integrity sensitive designs operating above 5 GHz—such as PCIe Gen 5 (16 GT/s per lane) or 10G Ethernet—the Df of 0.016 introduces measurable insertion loss. In such cases, consider a hybrid stackup using KB-6167GLD (Df ~0.006 at 1 GHz) or KB-6167GMD (Df ~0.010 at 1 GHz) prepreg on high-speed signal layers while retaining KB-6167F cores for power and ground planes. This hybrid approach captures the thermal reliability of KB-6167F with enhanced electrical performance where it matters most.
The extremely low moisture absorption of 0.09% (typical, vs 0.5% specification) means Dk and Df remain stable across varying humidity conditions—important for outdoor telecom equipment and automotive applications where environmental sealing may be imperfect.
KB-6067F Prepreg System: Complete Dk/Df Data by Glass Style
KB-6167F laminate pairs with KB-6067F prepreg for multilayer construction. The prepreg Dk and Df values at 1 GHz vary by glass style and resin content:
| Glass Style | Resin Content (%) | Dk @ 1 GHz (±0.2) | Df @ 1 GHz (±10%) | Pressed Thickness (mil) |
|---|---|---|---|---|
| 1080 | 62±2 | 4.3 | 0.016 | 2.8±0.30 |
| 1080 | 65±2 | 4.2 | 0.017 | 3.1±0.40 |
| 1080 | 68±2 | 4.2 | 0.017 | 3.4±0.40 |
| 2116 | 53±2 | 4.5 | 0.016 | 4.7±0.40 |
| 2116 | 55±2 | 4.5 | 0.016 | 5.0±0.40 |
| 2116 | 58±2 | 4.4 | 0.016 | 5.4±0.50 |
| 3313 | 52±2 | 4.5 | 0.015 | 3.5±0.30 |
| 3313 | 55±2 | 4.4 | 0.015 | 3.8±0.30 |
| 7628 | 43±2 | 4.7 | 0.015 | 7.3±0.40 |
| 7628 | 45±2 | 4.6 | 0.015 | 7.7±0.50 |
| 7628 | 48±2 | 4.6 | 0.016 | 8.3±0.50 |
For impedance simulation, use the specific Dk value corresponding to your chosen glass style and resin content—not the laminate Dk of 4.6 which represents a specific 8×7628 construction. Our stackup design service uses these prepreg-specific values for accurate impedance modeling.
Prepreg storage requires max 50%RH and max 23°C for 90-day shelf life, or refrigeration at max 5°C for 180-day shelf life. Material must return to room temperature for at least 4 hours before use.
Manufacturing Process Requirements and High-Tg Lamination Parameters
Kingboard's recommended lamination process for KB-6067F prepreg:
- Heat-up rate: 1.5–2.5°C/min from 80°C to 140°C
- Curing temperature: >190°C (note: higher than mid-Tg materials which cure at >180°C)
- Curing time: >60 minutes at cure temperature
- Curing pressure: 350±50 PSI (vacuum hydraulic press)
The elevated cure temperature of >190°C (vs >180°C for KB-6165F) reflects the higher Tg resin system requiring more energy for complete cross-linking. Incomplete cure reduces Tg, Td, and thermal endurance values—making proper lamination profile critical for achieving datasheet performance.
At APTPCB, our lamination processes follow Kingboard's guidelines with additional SPC monitoring. Temperature uniformity across the press platen is verified to ±3°C to ensure consistent cure across the full panel area.
Drilling: The inorganic filler system increases drill bit wear by approximately 15–20% compared to unfilled FR-4 like KB-6165. For standard mechanical drilling, carbide bits with appropriate entry and backup materials maintain hole quality. For microvias, laser drilling is unaffected by fillers and produces cleaner via barrels.
Copper Foil: KB-6167F is available with both HTE (standard electrodeposited) and RTF (reverse-treated foil) copper in weights from 1/3 oz to 6 oz. For high-frequency applications, specify RTF or VLP foil to minimize conductor loss.
Panel Sizes: Standard sizes include 37"×49", 41"×49", 43"×49", 74"×49", 82"×49", and 86"×49". Core thickness range is 0.05–3.20 mm.
Target Applications: Server, Automotive, Telecom, and Aerospace PCBs
Kingboard specifies KB-6167F for servers, instruments, consumer electronics, and automotive electronics. In practice, the material is used across a wider range of demanding applications:
Automotive Electronics: Engine control units (ECUs), battery management systems (BMS) for EVs, powertrain controllers, and ADAS processing boards. These applications demand -40°C to +125°C operating range with 1,000+ thermal shock cycles per AEC-Q100 and similar qualification standards. KB-6167F's combination of Tg 175°C, T-288 >35 min, and Z-CTE 2.6% provides comfortable margin. APTPCB's automotive PCB manufacturing supports PPAP documentation and full material traceability.
Enterprise Server and Data Center: Motherboards, RAID controllers, and switch fabric boards with 12–20+ layers and 10+ year service life expectations. The low moisture absorption (0.09%) ensures Dk stability in data center environments with varying humidity. Our multilayer fabrication handles KB-6167F in builds up to 30+ layers.
Telecommunications Infrastructure: Base station controllers, optical transport modules, and carrier-grade switches deployed in outdoor cabinets experiencing wide temperature swings. Our telecom PCB capabilities include controlled impedance and backdrilling on KB-6167F.
Industrial Controls: PLCs, motor drives, and power conversion equipment in factory environments with ambient temperatures reaching 60–85°C. The 540 N/mm² flexural strength prevents warpage under heavy component loads.
High Layer Count Designs: For boards exceeding 12 layers, KB-6167F's high Tg ensures that sequential lamination temperatures remain well within the material's thermal ceiling. The innerlayer registration accuracy benefits from the filled resin system's dimensional stability through multiple press cycles.
Industry Cross-Reference: KB-6167F vs Isola 370HR, Shengyi S1000-2, and ITEQ IT-180A
| Parameter | KB-6167F | Shengyi S1000-2 | Isola 370HR | ITEQ IT-180A | TUC TU-768 |
|---|---|---|---|---|---|
| Tg (DSC) | 175°C | 175°C | 180°C | 175°C | 175°C |
| Td (TGA) | 349°C | 345°C | 340°C | 350°C | 345°C |
| Dk @ 1 GHz | 4.6 | 4.4 | 4.4 | 4.4 | 4.5 |
| Df @ 1 GHz | 0.016 | 0.015 | 0.016 | 0.015 | 0.014 |
| Z-CTE (50–260°C) | 2.6% | 2.8% | 2.7% | 2.8% | 2.5% |
| T-288 (min) | >35 | >15 | 15 | >15 | >30 |
| IPC Slash Sheet | /126 | /126 | /121/130 | /126 | /126 |
KB-6167F's competitive advantage lies in pricing: as the world's largest CCL manufacturer, Kingboard offers KB-6167F at lower cost than equivalent materials from smaller suppliers. The Dk of 4.6 is slightly higher than some competitors—when using KB-6167F in impedance-controlled designs, ensure your simulation uses the correct material-specific Dk, not a generic FR-4 value.
Cross-qualification between these materials is common when the Dk difference is accounted for in impedance calculations. APTPCB processes all major laminate brands on our fabrication lines with material-specific press profiles.
Within Kingboard: When to Choose KB-6167F vs Alternatives
| Scenario | Recommended Material | Why |
|---|---|---|
| Standard multilayer, ≤8 layers, room temp | KB-6165 | Lower cost, adequate Tg 153°C |
| Lead-free only, no thermal stress | KB-6164 | Lower cost, adequate lead-free performance |
| Automotive / harsh environment | KB-6167F | Highest FR-4 thermal reliability |
| Signal speed >5 Gbps + high Tg | KB-6167GMD or KB-6167GLD | Lower Df for signal integrity |
| Extreme thermal cycling, aerospace | KB-6168LE | Even lower Z-CTE |
| Operating temp >150°C continuous | PI-515G or PI-520G | Polyimide required |
Quality Certification, IPC Compliance, and How to Order from APTPCB
KB-6167F is produced under Kingboard's ISO 9001, ISO 14001, and IATF 16949 certified quality systems. UL recognition under E123995 covers the full range of thicknesses and copper weights. REACH compliance reports are maintained by Kingboard with regular updates.
At APTPCB, our quality management system adds incoming material verification, first-article microsection analysis, in-process impedance testing, and outgoing electrical test (flying probe or fixture) on every production order. For automotive projects, we provide PPAP Level 3 documentation including material certificates, process capability studies, and reliability test data.
Submit your design files with stackup requirements for a free DFM review including material verification and impedance simulation. For one-stop PCB fabrication and assembly, we quote both services with optimized lead times—typically within 24 hours.